JPH0361400U - - Google Patents
Info
- Publication number
- JPH0361400U JPH0361400U JP12325989U JP12325989U JPH0361400U JP H0361400 U JPH0361400 U JP H0361400U JP 12325989 U JP12325989 U JP 12325989U JP 12325989 U JP12325989 U JP 12325989U JP H0361400 U JPH0361400 U JP H0361400U
- Authority
- JP
- Japan
- Prior art keywords
- board
- electronic component
- main surface
- reversing mechanism
- reversing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims description 8
- 230000032258 transport Effects 0.000 claims 2
- 238000010586 diagram Methods 0.000 description 2
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
Landscapes
- Feeding Of Articles By Means Other Than Belts Or Rollers (AREA)
- Registering Or Overturning Sheets (AREA)
- Specific Conveyance Elements (AREA)
- Attitude Control For Articles On Conveyors (AREA)
Description
第1図は、本考案による電子部品用基板の搬送
装置の基板主面反転機構の構造を示す斜視図、第
2図a,b及びcは前記基板主面反転機構の動作
説明図、第3図は、前記電子部品用基板の搬送装
置の基板方向反転機構の構造を示す斜視図、第4
図a,b,c,及びdは前記基板方向反転機構の
動作を前記基板主面反転機構の動作と共に説明す
る動作説明図、第5図は、電子部品用基板の搬送
装置の他の部分の構造及び動作を説明する図であ
る。
10……レール、11……コンベアベルト、1
2……基板、14……チツプ部品、15……基板
主面反転機構、16……垂直方向回転部、17…
…軸受、18……反転用アクチユエータ、19…
…幅調整用ネジ、20……基板挿入溝、21……
回転出力軸、22……基板方向反転機構、23…
…平面方向回転部、24……ロータリアクチユエ
ータ、25……スライド軸、26……移動用シリ
ンダ、27……可変レール調整ツマミ、28……
リニアベアリング、29……軸受。
FIG. 1 is a perspective view showing the structure of the board main surface reversing mechanism of the electronic component board transfer apparatus according to the present invention, FIGS. 2 a, b, and c are operation explanatory views of the board main surface reversing mechanism, and FIG.
Figures a, b, c, and d are operation explanatory diagrams for explaining the operation of the substrate direction reversing mechanism together with the operation of the substrate main surface reversing mechanism, and Fig. 5 is an operation explanatory diagram illustrating the operation of the substrate direction reversing mechanism as well as the operation of the substrate main surface reversing mechanism. It is a figure explaining structure and operation. 10...Rail, 11...Conveyor belt, 1
2... Board, 14... Chip component, 15... Board main surface reversing mechanism, 16... Vertical rotation unit, 17...
...Bearing, 18...Reversing actuator, 19...
... Width adjustment screw, 20 ... Board insertion groove, 21 ...
Rotation output shaft, 22... Substrate direction reversal mechanism, 23...
...Planar direction rotation unit, 24...Rotary actuator, 25...Slide shaft, 26...Movement cylinder, 27...Variable rail adjustment knob, 28...
Linear bearing, 29...Bearing.
Claims (1)
送装置において、前記搬送される基板の搬送経路
の途中に、前記搬送される電子部品用基板の主面
の向きを反転する基板主面反転機構と、前記搬送
される電子部品用基板の向きをその主面に沿つて
反転する基板方向反転機構とを設けたことを特徴
とする電子部品用基板の搬送装置。 In an electronic component board transporting device that transports an electronic component board, a board main surface reversing mechanism for reversing the direction of the main surface of the electronic component board to be transported is provided in the middle of the transport path of the board to be transported. 1. A device for transporting electronic component substrates, comprising: a substrate direction reversing mechanism for reversing the direction of the electronic component substrate being transported along its main surface.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989123259U JPH0745999Y2 (en) | 1989-10-21 | 1989-10-21 | Substrate for electronic parts |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989123259U JPH0745999Y2 (en) | 1989-10-21 | 1989-10-21 | Substrate for electronic parts |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0361400U true JPH0361400U (en) | 1991-06-17 |
JPH0745999Y2 JPH0745999Y2 (en) | 1995-10-18 |
Family
ID=31671246
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1989123259U Expired - Lifetime JPH0745999Y2 (en) | 1989-10-21 | 1989-10-21 | Substrate for electronic parts |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0745999Y2 (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003501842A (en) * | 1999-06-10 | 2003-01-14 | インテル・コーポレーション | Heat sink clip for electronic assembly |
JP2014037308A (en) * | 2012-08-20 | 2014-02-27 | Tokyo Automatic Machinery Works Ltd | Article transportation device |
JP2016113262A (en) * | 2014-12-15 | 2016-06-23 | 平田機工株式会社 | Support member, transfer device, and work system |
JP2016538724A (en) * | 2013-11-14 | 2016-12-08 | イリノイ トゥール ワークス インコーポレイティド | Supply device comprising a substrate reversing machine system and a clamping system, and a method for supplying a viscous material onto a substrate |
JP2018531200A (en) * | 2015-10-30 | 2018-10-25 | コー・ヤング・テクノロジー・インコーポレーテッド | Article transfer apparatus, article inspection apparatus, article transfer method, and article inspection method |
WO2022029550A3 (en) * | 2020-08-07 | 2022-04-28 | G.D S.P.A. | Grouping device and method for grouping discrete rows of articles into a continuous row of articles |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6128667U (en) * | 1984-07-27 | 1986-02-20 | 昭治 永瀬 | 6-sheet cut-out calendar with the next month appearing upside down |
JPS6352932A (en) * | 1986-08-21 | 1988-03-07 | Matsushita Electric Ind Co Ltd | Substrate processing method and device thereof |
-
1989
- 1989-10-21 JP JP1989123259U patent/JPH0745999Y2/en not_active Expired - Lifetime
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6128667U (en) * | 1984-07-27 | 1986-02-20 | 昭治 永瀬 | 6-sheet cut-out calendar with the next month appearing upside down |
JPS6352932A (en) * | 1986-08-21 | 1988-03-07 | Matsushita Electric Ind Co Ltd | Substrate processing method and device thereof |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003501842A (en) * | 1999-06-10 | 2003-01-14 | インテル・コーポレーション | Heat sink clip for electronic assembly |
JP2014037308A (en) * | 2012-08-20 | 2014-02-27 | Tokyo Automatic Machinery Works Ltd | Article transportation device |
JP2016538724A (en) * | 2013-11-14 | 2016-12-08 | イリノイ トゥール ワークス インコーポレイティド | Supply device comprising a substrate reversing machine system and a clamping system, and a method for supplying a viscous material onto a substrate |
JP2016113262A (en) * | 2014-12-15 | 2016-06-23 | 平田機工株式会社 | Support member, transfer device, and work system |
JP2018531200A (en) * | 2015-10-30 | 2018-10-25 | コー・ヤング・テクノロジー・インコーポレーテッド | Article transfer apparatus, article inspection apparatus, article transfer method, and article inspection method |
JP2019147693A (en) * | 2015-10-30 | 2019-09-05 | コー・ヤング・テクノロジー・インコーポレーテッド | Article transfer device, article inspection device, article transfer method and article inspection method |
WO2022029550A3 (en) * | 2020-08-07 | 2022-04-28 | G.D S.P.A. | Grouping device and method for grouping discrete rows of articles into a continuous row of articles |
Also Published As
Publication number | Publication date |
---|---|
JPH0745999Y2 (en) | 1995-10-18 |
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