JPH0281052U - - Google Patents
Info
- Publication number
- JPH0281052U JPH0281052U JP14064689U JP14064689U JPH0281052U JP H0281052 U JPH0281052 U JP H0281052U JP 14064689 U JP14064689 U JP 14064689U JP 14064689 U JP14064689 U JP 14064689U JP H0281052 U JPH0281052 U JP H0281052U
- Authority
- JP
- Japan
- Prior art keywords
- soldering
- bath
- cleaning tank
- transports
- notch
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004140 cleaning Methods 0.000 claims description 10
- 238000005476 soldering Methods 0.000 claims description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 5
- 229910000679 solder Inorganic materials 0.000 claims description 4
- 239000002253 acid Substances 0.000 claims description 2
- 230000032258 transport Effects 0.000 claims 5
- 230000004907 flux Effects 0.000 claims 1
- 210000000078 claw Anatomy 0.000 description 1
Landscapes
- Molten Solder (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989140646U JPH0438528Y2 (enrdf_load_stackoverflow) | 1989-12-06 | 1989-12-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989140646U JPH0438528Y2 (enrdf_load_stackoverflow) | 1989-12-06 | 1989-12-06 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0281052U true JPH0281052U (enrdf_load_stackoverflow) | 1990-06-22 |
| JPH0438528Y2 JPH0438528Y2 (enrdf_load_stackoverflow) | 1992-09-09 |
Family
ID=31405011
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989140646U Expired JPH0438528Y2 (enrdf_load_stackoverflow) | 1989-12-06 | 1989-12-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0438528Y2 (enrdf_load_stackoverflow) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53121131U (enrdf_load_stackoverflow) * | 1977-03-02 | 1978-09-27 | ||
| JPS57128051A (en) * | 1981-02-02 | 1982-08-09 | Hitachi Ltd | Soldering method and apparatus for semiconductor product |
| JPS5881561A (ja) * | 1981-11-06 | 1983-05-16 | Tamura Seisakusho Co Ltd | 被はんだ付け物整列支持用の治具 |
| JPS58158992A (ja) * | 1982-03-17 | 1983-09-21 | 株式会社日立製作所 | 半田処理方法 |
-
1989
- 1989-12-06 JP JP1989140646U patent/JPH0438528Y2/ja not_active Expired
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53121131U (enrdf_load_stackoverflow) * | 1977-03-02 | 1978-09-27 | ||
| JPS57128051A (en) * | 1981-02-02 | 1982-08-09 | Hitachi Ltd | Soldering method and apparatus for semiconductor product |
| JPS5881561A (ja) * | 1981-11-06 | 1983-05-16 | Tamura Seisakusho Co Ltd | 被はんだ付け物整列支持用の治具 |
| JPS58158992A (ja) * | 1982-03-17 | 1983-09-21 | 株式会社日立製作所 | 半田処理方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0438528Y2 (enrdf_load_stackoverflow) | 1992-09-09 |