JPH0282048U - - Google Patents
Info
- Publication number
- JPH0282048U JPH0282048U JP16140788U JP16140788U JPH0282048U JP H0282048 U JPH0282048 U JP H0282048U JP 16140788 U JP16140788 U JP 16140788U JP 16140788 U JP16140788 U JP 16140788U JP H0282048 U JPH0282048 U JP H0282048U
- Authority
- JP
- Japan
- Prior art keywords
- pin
- semiconductor integrated
- integrated circuit
- circuit package
- package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 3
- 239000000523 sample Substances 0.000 claims 1
- 238000005476 soldering Methods 0.000 claims 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案が適用されるＰＧＡ構造の半導
体集積回路パツケージの斜視図、第２図は本考案
の一実施例におけるピンの拡大断面図、第３図は
ピンの下面図、第４図は本考案の他の実施例のピ
ンの拡大断面図、第５図は従来のピンの一部の側
面図である。
１……パツケージ本体、２……ピン、３……凸
条、４……スプリング、５……突起。
Fig. 1 is a perspective view of a semiconductor integrated circuit package with a PGA structure to which the present invention is applied, Fig. 2 is an enlarged sectional view of a pin in an embodiment of the present invention, Fig. 3 is a bottom view of the pin, and Fig. 4 5 is an enlarged sectional view of a pin according to another embodiment of the present invention, and FIG. 5 is a side view of a portion of a conventional pin. 1...Package body, 2...Pin, 3...Protrusion, 4...Spring, 5...Protrusion.
Claims (1)
回路基板に半田付けして実装を行う半導体集積回
路パツケージにおいて、前記ピンを先端が開口さ
れた筒状に形成し、かつこのピンの内部にはピン
内に挿入されたチエツク用プローブに電気接触さ
れる接触部を形成したことを特徴とする半導体集
積回路パツケージ。 In a semiconductor integrated circuit package that is mounted by soldering a pin protruding from the package body to a printed circuit board, the pin is formed into a cylindrical shape with an open end, and the pin is inserted into the pin. A semiconductor integrated circuit package characterized in that a contact portion is formed to make electrical contact with a checked probe.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16140788U JPH0282048U (en) | 1988-12-13 | 1988-12-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16140788U JPH0282048U (en) | 1988-12-13 | 1988-12-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0282048U true JPH0282048U (en) | 1990-06-25 |
Family
ID=31444314
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16140788U Pending JPH0282048U (en) | 1988-12-13 | 1988-12-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0282048U (en) |
-
1988
- 1988-12-13 JP JP16140788U patent/JPH0282048U/ja active Pending