JP2655118B2 - Semiconductor device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device, and more particularly to a surface-mount type vertical semiconductor device.

[0002]

2. Description of the Related Art In recent years, a vertical mounting method has attracted attention as a method for mounting a semiconductor device on a mounting board such as a printed board at high density. As a semiconductor device capable of vertical mounting, SIP (SINGLE INLINE PAC) is used.
KEGE) or a ZIP (ZIGZAG INLINE PACKKA) in which terminals 23 drawn from the lower surface 2 of the package body 1 are alternately bent in opposite directions as shown in FIG.
GE).

However, in the above type, it is necessary to provide the through holes 24 in the mounting substrate 6 as shown in FIG. 10, so that the cost of the substrate increases and the wiring density on the substrate 6 cannot be increased. Therefore, a surface mounting type that does not require a through hole has been proposed.

The surface mount type vertical semiconductor device is disclosed in Japanese Unexamined Patent Publication No. 63-16650 and Japanese Unexamined Patent Publication No. Hei.
No. 361 discloses a support support type. These types are shown in FIGS.

FIG. 11 shows a self-standing type lead. Such a self-supporting lead type includes an inner bending terminal lead 25 and an outer bending terminal lead 25 ′ drawn from the lower surface of the package body 1.
Thus, the terminal leads stand on the substrate by themselves. on the other hand,
In the support maintaining type shown in FIG. 12, the terminal leads 26 are shortened and are supported by supports such as support leads 27 and support pins 28 provided on the lower surface 2 of the main body 1 and stand on the substrate.

[0006]

However, when mounting a vertical semiconductor device of the surface mounting type, the independent lead type and the independent support type require a substrate having a wiring pattern as shown in FIGS. 13 and 14, respectively. It is.
A solder paste is applied on the conductive pads 8 of these substrates,
The semiconductor device is mounted on the substrate so that the conductor pad 8 and the terminal lead overlap, and the conductive pad and the terminal lead are soldered by reflow to mount the semiconductor device. FIG. 13A is a wiring pattern of a self-supporting type semiconductor device which is self-standing by the inner bending terminal lead 25 shown in FIG. 11A, and can be mounted at a high density.
However, since the installation area between the inner bent terminal lead 25 and the conductive pad 8 is small, the solder paste is melted by reflow, and there is a disadvantage that the semiconductor device easily falls down before the solder becomes rigid.

FIG. 13b shows the outer bent lead 2 shown in FIG. 11b.
5 'is a wiring pattern of a self-supporting lead type semiconductor device. With this configuration, the grounding range is widened and it is difficult to fall down as compared with the inner bending terminal lead 25, but the wiring pattern is complicated, and when the number of terminal leads increases as shown in FIG. In this case, there is a problem that the spacing must be increased, and the mounting density decreases.

In a semiconductor device of the support support type, a dummy pad 29 for soldering a support lead 27 and a hole 30 for inserting a support pin 28 as shown in FIG. Must be provided. The dummy pad 29 and the hole 30 are unnecessary in the circuit, have a drawback that they hinder the routing of the wiring 9 and lower the mounting density, and the hole 30 reduces the cost of the substrate due to the drilling process. There was a disadvantage that it increased.

As described above, in the conventional method, it is impossible to make the semiconductor device hard to fall down and to increase the mounting density on the substrate without changing the cost of the substrate.

SUMMARY OF THE INVENTION It is therefore an object of the present invention to provide a semiconductor device which can increase the mounting density without increasing the cost of the substrate and preventing the tipping during vertical mounting.

[0011]

According to the present invention, there is provided a semiconductor device having a semiconductor package in which a semiconductor element is sealed, a plurality of external leads extending from one surface of the semiconductor package, and a semiconductor package having a plurality of external leads. A stand extending from another surface, the stand having a predetermined angle with respect to a direction in which the external lead extends.

[0012]

According to the semiconductor device having such a structure, the semiconductor device is mounted obliquely at a plurality of fulcrums due to the presence of the stand, so that the semiconductor device can be mounted on the surface and fall can be prevented.

[0013]

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 shows a first embodiment of the semiconductor device of the present invention. The device includes a semiconductor chip (not shown) sealed in a package body 1, a terminal lead 3 grounded to an electrode of the chip and pulled out from a lower surface 2 of the body 1, and a side surface 4 not opposed to the lower surface 2. And extends obliquely downward with respect to the main body 1 and is supported by a stand 5 that mechanically supports the main body 1. Therefore, FIG.
As shown in (b), this device is mounted obliquely with respect to the mounting substrate 6. Therefore, the range in which the terminal lead 3 and the stand 5 are grounded to the substrate is widened, and the semiconductor device is less likely to fall.

FIG. 2 shows a state where the semiconductor device of the first embodiment is mounted on a substrate. FIG. 2A shows a mounting in which the stand 5 is fixed with solder 7, and the stand 5 is used as an electrode.
That is, it is used when it is also used as a lead connected to an electrode of a semiconductor chip. This method can stably mount a semiconductor device, but requires a conductive pad on the substrate 6 because the stand 5 is used as an electrode. on the other hand,
FIG. 2B is an implementation in which the stand 5 is simply placed on the substrate 6 and is used when the stand 5 is not used as an electrode. In FIG. 2B, although there is no solder paste between the stand 5 and the substrate 6, the stand 5 is pressed onto the substrate 6 by the weight of the semiconductor device, and the semiconductor device can stably stand alone. Therefore, even if one of the terminal lead 3 and the stand 5 is raised and inclined, the semiconductor device is stable as long as the center of gravity of the semiconductor device exists inside the terminal lead 3 and the stand 5. Further, in the state shown in FIG. 2, even when the solder 7 before the reflow is a solder paste, the semiconductor device can stably stand alone and is hardly collapsed even during the reflow.

FIG. 3 shows a high-density mounting of the semiconductor device of the first embodiment. In this case, it is preferable that the stand 5 be mounted without soldering. Since the stand 5 is lowered on the substrate 6 away from the side surface 4 of the main body 1,
The mounting with the highest mounting density, in which the main bodies 1 of adjacent semiconductor devices are brought into close contact, is possible. Further, since the stand 5 is lowered vertically, the lead 3 and the stand 5 are not adjacent to each other, so that mounting work and mounting on the substrate can be performed.

FIG. 4 shows an example of a substrate on which the semiconductor device of FIG. 2B of the first embodiment is mounted. As shown in the wiring pattern shown in FIG. 4A, in order to mount the semiconductor device of the present invention, only the conductive pad 8 for the lead 3 needs to be provided on the substrate 6, and the wiring 9 is required for the stand 5. For protection, only the insulating coat 10 conventionally used is sufficient. At the time of mounting, there is a difference between the height of the solder paste 7 ′ applied on the conductive pad 8 and the height of the insulating coat 10 as shown in the sectional view of FIG. The device can stand alone without falling down.

FIG. 5 shows a method of manufacturing the semiconductor device according to the first embodiment.

First, a semiconductor element is connected by wire bonding on a lead frame, sealed with an epoxy resin, and a package body 1 having leads 3 'and a stand 5' before bending as shown in FIG. 5A. To form FIG.
As shown in FIG. 6, the stand 5 'may be led out from the die bonding portion to which the semiconductor element 6' is bonded.
An independent stand 5 'may be provided as shown in FIG. FIG.
Therefore, the stand 5 'is used as a back electrode of the chip 6'. In FIG. 6b, the stand 5 'may be used as it is, or may be connected to the surface electrode of the chip 6'. Further, there is also a shape in which the lead frame 5 'is separated from the semiconductor element 6' by cutting the dotted line portion in FIG. 6A.

Next, as shown in FIG. 5B, the main body 1 is fixed to the main body fixing die 11, and the lead bending die 1 shown in FIG.
2 and the lead bending roller 13 form the terminal lead 3. Then, the stand 5 is bent in two stages using the stand bending die 14 and the stand bending roller 15 shown in FIG. 5D and the stand bending die 16 shown in FIG. 5E, whereby the semiconductor device shown in FIG. Obtainable.

FIG. 7 shows a second embodiment of the semiconductor device of the present invention. As shown in the side view of FIG. 7A, the stand 17 is formed so as to be obliquely grounded with respect to the mounting board, and the space between the terminal lead 3 and the stand 17 is increased by increasing the distance between the terminal lead 3 and the board. Even when the step is large, the semiconductor device is hard to fall down. Further, as shown in FIG. 7B, high-density mounting in which the main body 1 is closely attached is also possible.

FIG. 8 shows an embodiment relating to the layout of the semiconductor device of the present invention. The semiconductor device of the first embodiment or the second embodiment (not shown) is provided on both sides of a semiconductor device in which the main body 1 is closely laid out. Although the semiconductor device on the middle side has only the terminal leads 3 without a stand, the semiconductor device can be stably laid out even with this layout.

FIG. 9 shows another embodiment of the lead 3 and the tip of the stand 5. Terminal lead 18, stand 19
Since the tip is rounded, the installation area does not change even if there is a step on the substrate. As a result, the installation condition does not change and the semiconductor device can be stably grounded. The terminal lead 20 and the stand 21 have a shape in which the installation area on the substrate is minimized, and there is an effect that the size of the conductive pad can be reduced. It is also possible to apply an insulating film 22 to the tip of the stand 5 and change the dimensions after forming the leads. In this stand, there is no need to coat the substrate with an insulating coating, and the cost of the substrate can be reduced.

FIG. 5 shows an example of a manufacturing method for obtaining the semiconductor device of the present invention, and the present invention is not limited to this method.

Although the present invention has been described with reference to the case where there are two stands, it is also possible to use two or more stands.

The stand of the present invention uses conductive leads, but any material may be used.
For example, an insulating material may be used. When this is used, it is not necessary to provide an insulating film on the substrate, and the number of steps is reduced.

Further, the shape of the stand according to the embodiment of the present invention is a straight line, but it is not limited to this, and may be a spring shape or a curved shape.

[0028]

As described above, in the semiconductor device according to the present invention, the installation area is widened by the terminal leads and the stand on the substrate, and the semiconductor device is unlikely to fall. Furthermore, since there is no obstacle in wiring other than the conductive pad for terminal lead, there is also an effect that the packing density can be increased to the limit of manufacturing the conductive pad and wiring. In a semiconductor device having a package body of 11 mm in height and 1.25 mm in thickness, conventionally, 3.
In contrast to the installation range of 65 mm width and the mounting interval of 2.54 pitch, in the semiconductor device of the present invention tilted 30 degrees from the vertical, the installation range of 5.5 mm width and the mounting interval of 1.45 mm pitch Becomes possible.

In FIG. 7, a semiconductor device having a more stable structure can be provided. Further, the length of the stand can be made longer than that of FIG. 1, and heat generated from the semiconductor package can be easily released.

In FIG. 8, by arranging a plurality of conventional vertical semiconductor packages and sandwiching them by the semiconductor device of the present invention, it is possible to stably arrange even the conventional vertical semiconductor devices.

[Brief description of the drawings]

FIGS. 1A and 1B are a perspective view and a side view, respectively, showing a semiconductor device according to one embodiment of the present invention.

FIG. 2 is a side view showing a mounting state of the semiconductor device of FIG. 1;

FIG. 3 is a side view in which the semiconductor devices of FIG. 1 are densely arranged;

4A and 4B are a plan view and a cross-sectional view of a substrate on which the semiconductor device of FIG. 1 is mounted.

FIG. 5 is a diagram illustrating a method of manufacturing the semiconductor device of FIG. 1;

FIG. 6 is a plan view showing the inside of the package of the semiconductor device of FIG. 1;

FIG. 7 is a side view showing a second embodiment of the present invention.

FIG. 8 is a side view showing a third embodiment of the present invention.

FIG. 9 is a side view showing the shapes of a terminal lead and a stand according to the present invention.

FIG. 10 shows a conventional insertion-mounted vertical semiconductor device (ZIG).
FIG.

FIG. 11 is a diagram showing a conventional lead-free type surface-mount vertical semiconductor device.

FIG. 12 is a diagram showing a conventional support-supported surface-mounted vertical semiconductor device.

FIG. 13 is a wiring pattern diagram on a mounting board of the semiconductor device of FIG. 10 of a conventional example.

FIG. 14 is a wiring pattern diagram on a substrate of the conventional semiconductor device of FIG. 11;

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Package main body 2 Terminal lead draw-out lower surface 3 Terminal lead 3 'Terminal lead before bending 4 Side of main body 1 Stand 6 Mounting substrate 6' Semiconductor element 7 Solder 7 'Solder paste 8 Terminal lead soldering pad 9 Circuit Substrate 10 Insulation coat for wiring protection 11 Main body fixing die 12 Lead bending die 13 Lead bending roller 14 Stand bending die 15 Stand bending roller 16 Stand bending die 17 Stand 18 of another embodiment 18, 20 Other Embodiments of Forming Terminal Leads 19, 21 Other Embodiments of Stand Tip Shape 22 Stand End Insulating Film 23 Insert Mount Type Terminal Lead 24 Terminal Lead 23 Insert Through Hole 25, 25 'Surface Mount Type Terminal Lead (Terminal Self-standing type) 26 Surface mount type terminal lead (support support type) 27 Torido 28 support pin 29 support hole lead 27 dummy pads 30 support pin inserted for soldering

Claims (5)

(57) [Claims] 1. The length is the first length, the width is the second length, and the height.
Is a hexahedral semiconductor package having a third length
And the height and the height of the six surfaces of the semiconductor package.
Derived from one of the two surfaces determined by
A plurality of external leads, and 6
Two sides of the plane determined by the side and the height
A stand derived from at least one of the surfaces
And the stand is located on the vertical side of the semiconductor package.
Direction, the horizontal direction or the height direction.
Center point of the surface derived by the stand
Is between the external lead and the stand . 2. The semiconductor device according to claim 1, wherein the stand is provided in the semiconductor package.
To supply a potential or signal to a semiconductor element sealed in
2. The semiconductor device according to claim 1, wherein the terminals are: 3. The vertical length is the first length, and the horizontal length is the second length and height.
Is a hexahedral semiconductor package having a third length
And the height and the height of the six surfaces of the semiconductor package.
Derived from one of the two surfaces determined by
Connected to the conductive pads on the mounting board
Of the semiconductor package and the front of the six surfaces of the semiconductor package.
Of the two faces determined by the horizontal and the height
And a stand derived from one surface.
The stand is in the vertical direction and the horizontal direction of the semiconductor package.
Direction or a direction different from the height direction.
And is connected to the mounting substrate, and the semiconductor package is
Is mounted diagonally with respect to the mounting substrate,
The center point of the surface derived from the external lead is
A semiconductor device which is located between the gates. 4. A vertical length is a first length, and a horizontal length is a second length and height.
Is a plurality of hexahedral semiconductor packages having a third length
Is mounted on a mounting substrate, and at least one of the plurality
The two semiconductor packages also have the vertical and the high
Derived from one of the two surfaces determined by
Connected to the conductive pads on the mounting board
Of the semiconductor package and the front of the six surfaces of the semiconductor package.
Of the two faces determined by the horizontal and the height
And a stand derived from one surface .
The stand is in the vertical direction and the horizontal direction of the semiconductor package.
Direction or a direction different from the height direction.
And is connected to the mounting substrate, and the semiconductor package is
Is mounted diagonally with respect to the mounting substrate,
The center point of the surface derived from the external lead is
Between the semiconductor package and the plurality of semiconductor packages.
Are placed in close contact with each other on the plane determined by the side
Wherein a is. 5. The semiconductor package according to claim 1, wherein the plurality of semiconductor packages are connected to both sides.
One semiconductor package has the stand and another semiconductor package
Characterized in that the body package does not have said stand
The semiconductor device according to claim 4 .