JPH02886Y2 - - Google Patents

Info

Publication number

JPH02886Y2

JPH02886Y2 JP1980157700U JP15770080U JPH02886Y2 JP H02886 Y2 JPH02886 Y2 JP H02886Y2 JP 1980157700 U JP1980157700 U JP 1980157700U JP 15770080 U JP15770080 U JP 15770080U JP H02886 Y2 JPH02886 Y2 JP H02886Y2

Authority

JP

Japan

Prior art keywords

coil

substrate

molded

rod

terminal

Prior art date

1980-11-04

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Expired

Links

• Espacenet
• Global Dossier
• Discuss

• 239000000758 substrate Substances 0.000 claims description 11
• 238000004804 winding Methods 0.000 claims description 8
• WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 4
• 229910000679 solder Inorganic materials 0.000 description 4
• 239000011347 resin Substances 0.000 description 3
• 229920005989 resin Polymers 0.000 description 3
• 238000005476 soldering Methods 0.000 description 3
• 230000000149 penetrating effect Effects 0.000 description 2
• 238000007796 conventional method Methods 0.000 description 1
• 238000007598 dipping method Methods 0.000 description 1
• 239000011810 insulating material Substances 0.000 description 1
• 239000002184 metal Substances 0.000 description 1
• 239000010445 mica Substances 0.000 description 1
• 229910052618 mica group Inorganic materials 0.000 description 1