JPH0282682A - Multiterminal plane packaging part and method of packaging the same - Google Patents

Multiterminal plane packaging part and method of packaging the same

Info

Publication number
JPH0282682A
JPH0282682A JP63233559A JP23355988A JPH0282682A JP H0282682 A JPH0282682 A JP H0282682A JP 63233559 A JP63233559 A JP 63233559A JP 23355988 A JP23355988 A JP 23355988A JP H0282682 A JPH0282682 A JP H0282682A
Authority
JP
Japan
Prior art keywords
leads
mounting
lead
wiring board
printed wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP63233559A
Other languages
Japanese (ja)
Inventor
Norio Yabe
谷邉　範夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP63233559A priority Critical patent/JPH0282682A/en
Publication of JPH0282682A publication Critical patent/JPH0282682A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To package a part by soldering by a reflow method by installing leads to the part so that the distances from the side face thereof to the packaging parts of the leads may vary alternately in zigzag form, bending the centers of the packaging parts upward in bridge form, and packaging the tips and the parts near the bent parts of the leads on a printed circuit board by plane packaging. CONSTITUTION:When an LSI package 11 is packaged on a printed circuit board 14, paste solder is printed on the footprints 15a to 15d of the printed circuit board 14. The LSI package 11 is mounted on the PC board so that the packaging parts 12c, 12e, 13c, and 13e of leads 12 and 13 may correspond to the footprints 15a to 15d on which the paste solder is printed. The leads 12 and 13 of the LSI package 11 are connected to the footprints 15e to 15d of the printed circuit board 14 at the same time by passing through the desired reflow furnace.

Description

【発明の詳細な説明】 概要 平面実装型ＬＳＩパッケージ等の多端子平面実装部品の
リード形状に関し、 半田ブリッジを生ずることなくプリント配線板上にリフ
ロー法により半田付は実装することのできる微細ピッチ
の多端子平面実装部品及びその実装方法を提供すること
を目的とし、 複数のリードが部品の側面から突出し、下方への折り曲
げ部を介して概略水平方向に伸長した実装部を有する多
端子平面実装部品にふいて、ＩＪ−ドの実装部の部品側
面からの距離が交互に千鳥状に変化するように、リード
を部品に取り付けるとともに、該実装部の中央部分を上
方にブリッジ状に折り曲げ、リードの先端部分及び前記
折り曲げ部近傍部分の２個所でプリント配線板に平面実
装するように構成する。[Detailed Description of the Invention] Overview Regarding the lead shape of multi-terminal flat mount parts such as flat mount type LSI packages, we have developed a fine-pitch lead shape that can be soldered onto a printed wiring board by a reflow method without producing solder bridges. The purpose of the present invention is to provide a multi-terminal flat mount component and a mounting method thereof, the multi-terminal flat mount component having a mounting portion in which a plurality of leads protrude from the side of the component and extend approximately horizontally through a downwardly bent portion. Then, attach the leads to the component so that the distance from the side of the component to the mounting part of the IJ-card changes alternately in a staggered manner, and bend the center part of the mounting part upwards into a bridge shape. It is configured to be flat-mounted on the printed wiring board at two locations: the tip portion and the portion near the bent portion.

産業上の利用分野 本発明は多端子平面実装部品及びその実装方法に関し、
特に平面実装型ＬＳＩパッケージ等の多端子平面実装部
品のリード形状に関する。INDUSTRIAL APPLICATION FIELD The present invention relates to a multi-terminal planar mounting component and its mounting method.
In particular, it relates to the lead shape of a multi-terminal flat-mounted component such as a flat-mounted LSI package.

近年、ＬＳＩの集積化等の飛躍的向上に伴い、機器の高
機能化、小型化、軽量化等の要求が益々強くなり、電子
部品は平面実装に適するようにチップ部品化されるとと
もに、ＬＳＩパッケージはリード挿入型に比較し大幅な
小型・薄型化が実現できる平面実装型ＬＳＩパッケージ
が主流となってきている。しかも、機器の高機能化に伴
い接続リード数も増加し、パッケージの小型化・薄型化
とともにリードピッチの微細化が要求されている。In recent years, with the dramatic improvement in the integration of LSIs, there has been an increasing demand for higher functionality, smaller size, and lighter weight devices. Planar mount LSI packages, which are significantly smaller and thinner than lead insertion types, have become mainstream. Moreover, as devices become more sophisticated, the number of connecting leads increases, and there is a demand for smaller and thinner packages as well as finer lead pitches.

一方、平面実装型ＬＳＩパッケージ等の多端子平面実装
部品は、ペースト半田を印刷したプリント配線板に搭載
し、所望のりフロー炉を通すことにより該搭載部品の接
続リードとプリント配線板のフットプリントとは一括半
田付は接続される。このような平面実装型ＬＳＩパッケ
ージ等の実装作業において、パッケージリードのリード
幅、リードピッチの微細化が進むにつれて、リード間で
半田ブリッジ等が生じやすくなり半田付は作業を非常に
困難にしつつある。そこで、リードピッチが微細化して
も半田ブリッジ等を生ずることのない多端子平面実装部
品のリード形状が要望されている。On the other hand, multi-terminal flat-mounted parts such as flat-mounted LSI packages are mounted on a printed wiring board printed with solder paste, and then passed through a desired glue flow furnace to create a connection lead of the mounted part and a footprint of the printed wiring board. The bulk soldering will be connected. In mounting work for flat-mounted LSI packages, etc., as the lead width and lead pitch of package leads become finer, solder bridges are more likely to occur between leads, making soldering work extremely difficult. . Therefore, there is a need for a lead shape for multi-terminal flat mount components that does not cause solder bridges or the like even when the lead pitch becomes finer.

従来の技術 第３図はリードがプリント配線板を貫通するタイプの実
装方法を示す従来例断面図である。ＬＳＩパッケージ１
はその側面に垂直方向に突出するリード２を有しており
、このリード２をプリント配線板３のスルホール４中に
挿入し、半田５で固定することによりＬＳＩパッケージ
１はプリント配線板３に挿入実装される。この挿入実装
方法によると、水平方向のストレスはプリント配線板３
により構造的に補強され、垂直方向のストレスに対して
は半田付は部の面積を確保することで補強している。ま
たこのような挿入実装型では、プリント配線板実装タイ
プのコネクタでよく用いられているように、端子（リー
ド）を千鳥状に配列することにより端子ピッチを狭くす
ることが可能である。BACKGROUND OF THE INVENTION FIG. 3 is a cross-sectional view of a conventional example of a mounting method in which leads pass through a printed wiring board. LSI package 1
has a lead 2 protruding vertically from its side surface, and by inserting this lead 2 into a through hole 4 of a printed wiring board 3 and fixing it with solder 5, the LSI package 1 is inserted into the printed wiring board 3. Implemented. According to this insertion mounting method, the horizontal stress is
It is structurally reinforced, and the vertical stress is reinforced by securing the soldering area. Furthermore, in such an insertion mounting type, it is possible to narrow the terminal pitch by arranging the terminals (leads) in a staggered manner, as is often used in printed wiring board mounting type connectors.

第４図は平面実装タイプの従来例を示しており、（Ａ）
が側面図を（Ｂ）が半田付は部を模式的に示している。Figure 4 shows a conventional example of a flat mount type, (A)
(B) schematically shows the soldering part.

ＬＳＩパッケージ６には複数個のり−ド７が設けられて
おり、各々のリード７は下方への折り曲げ部７ａと水平
方向に伸長した実装部７ｂとを含んでいる。８はプリン
ト配線板であり、リード接続用のフットプリント９が設
けられている。リード７の実装部７ｂとプリント配線板
８のフットプリント９とは半田１０により接続される。The LSI package 6 is provided with a plurality of leads 7, and each lead 7 includes a downwardly bent portion 7a and a mounting portion 7b extending in the horizontal direction. 8 is a printed wiring board, and a footprint 9 for lead connection is provided. The mounting portion 7b of the lead 7 and the footprint 9 of the printed wiring board 8 are connected by solder 10.

このような平面実装型ＬＳＩパッケージ６の実装手順は
、ＬＳＩパッケージ６を所望のフットプリント９にペー
スト半田を印刷したプリント配線板８に搭載し、所望の
りフロー炉を通すことによりＬＳＩパッケージ６のリー
ド７とプリント配線板８上の所望のフットプリント９と
はり一ド７の実装部７ｂにおいて一括半田付は接続され
る。平面実装部品のリードの水平・垂直方向ストレスへ
の対応は、リード７の水平方向に伸長した実装部７ｂを
長く形成し、この実装部７ｂをプリント配線板８のフッ
トプリント９に半田付けにより固定することにより対応
している。このようにリードの実装部７ｂを所望に長く
することで、固定部に加わる垂直方向の力及び水平方向
の力に対向するようにしている。The mounting procedure for such a flat mount type LSI package 6 is to mount the LSI package 6 on a printed wiring board 8 on which paste solder is printed on the desired footprint 9, and to pass the lead of the LSI package 6 through a desired glue flow furnace. 7 and a desired footprint 9 on the printed wiring board 8 are connected by bulk soldering at the mounting portion 7b of the beam 7. In order to cope with horizontal and vertical stress on the leads of planar mounting components, the mounting portion 7b of the lead 7 is formed to be long and extends in the horizontal direction, and this mounting portion 7b is fixed to the footprint 9 of the printed wiring board 8 by soldering. We are responding by doing this. By making the lead mounting portion 7b as long as desired in this manner, it is possible to counter the vertical force and horizontal force applied to the fixing portion.

発明が解決しようとする課題 平面実装部品の小型化、高集積化に伴い、リードピッチ
も２．５４ｍｍのグリッド基準からその１／２．１／３
へと益々微細化される傾向にある。Problems to be Solved by the Invention With the miniaturization and higher integration of planar mounting components, the lead pitch has also decreased from the grid standard of 2.54 mm to 1/2.1/3 of that.
There is a trend toward further miniaturization.

しかしこのようにリードピッチが微細化されると、半田
付は実装の際にリード間あるいはプリント配線板のフッ
トプリント間に半田のブリッジが生じやすいという問題
がある。ブリッジを抑えるために半田量を少なく印刷す
ると、混在される他のチップ部品の半田濡れが不十分に
なるという問題があるとともに、パッケージタイプの部
品のリードにおいてもリードの浮き上がり等により接続
不良が生じることがある。熱圧着、レーザ、赤外線スポ
ットによる微細リード部の個別接合は、半田量、溶接条
件が所望によりコントロールできるが、括りフロー法と
異なり生産性がよくないという問題がある。However, as the lead pitch becomes finer in this manner, there is a problem in that soldering tends to cause solder bridges between leads or between footprints of a printed wiring board during mounting. If a small amount of solder is printed in order to suppress bridging, there is a problem that other chip components that are mixed in will not be sufficiently wetted with solder, and the leads of package-type components will also cause connection failures due to the leads lifting up. Sometimes. Individual bonding of fine lead parts by thermocompression bonding, laser, or infrared spot allows the amount of solder and welding conditions to be controlled as desired, but unlike the bundled flow method, there is a problem in that productivity is not good.

本発明はこのような点に謹みてなされたものであり、そ
の目的とするところは、半田ブリッジを生ずることなく
プリント配線板上にリフロー法により半田付は実装する
ことのできる微細ピッチの多端子平面実装部品及びその
実装方法を提供することである。The present invention has been devised with consideration to these points, and its purpose is to provide a multi-terminal with a fine pitch that can be soldered and mounted on a printed wiring board by a reflow method without producing solder bridges. An object of the present invention is to provide a planar mounting component and a method for mounting the same.

課題を解決するための手段 複数のリードが部品の側面から突出し、下方への折り曲
げ部を介して概略水平方向に伸長した実装部を有する多
端子平面実装部品において、リードの実装部の部品側面
からの距離が交互に千鳥状に変化するように、リードを
部品に取り付ける。Means for Solving the Problems In a multi-terminal flat mount component having a mounting section in which a plurality of leads protrude from the side surface of the component and extend approximately horizontally through a downwardly bent section, the mounting section of the leads extends from the component side surface. Attach the leads to the component so that the distance between them alternates in a staggered manner.

更に、実装部の中央部分を上方にブリッジ状に折り曲げ
、リードの先端部分及び前記折り曲げ部近傍部分の２個
所でプリント配線板に平面実装されるように構成する。Further, the central portion of the mounting portion is bent upward into a bridge shape, so that it is planarly mounted on the printed wiring board at two locations: the tip of the lead and the portion near the bent portion.

また上述した多端子平面実装部品をプリント配線板に実
装するに際しては、プリント配線板の半田付は部をリー
ドの折り曲げ部近傍部分が接合される部分及びリードの
先端部分が接合される部分の２個所に分割するとともに
、分割された半田付は部を千鳥状に配列するようにして
実装する。Furthermore, when mounting the above-mentioned multi-terminal flat mount component on a printed wiring board, the soldering part of the printed wiring board is divided into two parts: the part near the bend of the lead and the part where the tip of the lead is joined. It is divided into parts, and the divided soldering parts are mounted in a staggered arrangement.

作　　　用 リードに対する垂直方向の力は、半田付けされた実装部
においてリードの立ち上がり部即ち折り曲げ部近傍部分
に大部分が加わり、この部分において垂直方向の負荷の
大部分を支えることになる。Most of the vertical force applied to the working leads is applied to the rising portions of the leads, that is, the portions near the bent portions of the soldered mounting portions, and this portion bears most of the vertical load.

また、印刷配線板に対する水平方向の力は、水平方向に
伸長したリード実装部にモーメントとじて働くために、
リード実装部が所望の長さ伸長していることが必要であ
り、その負荷はリードの折り曲げ部近傍部分及びリード
の先端部分により支えられる。本発明はこの点に着目し
てなされたものであり、リード形状を上述したように構
成することにより、垂直方向及び水平方向のストレスに
対しても十分対向できるとともに、リードピッチを小さ
くしてもリードの実装部分及び対応するプリント配線板
のフットプリントが千鳥状に配列されているため、半田
ブリッジを発生することなくリードピッチの小さい多端
子平面実装部品をプリント配線板上に平面実装すること
ができる。In addition, since the horizontal force on the printed wiring board acts as a moment on the lead mounting part that extends in the horizontal direction,
It is necessary that the lead mounting portion extends to a desired length, and the load is supported by the portion near the bending portion of the lead and the tip portion of the lead. The present invention has been made with attention to this point, and by configuring the lead shape as described above, it is possible to sufficiently counter stress in the vertical and horizontal directions, and even with a small lead pitch. Since the mounting parts of the leads and the corresponding printed wiring board footprints are arranged in a staggered manner, it is possible to flat-mount multi-terminal flat mount components with small lead pitches on the printed wiring board without generating solder bridges. can.

実　　施　　例 第１図は本発明実施例側面図、第２図は実施例の半田付
は部を示す模式図である。Embodiment FIG. 1 is a side view of an embodiment of the present invention, and FIG. 2 is a schematic diagram showing the soldering portion of the embodiment.

平面実装型ＬＳＩパッケージ１１の側面には突出長さが
相違するリード１２．１３が交互に設けられている。リ
ード１２は水平基端部１２ａと、下方への折り曲げ部（
立ち上がり部）１２ｂと、折り曲げ部近傍の実装部１２
Ｃと、ブリッジ部１２ｄと、先端実装部１２ｅとにより
構成されている。同じくリード１３は、水平基端部１３
ａと、下方への折り曲げ部（立ち上がり部）１３ｂと、
折り曲げ部近傍の実装部１３ｃと、ブリッジ部１３ｄと
、先端実装部１３ｅとにより構成されている。Leads 12 and 13 having different protruding lengths are alternately provided on the side surface of the plane-mounted LSI package 11. The lead 12 has a horizontal base end 12a and a downwardly bent part (
rising portion) 12b and the mounting portion 12 near the bent portion
C, a bridge portion 12d, and a tip mounting portion 12e. Similarly, the lead 13 has a horizontal proximal end 13
a, a downwardly bent portion (rising portion) 13b,
It is composed of a mounting part 13c near the bent part, a bridge part 13d, and a tip mounting part 13e.

１４はＬＳＩパッケージ１１が実装されるプリント配線
板であり、その表面にはり−ド１２，１３を搭載するフ
ットプリント１５ａ、１５ｂ、１５ｃ、１５ｄが設けら
れている。フットプリント１５ａはリード１２の折り曲
げ部近傍の実装部１２Ｃに対応し、フットプリント１５
ｂはリード１２の先端実装部１２ｅに対応して設けられ
ている。Reference numeral 14 denotes a printed wiring board on which the LSI package 11 is mounted, and footprints 15a, 15b, 15c, and 15d on which the solder boards 12 and 13 are mounted are provided on the surface of the printed wiring board. The footprint 15a corresponds to the mounting portion 12C near the bent portion of the lead 12.
b is provided corresponding to the tip mounting portion 12e of the lead 12.

また、フットプリント１５Ｃはリード１３の折り曲げ部
近傍の実装部１３Ｃに対応し、フットプリン）１５ｄは
リード１３の先端実装部１３ｅに対応して設けられてい
る。更に第２図に示されているように、プリント配線板
１４のフットプリント１５ａ−１５ｄは千鳥状に設けら
れている。これに対応してリード１２及び１３の実装部
１２ｃ。Further, the footprint 15C corresponds to the mounting portion 13C near the bent portion of the lead 13, and the footprint 15d corresponds to the tip mounting portion 13e of the lead 13. Furthermore, as shown in FIG. 2, the footprints 15a-15d of the printed wiring board 14 are provided in a staggered manner. Correspondingly, the mounting portions 12c of the leads 12 and 13 are mounted.

１２ｅ及び１３Ｃ，１３ｅは部品側面からの距離が交互
に千鳥状に変化するように配列されている。12e, 13C, and 13e are arranged so that the distance from the side surface of the component changes alternately in a staggered manner.

このように構成されたＬＳＩパッケージ１１をプリント
配線板１４上に実装するには、ペースト半田をプリント
配線板Ｉ４のフットプリント１５ａ〜１５ｄに印刷し、
ペースト半田が印刷されたフットプリント１５ａ〜１５
ｄ上にリード１２゜１３の実装部１２Ｃ，１２ｅ、１３
ｃ、１３ｅが対応するようにＬＳＩパッケージ１１を搭
載し、所望のりフロー炉を通すことによりＬＳＩパッケ
ージ１１のリード１２．１３とプリント配線板１４のフ
ットプリン）１５ａ−１５ｄは一括半田付は接続される
。In order to mount the LSI package 11 configured in this way on the printed wiring board 14, paste solder is printed on the footprints 15a to 15d of the printed wiring board I4, and
Footprints 15a to 15 printed with paste solder
Mounting parts 12C, 12e, 13 of leads 12°13 on d.
The LSI package 11 is mounted so that the leads 12 and 13e correspond to each other, and the leads 12 and 13 of the LSI package 11 and the footprints 15a to 15d of the printed wiring board 14 are connected by bulk soldering by passing them through a desired glue flow furnace. Ru.

本実施例では上述したようなリード形状を採用し、プリ
ント配線板のフットプリントパターンもこれに対応して
配置したので、リードピッチｐを第４の従来例に示した
リードピッチｐ、に比較して小さくしても半田ブリッジ
の発生を避けることができ、リード本来の機能を確保す
ることができる。In this example, the lead shape as described above is adopted, and the footprint pattern of the printed wiring board is also arranged correspondingly. Therefore, the lead pitch p is compared with the lead pitch p shown in the fourth conventional example. Even if the lead is made smaller, the occurrence of solder bridges can be avoided and the original function of the lead can be ensured.

尚上述した実施例においては、リード１２．１３を折り
曲げ部１２ｂ、１３ｂで概略垂直下方に折り曲げている
が、第４図の折り曲げ部に示すような傾斜を持たせるよ
うにしてもよい。また、上述した実施例ではリード形状
を平面実装型ＬＳＩパッケージに適用した例について説
明したが、本発明のリード形状は平面実装型混成集積回
路モジュール、平面実装型コネクタ等の多端子部品にも
適用可能である。In the embodiment described above, the leads 12, 13 are bent approximately vertically downward at the bending portions 12b and 13b, but they may be bent at an angle as shown in the bending portions of FIG. In addition, in the above-mentioned embodiments, an example was explained in which the lead shape was applied to a plane mount type LSI package, but the lead shape of the present invention can also be applied to multi-terminal components such as a plane mount type hybrid integrated circuit module and a plane mount type connector. It is possible.

発明の効果 本発明は以上詳述したように構成したので、半田ブリッ
ジを生ずることなくプリント配線板上にリフロー法によ
り半田付は実装することのできる微細ピッチの多端子平
面実装部品を提供できるという効果を奏する。Effects of the Invention Since the present invention is configured as detailed above, it is possible to provide a fine-pitch multi-terminal flat mount component that can be soldered and mounted on a printed wiring board by the reflow method without producing solder bridges. be effective.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本発明の実施例側面図、 第２図は実施例の半田付は部を示す模式図、第３図は挿
入実装型の従来例を示す断面図、第４図は平面実装型の
従来例を示す図であり、（Ａ）が側面図、（Ｂ）が半田
付は部を示す模式％式％ １・・・平面実装型ＬＳＩパッケージ、２　、　　　ｌ
　　３　・・・　リ　−　ト′　、２ｃ、１２ｅ、１３
ｃ、１３ｅ−＝実装部、４・・・プリント配線板、 ５ａ、１５ｂ、１５ｃ、１５ｄ ・・・フットプリント。 ィ疋　米イ列　を午ｒＤ　図 第３図Fig. 1 is a side view of an embodiment of the present invention, Fig. 2 is a schematic diagram showing the soldering part of the embodiment, Fig. 3 is a sectional view showing a conventional example of an insertion mount type, and Fig. 4 is a plane mount type. 1 is a diagram showing a conventional example, in which (A) is a side view and (B) is a schematic diagram showing soldering parts. 1...Flat mounting type LSI package, 2, l
3... Reet', 2c, 12e, 13
c, 13e-=mounting section, 4... printed wiring board, 5a, 15b, 15c, 15d... footprint. Figure 3

Claims (2)

【特許請求の範囲】[Claims] （１）複数のリードが部品の側面から突出し、下方への
折り曲げ部を介して概略水平方向に伸長した実装部を有
する多端子平面実装部品において、リード（１２，１３
）の実装部の部品側面からの距離が交互に千鳥状に変化
するように、リード（１２，１３）を部品（１１）に取
り付けるとともに、 該実装部の中央部分（１２ｄ，１３ｄ）を上方にブリッ
ジ状に折り曲げ、リードの先端部分（１２ｅ，１３ｅ）
及び前記折り曲げ部近傍部分（１２ｃ，１３ｃ）の２個
所でプリント配線板（１４）に平面実装されるようにし
たことを特徴とする多端子平面実装部品。(1) In a multi-terminal flat mount component having a mounting portion in which a plurality of leads protrude from the side surface of the component and extend approximately horizontally through a downwardly bent portion, the leads (12, 13
) The leads (12, 13) are attached to the component (11) so that the distance from the side surface of the mounting section of the mounting section changes alternately in a staggered manner, and the center portion (12d, 13d) of the mounting section is attached upward. Bend into a bridge shape and the tip of the lead (12e, 13e)
and a multi-terminal flat-mounted component, characterized in that it is flat-mounted on a printed wiring board (14) at two locations near the bent portions (12c, 13c). （２）請求項１記載の多端子平面実装部品をプリント配
線板に実装するに際し、プリント配線板（１４）の半田
付け部をリードの折り曲げ部近傍部分（１２ｃ，１３ｃ
）が接合される部分（１５ａ，１５ｃ）及びリードの先
端部分（１２ｅ，１３ｅ）が接合される部分（１５ｂ，
１５ｄ）の２個所に分割するとともに、分割された半田
付け部を千鳥状に配列して平面実装することを特徴とす
る多端子平面実装部品の実装方法。(2) When mounting the multi-terminal flat mount component according to claim 1 on a printed wiring board, the soldered portion of the printed wiring board (14) is connected to the portions near the bent portions of the leads (12c, 13c).
) are joined (15a, 15c) and the lead tip parts (12e, 13e) are joined (15b,
15d) A method for mounting a multi-terminal flat-mounted component, which comprises dividing the component into two parts, and arranging the divided soldering parts in a staggered manner for flat-surface mounting.
JP63233559A 1988-09-20 1988-09-20 Multiterminal plane packaging part and method of packaging the same Pending JPH0282682A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63233559A JPH0282682A (en) 1988-09-20 1988-09-20 Multiterminal plane packaging part and method of packaging the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63233559A JPH0282682A (en) 1988-09-20 1988-09-20 Multiterminal plane packaging part and method of packaging the same

Publications (1)

Publication Number Publication Date
JPH0282682A true JPH0282682A (en) 1990-03-23

Family

ID=16956966

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63233559A Pending JPH0282682A (en) 1988-09-20 1988-09-20 Multiterminal plane packaging part and method of packaging the same

Country Status (1)

Country Link
JP (1) JPH0282682A (en)

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