JPH02770U - - Google Patents
Info
- Publication number
- JPH02770U JPH02770U JP7777588U JP7777588U JPH02770U JP H02770 U JPH02770 U JP H02770U JP 7777588 U JP7777588 U JP 7777588U JP 7777588 U JP7777588 U JP 7777588U JP H02770 U JPH02770 U JP H02770U
- Authority
- JP
- Japan
- Prior art keywords
- leads
- width
- footprint
- component package
- footprints
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000006071 cream Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図Ａ，Ｂは本考案の部品パツケージの接続
構造を示す断面図及びフツトプリントの平面図、
第２図Ａ，Ｂは本考案の実施例で、軸ずれしない
場合及び軸ずれした場合をそれぞれ示し、第３図
は本考案の他の実施例を示す平面図、第４図は本
考案の接続構造の詳細平面図、第５図及び第６図
は従来の部品パツケージの接続構造を示す平面図
である。
１……部品パツケージ、２……リード、３……
プリント配線基板、４……フツトプリント、５…
…クリーム半田、ａ，ｂ……フツトプリントの幅
、Ｄ……フツトプリントの間隔。
FIGS. 1A and 1B are a cross-sectional view and a plan view of the footprint showing the connection structure of the component package of the present invention,
Figures 2A and 2B show embodiments of the present invention, with no axis deviation and cases with axis deviation, respectively; Figure 3 is a plan view showing another embodiment of the invention; and Figure 4 is a plan view of the invention. Detailed plan views of the connection structure, FIGS. 5 and 6 are plan views showing the connection structure of a conventional component package. 1... Part package, 2... Lead, 3...
Printed wiring board, 4... Foot print, 5...
...Cream solder, a, b...width of foot prints, D...distance between foot prints.
Claims (1)
ツケージ１を、該リードに対応するフツトプリン
ト４が配列されているプリント板３に接続する構
造において、前記リード２の長手方向に関するフ
ツトプリント４の一端の幅ａと他端の幅ｂとが異
なり、隣接するフツトプリント４を幅の大なる側
と小なる側とを交互に配列したことを特徴とする
部品パツケージの接続構造。 In a structure in which a component package 1 in which a large number of leads 2 protrude in parallel is connected to a printed board 3 on which footprints 4 corresponding to the leads are arranged, one end of the footprint 4 in the longitudinal direction of the leads 2 A component package connection structure characterized in that the width a of the footprint and the width b of the other end are different, and adjacent footprints 4 are arranged alternately on the larger width side and the smaller width side.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7777588U JPH02770U (en) | 1988-06-14 | 1988-06-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7777588U JPH02770U (en) | 1988-06-14 | 1988-06-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02770U true JPH02770U (en) | 1990-01-05 |
Family
ID=31302738
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7777588U Pending JPH02770U (en) | 1988-06-14 | 1988-06-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02770U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001085826A (en) * | 1999-09-14 | 2001-03-30 | Mitsubishi Electric Corp | Wiring board |
-
1988
- 1988-06-14 JP JP7777588U patent/JPH02770U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001085826A (en) * | 1999-09-14 | 2001-03-30 | Mitsubishi Electric Corp | Wiring board |