JPH0279049U - - Google Patents

Info

Publication number
JPH0279049U
JPH0279049U JP1988158589U JP15858988U JPH0279049U JP H0279049 U JPH0279049 U JP H0279049U JP 1988158589 U JP1988158589 U JP 1988158589U JP 15858988 U JP15858988 U JP 15858988U JP H0279049 U JPH0279049 U JP H0279049U
Authority
JP
Japan
Prior art keywords
bonding wire
base body
semiconductor element
insulating member
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988158589U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988158589U priority Critical patent/JPH0279049U/ja
Publication of JPH0279049U publication Critical patent/JPH0279049U/ja
Pending legal-status Critical Current

Links

Classifications

    • H10W74/10
    • H10W90/756

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP1988158589U 1988-12-06 1988-12-06 Pending JPH0279049U (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988158589U JPH0279049U (enExample) 1988-12-06 1988-12-06

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988158589U JPH0279049U (enExample) 1988-12-06 1988-12-06

Publications (1)

Publication Number Publication Date
JPH0279049U true JPH0279049U (enExample) 1990-06-18

Family

ID=31439053

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988158589U Pending JPH0279049U (enExample) 1988-12-06 1988-12-06

Country Status (1)

Country Link
JP (1) JPH0279049U (enExample)

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