JPH0745999Y2 - Substrate for electronic parts - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial field of use] The present invention relates to a so-called electronic component substrate transfer device for transporting electronic component substrates such as hybrid ICs in an electronic component factory on a production line. .

[Prior Art] Conventionally, in an electronic component production line for producing a substrate for an electronic component such as a hybrid IC in an electronic component manufacturing process,
2. Description of the Related Art An electronic component substrate transfer device that transfers an electronic component substrate onto a rail is used. In such an electronic component production line, for example, first, after printing a thick film on a substrate,
After printing the solder paste and transferring the adhesive resin, the chip parts are mounted and the hybrid IC is manufactured. Further, in such an electronic component production line, when chip components are mounted on both surfaces of the substrate, first, after mounting the chip components on one surface of the substrate, the direction of the main surface of the substrate is reversed,
Subsequently, the chip component is mounted on the other surface. Therefore, a so-called substrate reversing mechanism for changing the direction of the main surface of the substrate, that is, for reversing the substrate is arranged in the middle of the line.

[Problems to be Solved by the Invention] However, the substrate inverted by the substrate inversion mechanism in the conventional electronic component substrate transfer device also inverts the plane direction of the substrate with respect to the traveling direction of the substrate. . For example, when mounting a chip component on a substrate and positioning the substrate with one end face of the substrate as a reference, the end face serving as the reference becomes the reverse of that before the reversal of the substrate. As a result, if the end face that faces forward with respect to the traveling direction of the substrate is used as the reference before the reversal, the end face that has been the reference becomes rearward after the reversal of the main surface of the substrate. This also applies to the case where a mark or a through hole is formed on the main surface of the substrate and printing or mounting of a component is performed based on this mark.

In this way, if the reference end face and other reference positions are reversed before and after reversing the board, thick film printing, cream solder printing, chip component mounting, etc. on each surface of the board It is difficult to perform accurate positioning in the process of
There is a problem that the printing on the board, the mounting accuracy, etc. are reduced.

Therefore, in view of the above-mentioned problems in the prior art, an object of the present invention is to easily align the board when printing on both sides of the board or mounting an electronic component, thereby improving printing and mounting accuracy. An object of the present invention is to provide an electronic component substrate transporting device that can achieve the above.

[Means for Solving the Problem] That is, in order to achieve the above-mentioned object, the means adopted in the present invention is an electronic component substrate transfer device for transferring an electronic component substrate. A substrate main surface reversing mechanism for reversing the direction of its main surface with an axis parallel to an end face serving as a positioning reference of the conveyed electronic component substrate in the middle of the path, and the conveyed electronic component substrate And a board direction reversing mechanism for reversing the direction of the end surface, which is the positioning reference, along the main surface of the board.

[Operation] In the above-described electronic component substrate transporting device, the direction of the main surface of the substrate for electronic component substrate is reversed in the middle of the transport path of the electronic component substrate, with the axis parallel to the end face serving as the positioning reference of the substrate as the reference axis. By providing the board principal surface reversing mechanism and the board direction reversing mechanism that reverses the direction of the end surface that serves as the positioning reference of the transported electronic component substrate along the main surface, the former reversing mechanism When the main surface of the substrate is inverted by, the orientation of the end surface, which is the reference for positioning the substrate in the opposite direction to that, is returned to the original orientation by the latter inversion mechanism. Therefore, the orientation of the end face serving as the reference of the substrate does not change in the subsequent steps, and the alignment can be easily performed.

[Embodiment] An embodiment of the present invention will be described below with reference to the accompanying drawings.

FIG. 1 shows a transfer device for a substrate for electronic parts according to the present invention. In this transfer device, a pair of transfer rails 10, 10 ... Arranged in parallel are not shown, for example, thick film printing. Line, cream solder printing line, adhesive resin transfer line, chip component mounting line, etc.
It is located along the IC production line process. A so-called conveyor belt 11, 11, ... Is provided near the upper ends of the transport rails 10, 10, ... For example, a substrate for a hybrid IC on which various chip components are to be mounted.
12, 12, ... Are carried on these conveyor belts 11, 11 ,.

Then, in the middle of the transfer rails 10, 10 ...
12 ... Chip component 14 on one mounting surface, that is, on the surface,
A so-called substrate main surface reversing mechanism 15 for reversing the hybrid IC substrates 12, 12 ... Is arranged after mounting 14 ... And before proceeding to the step of mounting chip components on the back surface thereof. As shown in the drawing, the substrate main surface reversing mechanism 15 has a vertical rotating portion 16 mounted in the middle of the transfer rails 10, 10 ... And supports the vertical rotating portion 16 so as to be rotatable. The vertical rotation unit 16 is rotated by a reversing actuator 18 via a bearing 17 for the purpose. Further, reference numeral 19 in the drawing is the transportation rail 10,
Width adjusting screws for adjusting the separation distance between 10, ..., 20, 20 ... are board insertion grooves for inserting the hybrid IC boards 12, 12, ... The rotation output shaft of the reversing actuator 18 is shown.

As shown in the attached FIG. 2 (a), the substrate 12 that has been conveyed by being placed on the conveyor belts 11, 11 ... It is pushed out by a pusher or the like not shown and inserted into the substrate insertion grooves 12, 12 of the substrate main surface reversing mechanism 15. Next, the substrate main surface reversing mechanism 15 is rotated by the operation of the reversing actuator 18, as shown in FIG. By this rotation, as shown in FIG. 2 (c), the substrate main surface reversing mechanism 15
Is rotated by 180 ° and stopped, and in this state, the substrate 12 is again pushed out by a pusher or the like not shown in the figure, and the substrate 12 is again conveyed by the conveyor belts 11, 11 of the transfer rails 10, 10.
It is placed on top of ... and transported to the lower side.

Further, according to the present invention, a so-called substrate direction reversing mechanism 22 for reversing the plane direction of the substrate 12, which is a substrate for electronic components to be conveyed, is provided subsequent to the substrate main surface reversing mechanism 15. Has been. As shown by the broken line in the figure, the substrate direction reversing mechanism 22 includes a plane direction rotating portion 23 disposed in the middle of the transfer rails 10, 10 ...
A rotary actuator 24, which is provided on the lower side of the carriage 23, for rotating the rotary actuator 24 and the plane-direction rotating portion 23 are arranged on the plane from the middle of the carrying rails 10, 10, ..., More specifically, in the lateral direction thereof. Slide shafts 25, 25 for moving, and a moving cylinder for driving the slide shaft 25.
It consists of 26 and. Reference numeral 27 in the figure is a variable rail adjusting knob attached to the tip of the width adjusting screw 19 for adjusting the separation distance between the transport rails 10, 10 ... Reference numeral 29 indicates a bearing of the slide shafts 25, 25.

Next, regarding the operation of the substrate direction reversing mechanism 22 described above, refer to the attached FIG. 4 (a), (b) (c) and (d) together with the operation of the substrate main surface reversing mechanism 15 described above. While explaining. First, FIG. 4 (a) shows a state where the substrate 12 is supplied to the substrate main surface reversing mechanism 15 from the transfer rails 10 on the upper side. In this state, the substrate 12 is conveyed with its one main surface (A surface) facing upward. After that, as shown in FIG.
By rotating the substrate principal surface reversing mechanism 15 around an axis parallel to the end surface 121 serving as the reference surface of the substrate 12, the other principal surface (B surface) of the substrate 12 is turned upward (that is, the principal surface is inverted). Then, as shown in FIG. 4 (c), the substrate is then moved to the next substrate direction reversing mechanism 22, for example, by the action of a pusher (not shown).

Here, in the state of FIG. 4 (a), the end surface 121 serving as the reference surface of the substrate 12 is ahead of the traveling direction thereof, but in the state of FIG. 4 (c), the substrate 12 is The end surface 121, which is the reference surface, is inverted at the same time as the main surface is inverted by the action of the substrate main surface inversion mechanism 15, and is directed rearward with respect to the traveling direction.

Next, as shown in FIG. 4 (d), the board 12 is moved by the operation of the board direction reversing mechanism 22 so that the carrying rail 1 is conveyed.
After being taken out to the side of 0 and 10 and rotated in that direction by 180 °, it is returned to the rails 10 and 10. As a result, the end face 121 again faces forward with respect to the traveling direction of the substrate 12, as in the state of FIG. 4 (a). That is, although the main surface of the substrate 12 is inverted, the direction of the end surface 121, which is the reference surface, with respect to the traveling direction does not change.

In the above embodiment, the board 12 is provided with three transfer rails 1
Only the case of using a wide pair of 0, 10 ... (the lower two in the figure) has been described, but depending on the type of substrate, the above-mentioned three transfer rails 10, 10 may be used. It is also possible to carry the sheet by using a pair having a narrow width (two on the upper side in the drawing) among the ... In that case, the transfer rails 10, 10 ...
It is necessary to adjust the distance between the rails, but this rail-to-rail distance adjustment can be done by rotating the fixed rails (upper and lower rails in the figure) at both ends, as shown in Fig. 5 (a). This is performed by rotating the attached width adjusting screw 19 by the variable rail adjusting knob 27 attached to the tip thereof. This places them in the middle,
Moreover, the position of the transfer rail 10 screwed into the width adjusting screw 19 moves to both sides. Also, in the above figures, reference numerals
Reference numerals 30, 30 ... Show the width adjusting shafts provided between the rails at both ends of the transport rails 10, 10 ... And slidably holding the intermediate rails.

In this case, when the substrate direction reversing mechanism 22 is rotated on a plane and then returned to the cutout portions of the transport rails 10, 10, ..., the moving position of the plane direction rotating portion 23 of the substrate direction reversing mechanism 22 is changed. A stopper 31 for accurately setting the transfer rails 10 is provided. This stopper 31
Is screwed into a lock nut 33 fixed to the stopper base 32, and its tip position can be adjusted by rotating itself. Then, as shown in FIG. 5A, the stopper 31 is provided in the plane direction rotating portion before the plane direction rotating portion 23 of the substrate direction reversing mechanism 22 is rotated.
It abuts on one side surface of 23, but after rotating this by 180 ° in the direction of the parallel surface, as shown in FIG. 5 (b),
It is possible to pass through a hole 34 formed in the other side surface of the plane direction rotating portion 23, contact the side surface of the central rail, and accurately dispose with respect to the transport rails 10, 10. There is.

Further, in the above embodiment, the substrate main surface reversing mechanism 15
Has been described as being arranged on the upper side of the substrate direction reversing mechanism 22 in the production line process, but even if the positional relationship between the substrate main surface reversing mechanism 15 and the substrate direction reversing mechanism 22 is changed, The same effect as the example is obtained.

[Effects of the Invention] As is clear from the above description, according to the electronic component substrate transporting device of the present invention, when printing or mounting electronic components on both sides of the substrate, the main surface of the substrate is reversed. Even if this is done, the orientation on the plane that serves as the position reference when printing or mounting chip components does not change, and for example, it is possible to always use one end face of the substrate as the reference surface. Will be easier. This makes it possible to improve printing and mounting accuracy on the substrate.

[Brief description of drawings]

FIG. 1 is a perspective view showing a structure of a substrate main surface reversing mechanism of an electronic component substrate transfer apparatus according to the present invention, FIG. 2 (a),
(B) and (c) are operation explanatory views of the substrate main surface reversing mechanism, FIG. 3 is a perspective view showing a structure of a substrate direction reversing mechanism of the electronic component substrate transfer device, and FIG. 4 (a). ,
(B), (c) and (d) are operation explanatory views for explaining the operation of the board direction reversing mechanism together with the operation of the board principal surface reversing mechanism, and FIG. It is a figure explaining the structure and operation | movement of a part. 10 …… rail, 11 …… conveyor belt, 12 …… substrate, 14
...... Chip parts, 15 …… Board main surface reversing mechanism, 16 …… Vertical rotating part, 17 …… Bearing, 18 …… Reversing actuator, 19 …… Width adjusting screw, 20 …… Board insertion groove, 21 ...... Rotary output shaft, 22 …… Board direction reversing mechanism, 23 …… Plane direction rotating part, 24 …… Rotary actuator 25 …… Slide shaft, 26 …… Movement cylinder, 27 …… Variable rail adjustment knob, 28 …… … Linear bearings, 29 …… Bearings

Claims (1)

[Scope of utility model registration request] 1. A transport device for a substrate for electronic parts for transporting a substrate for electronic parts, which is parallel to an end face serving as a positioning reference of the substrate for electronic parts to be transported, in the middle of a transport path of the substrate to be transported. A substrate main surface reversing mechanism that reverses the direction of the main surface with the axis as a reference axis; and a substrate direction reversing mechanism that reverses the direction of the end surface that serves as a positioning reference for the transported electronic component substrate along the main surface. A substrate transfer device for electronic parts, which is provided in front of and behind.