JP2513413B2 - Flux applicator - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flux coating device for coating a solder surface of a printed circuit board with flux.

[0002]

2. Description of the Related Art As is well known, after electronic components are mounted on a printed circuit board, the components are fixed and the terminals are connected by soldering. Flux is applied during this soldering. The flux contains an active material as a component, and when connecting the molten solder and terminals such as electronic parts, the oxide film and dirt on the surfaces of the printed circuit board and terminals are removed. This flux is atomized by the spray nozzle of the flux applicator at high speed,
And it is applied uniformly.

FIG. 3 is a schematic perspective view of a conventional flux coating device, FIG. 3 (b) is a front view of a main portion, and FIG. 4 is a schematic perspective view of a conveyance portion of a printed circuit board. In these figures, 2 is a printed circuit board on which electronic components 3 and the like are mounted, 6 is a spray nozzle that atomizes the flux 7 onto the lower surface of the printed circuit board 3, and 30 is a transfer of the printed circuit board 2 described later. A base stand having a slide groove 31 extending perpendicularly to the direction A in the horizontal direction, and 32 a flux application controller.

Reference numeral 35 denotes a carrier for carrying the printed circuit board 2, and a bearing 36 is provided on a side surface thereof. The bearing 36 is mounted on a rail (not shown) and the carrier 35 is mounted on the rail. It is freely movable. 37 is an endless transport chain, bearing 36
The chain 37 is provided with a transport hook claw 38 that engages with the chain 37.
The carrier 35 is transported in the direction of arrow A through the transport hook claws 38 by traveling. Reference numeral 39 is a holding claw that holds the printed circuit board 2 horizontally on the carrier 35.

With this configuration, the printed circuit board 2 is conveyed in the direction A by the carrier 35, and when the tip of the printed circuit board 2 is located above the spray nozzle 6, the spray nozzle 6 is not shown. The drive source reciprocates in the D direction along the slide groove 31, and at the same time atomized flux 7 is sprayed from the spray nozzle 6 onto the lower surface of the printed circuit board 2, and the flux 7 is applied to the entire lower surface of the printed circuit board 2. To be done.

[0006]

However, in the above-mentioned conventional flux coating apparatus, the spray nozzle 6 is used.
The slide speed of is fixed to a constant speed so as to be the same as the conveying speed of the printed circuit board 2. Therefore, even if only the conveying speed of the printed circuit board is increased for the purpose of improving the production capacity, the sliding speed of the spray nozzle 6 is constant, so that the sliding speed of the spray nozzle 6 corresponds to the conveying speed. Therefore, there is a problem in that the flux coating state on the coating surface of the printed circuit board causes uneven coating, and stable soldering quality after soldering cannot be obtained. Further, since the reciprocating movement of the spray nozzle 6 is performed by a linear slide, there is a limit in increasing the speed corresponding to the conveying speed of the printed circuit board 2, and as a result, it is an obstacle to the improvement of the production capacity. It was

Therefore, the present invention has been made in view of the above-mentioned conventional drawbacks, and an object of the present invention is to shorten the processing time for flux application and
It is an object of the present invention to provide a flux coating device in which uneven coating of flux does not occur.

[0008]

To achieve this object, a flux coating apparatus according to the present invention uses a spray nozzle that atomizes flux while carrying a printed circuit board on which electronic components are mounted. A flux applying device for applying flux to a soldering surface of a board, comprising means for swinging the spray nozzle in a direction orthogonal to a conveyance direction of the printed board. Also,
A means for varying the swinging speed is provided.

[0009]

According to the present invention, since the flux is applied by swinging the spray nozzle, the flux can be applied at high speed. Further, since the means for varying the swinging speed is provided, the swinging speed can be changed according to the conveyance speed of the printed circuit board.

[0010]

An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a schematic perspective view of a flux coating apparatus of the present invention, FIG. 2 is an enlarged view of a drive unit that similarly swings a spray nozzle, (a) is a side view, and (b) is a plan view. In these drawings, the same components as those of the conventional technique are designated by the same reference numerals and detailed description thereof is omitted, and the conveying means of the printed circuit board is also the same as that of the conventional technique, and therefore is not shown. In these figures, 5 is a base, 8 is a speed controller, and a motor 11 and the like, which will be described later, are housed therein.

Reference numeral 10 generally indicates a swinging mechanism for swinging the spray nozzle 6, and a motor 1 as a drive source.
1, the motor 11 can change the rotation speed. 12 is a motor shaft 11 of the motor 11.
The centrifugal cam fixed to a has a plurality of screw holes 12a to 12c at positions deviated from a point D which is the center of rotation. Reference numeral 15 is a connecting lever, which has a plurality of mounting holes 15a on one end side.
.About.15c are bored, and one of these mounting holes is selected (15a in this embodiment) and the screw 14 is inserted and screwed into the screw hole 12a. Is attached to.

Reference numeral 17 denotes a drive rod, one end of which is connected to the other end of the connecting lever 15 by a pin 16 and the other end of which is a tack 1.
8 is connected to a drive lever 19 which is vertically erected. A shaft 2 rotatably supported by a bearing 22 attached to the base 5 is provided above the drive lever 19.
1 is fixed, and the drive lever 19 and the shaft 21 are integrated. The tip portion 23 of the shaft 21 exposed from the base 5 is formed with a threaded portion.
A through hole (not shown) formed in the spray nozzle 6 is inserted through the nut 24 and the nut 24 is screwed into the screw portion 23, whereby the spray nozzle 6 is erected and fixed to the shaft 21.

Next, the operation of the flux coating device thus constructed will be described. When the tip of the printed circuit board 2 is located above the spray nozzle 6, a detector (not shown) detects the tip, and the detector sends a start signal to the motor 11 to rotate the motor 11. Due to the rotation of the motor 11, one end of the connecting lever 15 attached at a position deviated from the center G of the centrifugal cam 12 rotates about G. This rotation is converted into a linear motion (horizontal motion) in the D direction by the drive rod 17, and the drive lever 19 rotatably supported by the bearing 22 swings about the bearing 22.
The shaft 21 integrated with this also swings.

As a result, the spray nozzle 6 also swings, that is, swings, in the direction B, that is, in the direction orthogonal to the transport direction A of the printed circuit board 2. At the same time, the spray nozzle 6
The flux 7 is ejected from the base plate 1, the widthwise application of the printed circuit board 2 is performed, and the entire lower surface of the printed circuit board 2 is applied by the conveyance of the printed circuit board 2 in the A direction. In this way, the swing motion of the spray nozzle 6 causes the printed circuit board 2 to move.
Since the flux coating in the width direction is performed, it is possible to increase the flux coating speed in the width direction as compared with the conventional case where the spray nozzle 6 is slid. Therefore, even when the conveyance speed of the printed circuit board 2 is increased for the purpose of shortening the flux application time, the swinging operation of the spray nozzle 6 that is orthogonal to the direction of conveyance of the printed circuit board 2 can be followed, and uneven flux application can occur. Absent.

Here, when the conveying speed of the printed circuit board 2 is increased for the purpose of improving the production capacity, the speed controller 8 is operated to increase the rotation of the motor 11 to swing the spray nozzle 6. The operation can be increased, and the swinging operation of the spray nozzle 6 can be selected according to the conveyance speed of the printed circuit board 2, and high-quality flux coating without coating unevenness can be performed in a shorter time than before. It becomes possible.

The swing angle of the spray nozzle 6 can be changed by changing the mounting position of the connecting lever 15 to the centrifugal cam 12. That is, the screw 14 is attached to the mounting hole 15a at a distance 15b or 15c away from the center G.
And the screw hole 12b or 12c is screwed into the screw hole 12b or 12c to increase the amount of reciprocating movement of the connecting lever 15 in the C direction, thereby increasing the swing angle of the spray nozzle 6.

[0017]

As described above, according to the present invention, since the spray nozzle is swung in the direction orthogonal to the conveying direction of the printed circuit board, the swing speed of the spray nozzle can be reduced. Therefore, the flux coating can be followed even if the conveyance speed of the printed circuit board is increased, the flux coating time can be shortened, and the production efficiency is improved.

Further, since the means for varying the swinging motion is provided, the spray nozzle of the spray nozzle adapted to the conveying speed of the printed circuit board is provided.
A swinging motion can be selected, which allows uniform flux coating without coating unevenness and stable soldering quality.

[Brief description of drawings]

FIG. 1 is a schematic perspective view of a flux coating device according to the present invention.

FIG. 2 is an enlarged view of a swing mechanism that swings a spray nozzle in a flux coating apparatus according to the present invention, (a) is a side view, and (b) is a plan view.

FIG. 3 is a schematic perspective view of a conventional flux coating device.

FIG. 4 is a schematic perspective view of a printed circuit board transport device in the flux coating device.

[Explanation of symbols]

 2 Printed Circuit Board 6 Spray Nozzle 7 Flux 10 Swing Mechanism 11 Motor 12 Centrifugal Cam 15 Connection Lever 17 Drive Rod 19 Drive Lever 21 Shaft

Claims (2)

(57) [Claims] 1. A flux applicator for applying flux to a soldering surface of the printed circuit board by a spray nozzle that atomizes the flux while transporting the printed circuit board on which electronic components are mounted. A flux applying apparatus comprising means for swinging the head in a direction orthogonal to the carrying direction of the flux. 2. The flux coating apparatus according to claim 1, further comprising means for varying the rocking speed of the spray nozzle.