JPH0287562U

JPH0287562U -

Info

Publication number: JPH0287562U
Application number: JP16656288U
Authority: JP
Priority date: 1988-12-23
Filing date: 1988-12-23
Publication date: 1990-07-11

Description

[Brief explanation of drawings]

第１図ないし第３図は本考案の実施例を示す図
で、第１図は本考案のクリームはんだ塗布装置の
全体を示す正面図、第２図は第１図を矢印Ａから
見た側面図、第３図は第２図のノズル近傍を矢印
Ｂから見た拡大図、第４図はこの種のはんだ付け
の対象であるＦＩＣの全体を示す図で、ａは平面
図、ｂは正面図、第５図は第４図ｂの一点鎖線の
円Ｃで示した部分のリード先端部分と基板上のパ
ターンとの関係位置を示す拡大図、第６図および
第７図ははんだ付け工程を示す図で、第６図は前
記第５図に示す基板のパターン上にクリームはん
だを適正量、適正位置に塗布した状態を示す図、
第７図は第６図の状態から基板上へＦＩＣを搭載
して加熱しはんだ付けした状態を示す図、第８図
と第９図とは従来例を示す図面で、第８図はシリ
ンジ、ノズル、ならい機構を示した断面図、第９
図は第８図のノズル近傍をＤ―Ｄから見た一部断
面図である。２：クリームはんだ塗布装置、４：シリンジ、
６：ノズル、６ａ：吐出口、８：ヒータ、１０：
基板、１４，２４：プーリ、１７：ブラケツト、
１８：ローラ、１９：ならい機構、２０：取付台
、２８：検出器、２９：旋回機構、３０：ヘツド
、４０：スライド、４２：送り機構、４９：圧縮
空気、５０：平板状のＩＣ（ＦＩＣ）、５４：パ
ターン、５６：クリームはんだ、６２：接触子。 Figures 1 to 3 are diagrams showing an embodiment of the present invention. Figure 1 is a front view showing the entire cream solder applicator of the present invention, and Figure 2 is a side view of Figure 1 viewed from arrow A. Figure 3 is an enlarged view of the vicinity of the nozzle in Figure 2 seen from arrow B, Figure 4 is a diagram showing the entire FIC that is the target of this type of soldering, where a is a plan view and b is a front view. 5 is an enlarged view showing the relationship between the lead tip portion of the part indicated by the dot-dash line circle C in FIG. 4b and the pattern on the board, and FIGS. 6 and 7 are the soldering process. 6 is a diagram showing a state in which cream solder is applied in an appropriate amount and at an appropriate position on the pattern of the board shown in FIG. 5,
Fig. 7 shows a state in which the FIC is mounted on the board from the state shown in Fig. 6, heated and soldered; Fig. 8 and Fig. 9 are drawings showing conventional examples; Fig. 8 shows a syringe, Cross-sectional view showing the nozzle and tracing mechanism, No. 9
The figure is a partial cross-sectional view of the vicinity of the nozzle in FIG. 8, taken along line DD. 2: Cream solder applicator, 4: Syringe,
6: Nozzle, 6a: Discharge port, 8: Heater, 10:
Board, 14, 24: pulley, 17: bracket,
18: Roller, 19: Tracing mechanism, 20: Mounting base, 28: Detector, 29: Rotating mechanism, 30: Head, 40: Slide, 42: Feeding mechanism, 49: Compressed air, 50: Flat IC (FIC) ), 54: pattern, 56: cream solder, 62: contact.

Claims

[Scope of utility model registration request]

It is a cream solder applicator for machines that solder electronic components onto circuit boards, and it consists of a cylindrical container containing cream solder and a syringe with a cream solder coating nozzle attached to its lower tip. A tracing mechanism that is heated by a heater and that is provided near the nozzle and comes into contact with the substrate to maintain a desired distance between the discharge port of the nozzle and the substrate, and a turning mechanism about a vertical axis. In a cream solder applicator equipped with a head and a feeding mechanism that mounts the head and moves it vertically, the tracing mechanism provided near the nozzle is rotatably supported by a bracket around a horizontal axis. A cream solder applicator comprising a roller whose lower end comes into contact with the substrate.