JPH0279049U - - Google Patents
Info
- Publication number
- JPH0279049U JPH0279049U JP1988158589U JP15858988U JPH0279049U JP H0279049 U JPH0279049 U JP H0279049U JP 1988158589 U JP1988158589 U JP 1988158589U JP 15858988 U JP15858988 U JP 15858988U JP H0279049 U JPH0279049 U JP H0279049U
- Authority
- JP
- Japan
- Prior art keywords
- bonding wire
- base body
- semiconductor element
- insulating member
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988158589U JPH0279049U (enExample) | 1988-12-06 | 1988-12-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988158589U JPH0279049U (enExample) | 1988-12-06 | 1988-12-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0279049U true JPH0279049U (enExample) | 1990-06-18 |
Family
ID=31439053
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988158589U Pending JPH0279049U (enExample) | 1988-12-06 | 1988-12-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0279049U (enExample) |
-
1988
- 1988-12-06 JP JP1988158589U patent/JPH0279049U/ja active Pending