JPH0275193A - Sealing method for thin film el panel - Google Patents

Sealing method for thin film el panel

Info

Publication number
JPH0275193A
JPH0275193A JP63223634A JP22363488A JPH0275193A JP H0275193 A JPH0275193 A JP H0275193A JP 63223634 A JP63223634 A JP 63223634A JP 22363488 A JP22363488 A JP 22363488A JP H0275193 A JPH0275193 A JP H0275193A
Authority
JP
Japan
Prior art keywords
panel
sealing
insulating material
substrate
thin film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP63223634A
Other languages
Japanese (ja)
Inventor
Toshihiro Mitsu
俊宏 満
Yukio Onuki
由紀夫 大貫
Akio Kondo
近藤 昭夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tosoh Corp
Original Assignee
Tosoh Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tosoh Corp filed Critical Tosoh Corp
Priority to JP63223634A priority Critical patent/JPH0275193A/en
Publication of JPH0275193A publication Critical patent/JPH0275193A/en
Pending legal-status Critical Current

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  • Electroluminescent Light Sources (AREA)

Abstract

PURPOSE:To eliminate the heat treatment after sealing and prevent the breakage of a panel due to the volume expansion of an insulating material and the omnipresence of a black dye by filling and sealing a black gelatinous or solid insulating material in a void between a panel substrate and a back substrate. CONSTITUTION:A transparent electrode 2 is arranged in parallel in a band shape on a glass substrate 1, an EL light emitting layer 4 made of a material added with MnS to ZnS is formed on it so as to be pinched by dielectric layers 3 and 5 made of Al2O3, and a back electrode 7 arranged with an Al layer in a band shape in the direction perpendicular to the electrode 2. A back substrate 8 with a filling hole 9 is then stuck, and liquid black thermosetting silicon resin is vacuum-filled through the filling hole. After it is heated and hardened, the periphery of the filling hole is cleaned, and a sealing plate 13 is stuck with epoxy resin 12 to seal the hole. A panel is not broken due to heating after sealing, and the contrast of the thin film EL panel can be improved.

Description

【発明の詳細な説明】 (産業上の利用分野) 本発明は、交流電界の印加によってEL(Electr
oluminescencc)発光を呈する薄膜ELパ
ネルの製造方法に関するものであり、特にその封止方法
に関するものである。
DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention provides EL (Electrical
The present invention relates to a method for manufacturing a thin-film EL panel that emits light, and particularly to a method for sealing the same.

(従来の技術) 一般的に薄膜ELパネルはガラス基板上に透明電極を設
けたパネル基板上にEL薄膜を設け、さらにその上に背
面電極を設けた構造を有する薄膜EL素子を背面基板と
絶縁性材料を用いて封止したものである。
(Prior art) Generally, a thin film EL panel has a structure in which a transparent electrode is provided on a glass substrate, an EL thin film is provided on a panel substrate, and a back electrode is further provided on the panel substrate.A thin film EL element is insulated from the back substrate. It is sealed using a flexible material.

また、このELN膜としてはMnをドープしたZnSや
Zn5eなどからなるEL発光層をAρ 203やTi
O3などからなる第一誘電体層(下層)および第二誘電
体層(上層)で挾んだ二重絶縁構造のものが開発されて
おり、このEL薄膜を用いて得た薄膜ELパネルは絶縁
耐圧、発光効率および動作の安定性に優れたものである
In addition, for this ELN film, the EL light emitting layer made of Mn-doped ZnS or Zn5e is replaced with Aρ 203 or Ti.
A double insulation structure sandwiched between a first dielectric layer (lower layer) and a second dielectric layer (upper layer) made of O3, etc. has been developed, and thin-film EL panels obtained using this EL thin film are insulated. It has excellent voltage resistance, luminous efficiency, and operational stability.

このような薄膜ELパネルの製造において、従来、絶縁
性材料としてシリコーンオイルが用いられており、第2
図に示すように背面基板8に絶縁性制料の注入孔9を設
け、該注入孔から注入管を通してシリコーンオイル7を
注入した後に、柱状のアルミニウム片11を注入孔9に
挿入し仮封止を行ない、次いでエポキシ樹脂12を用い
て注入孔をカラス片13て封孔する封止方法か主に採用
されている。この仮封止は、シリコーンオイルと封孔の
際に用いるエポキシ樹脂の相性が悪いために行われるも
のであり、封止の工程は繁雑なものとなる。
In the manufacture of such thin film EL panels, silicone oil has conventionally been used as an insulating material;
As shown in the figure, an insulating material injection hole 9 is provided in the rear substrate 8, and after silicone oil 7 is injected from the injection hole through an injection tube, a columnar aluminum piece 11 is inserted into the injection hole 9 for temporary sealing. A method of sealing is mainly used in which the injection hole is sealed with a glass piece 13 using an epoxy resin 12. This temporary sealing is performed because silicone oil and the epoxy resin used for sealing are incompatible, and the sealing process becomes complicated.

また、このような方法で封止されたELパネルは、発光
時のコントラストを向上させるために背面基板側の外部
光を遮断する必要かある。従来、外部光を遮断するため
には、 (1)背面ガラスの外側に、加熱硬化型樹脂からなる黒
色塗料を塗布する。
Further, in an EL panel sealed by such a method, it is necessary to block external light on the rear substrate side in order to improve the contrast during light emission. Conventionally, in order to block external light, (1) black paint made of heat-curable resin is applied to the outside of the back glass.

(2)シリコーンオイルを染料で着色する。(2) Coloring silicone oil with dye.

などの手段が取られてきた。しかしながら、(1)の方
法では封孔に用いたガラス片13が背面ガラスより突出
しているために、該ガラス片の側面および周辺部への黒
色塗料の塗布が困難であり、更に絶縁性封材注入孔を封
孔した後に塗料の加熱硬化が行なわれるので、パネル基
板と背面基板間に注入されたシリコーンオイルの体積膨
張が生じ、背面基板が破損してしまうという問題がある
。また(2)の方法では、染料はシリコーンオイル中に
充分溶解しないので、長時間静止状態で使用を続けると
染料が偏在してしまい、この偏在により充分に外部光を
遮断することができなくなり、コントラストの低下を招
くという問題点がある。
Such measures have been taken. However, in method (1), since the glass piece 13 used for sealing protrudes from the back glass, it is difficult to apply black paint to the side and peripheral parts of the glass piece, and furthermore, the insulating sealing material Since the paint is heated and cured after the injection hole is sealed, there is a problem in that the silicone oil injected between the panel substrate and the rear substrate expands in volume, resulting in damage to the rear substrate. In addition, in method (2), the dye is not sufficiently dissolved in the silicone oil, so if it is used in a stationary state for a long time, the dye will be unevenly distributed, and this uneven distribution will not be able to sufficiently block external light. There is a problem in that the contrast deteriorates.

(発明か解決しようとする課題) 本発明の1]的は、上述の課題を解決し、コントラスト
向上の効果かあり、かつ、製造も容易である薄膜ELパ
ネルを提供することにある。
(Problems to be Solved by the Invention) An object of the present invention is to provide a thin film EL panel that solves the above-mentioned problems, has an effect of improving contrast, and is easy to manufacture.

(課題を解決するための手段及び作用)本発明者らは」
1記5!題を解決するために、封止の際パネル内部に注
入される絶縁性材料に関して鋭意検討を行なった結果、
本発明を完成するに至った。すなわち本発明は、パネル
基板と背面基板とを封止樹脂によって張り合わせた後、
両ハ板間に設けられた空隙に、背面基板側に設けられた
注入孔から絶縁性材料を注入し、次いで注入孔を封孔す
る薄膜ELパネルの封止方法において、絶縁性材料とし
て黒色のゲル状または固体状の絶縁性材料を用いること
を特徴とする薄膜ELパネルの封止方法である。
(Means and effects for solving the problem) The present inventors"
1st record 5! In order to solve this problem, we conducted extensive research on the insulating material that is injected into the panel during sealing.
The present invention has now been completed. That is, in the present invention, after bonding the panel substrate and the back substrate together using a sealing resin,
In a thin film EL panel sealing method in which an insulating material is injected into the gap provided between both plates through an injection hole provided on the rear substrate side, and then the injection hole is sealed, a black material is used as the insulating material. This is a method for sealing a thin-film EL panel, characterized by using a gel-like or solid-state insulating material.

本発明の薄膜ELパネルの封止方法では、パネル内部に
注入する絶縁性材料として黒色のゲル状または固体状の
絶縁性材料が用いられる。この材料としては熱硬化性あ
るいは光硬化性のブチルゴム系樹脂、スチレンブタジェ
ンゴム系樹脂、クロロプレン系樹脂、アクリル系樹脂、
シリコーン樹脂などを例示することができるが、黒色で
あり、注入孔からの注入の際に液状であり、また電気特
性に優れているものであれば特に限定はない。
In the thin film EL panel sealing method of the present invention, a black gel-like or solid insulating material is used as the insulating material injected into the panel. Examples of this material include thermosetting or photocurable butyl rubber resin, styrene butadiene rubber resin, chloroprene resin, acrylic resin,
Examples include silicone resin, but there are no particular limitations as long as it is black, liquid when injected from the injection hole, and has excellent electrical properties.

以下、図面に基づいて本発明の詳細な説明する。Hereinafter, the present invention will be described in detail based on the drawings.

第1図は本発明の方法により封止を行なった薄膜ELパ
ネルの一例を示す断面図である。
FIG. 1 is a sectional view showing an example of a thin film EL panel sealed by the method of the present invention.

本発明の封止方法は例えば、上記の絶縁性材料14を液
状のまま、背面基板8に設けた注入孔9から注入管を通
して注入し、次いて加熱あるいは光の照射なとにより材
料をゲル化または固体化し、その後エポキシ樹脂12と
封孔板13により注入孔9を封孔して行なうことができ
る。また、余分に注入された絶縁性材料は、材料のゲル
化または固体化の際に注入孔9より流出し、固化するの
で、この固化した材料を削った後に封孔を行なえば、仮
封止を必要とせずにエポキシ樹脂12と封孔板13たけ
で封孔を行なうことが可能となる。
The sealing method of the present invention includes, for example, injecting the above-mentioned insulating material 14 in a liquid state through an injection tube through an injection hole 9 provided in the rear substrate 8, and then gelling the material by heating or irradiating it with light. Alternatively, the injection hole 9 can be solidified and then sealed with the epoxy resin 12 and the sealing plate 13. In addition, the excess injected insulating material flows out from the injection hole 9 and solidifies when the material gels or solidifies, so if the hole is sealed after cutting off this solidified material, temporary sealing can be achieved. It becomes possible to seal the holes using only the epoxy resin 12 and the sealing plate 13 without requiring any.

(実施例) 以下、実施例により本発明をさらに詳細に説明、本発明
は何らこれらに限定されるものではない。
(Examples) Hereinafter, the present invention will be explained in more detail with reference to Examples, but the present invention is not limited thereto.

実施例 第1図に示すように、ガラスからなる基板1上に透明電
極2を帯状に多数平行配置した。次いて透明電極2上に
Aρ 203からなる第一誘電体層3を2000人、そ
の上にZnSにMnSを添加した材料からなるEL発光
層4を9000人、さらにその上にAβ 203からな
る第二誘電体層5を2000人、各々スパッタリング法
により形成した後、第二誘電体層5上にアルミニウム層
を厚さ6000人蒸着し、該アルミニウム層を透明電極
2と直交する方向へ帯状に成型配列し、背面電極7を形
成した。
EXAMPLE As shown in FIG. 1, a large number of transparent electrodes 2 were arranged in parallel in strips on a substrate 1 made of glass. Next, a first dielectric layer 3 made of Aρ 203 was placed on the transparent electrode 2 by 2000 people, an EL light emitting layer 4 made of ZnS with MnS added thereto by 9000 people, and a third dielectric layer 3 made of Aβ 203 was placed on top of that by 9000 people. After forming 2,000 second dielectric layers 5 by sputtering, a 6,000-thick aluminum layer is deposited on the second dielectric layer 5, and the aluminum layer is formed into a strip in a direction perpendicular to the transparent electrode 2. Then, the back electrode 7 was formed.

次いで、注入孔9を有する背面基板8(厚さは1、 、
1. m IN )をエポキシ樹脂12を介してガラス
基板1および透明電極2に張り合わせ、絶縁性の硬化性
樹脂を注入する前のパネルを得た。
Next, a back substrate 8 having injection holes 9 (thickness: 1,
1. m IN ) was attached to the glass substrate 1 and the transparent electrode 2 via the epoxy resin 12 to obtain a panel before injecting the insulating curable resin.

このパネルの注入孔9に注入管を挿入し、液状で黒色の
熱硬化性のシリコン樹脂をいれた容器と共に真空乾燥器
の中へ配置し、真空ポンプを用いて真空乾燥器内部の空
気、パネル内の空気および熱硬化性樹脂中に溶解してい
る空気を除き、続いて乾燥器内部の圧力を大気圧に戻し
、注入管を通して熱硬化性樹脂をパネル内に注入した。
Insert the injection tube into the injection hole 9 of this panel, place it in a vacuum dryer together with a container containing liquid black thermosetting silicone resin, and use a vacuum pump to remove the air inside the vacuum dryer and the panel. After removing the air inside the dryer and the air dissolved in the thermosetting resin, the pressure inside the dryer was returned to atmospheric pressure, and the thermosetting resin was injected into the panel through the injection pipe.

注入後、注入管をはずし、パネルを取り出して清浄し、
再び乾燥器内に入れ、150°Cにて30分間熱硬化性
樹脂を加熱硬化した。その後徐冷し、パネルの注入孔9
の周囲を清浄し、エポキシ樹脂12によって封孔板13
を注入孔9を覆うように接着して1・1孔した。
After injection, remove the injection tube, take out the panel and clean it.
It was placed in the dryer again, and the thermosetting resin was heated and cured at 150°C for 30 minutes. After that, it is slowly cooled and the injection hole 9 of the panel is
Clean the area around the hole sealing plate 13 with epoxy resin 12.
was glued so as to cover injection hole 9 to form 1.1 hole.

得られた薄膜ELパネルは優れたコンi・ラストを有す
るものであった。
The resulting thin film EL panel had excellent contrast.

(発明の効果) 以上述べたとおり、本発明の薄膜ELパネルの封止方法
によれば、パネル内部に注入された封入材料か黒色の絶
縁性ゲル状利料もしくは黒色の絶縁性固体材料であるの
で、絶縁性材料注入孔の封孔後に加熱処理を行なう必要
がないので、コントラストを向上する際に、絶縁性材料
の体積膨脂に伴うパネルの破損を防止することができる
。更に本発明によれば黒色染料の偏在がないコントラス
トる。
(Effects of the Invention) As described above, according to the thin-film EL panel sealing method of the present invention, the encapsulating material injected into the panel, the black insulating gel-like compound, or the black insulating solid material Therefore, it is not necessary to perform heat treatment after sealing the insulating material injection hole, so that damage to the panel due to volume expansion of the insulating material can be prevented when improving contrast. Further, according to the present invention, there is a contrast without uneven distribution of black dye.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明の方法により封止した薄膜ELパネルの
断面図である。 第2図は従来の方法により封止した薄膜ELパネルの断
面図である。 図中、 ]・・・基板       2・・透明電極3・・・第
一誘電体層   4・・・EL発光層5・・第二誘電体
層   6・・・背面電極7 シリコーンオイル 8・
・・背面基板9・・・注入孔      10・・・エ
ポキシ樹脂11・・・アルミニウム片  12・・・エ
ポキシ樹脂13・・封孔板 14・・・黒色のゲル状または固体状の絶縁性材料を各
々示す。
FIG. 1 is a cross-sectional view of a thin film EL panel sealed by the method of the present invention. FIG. 2 is a cross-sectional view of a thin film EL panel sealed by a conventional method. In the figure, ]... Substrate 2... Transparent electrode 3... First dielectric layer 4... EL light emitting layer 5... Second dielectric layer 6... Back electrode 7 Silicone oil 8.
... Rear substrate 9 ... Injection hole 10 ... Epoxy resin 11 ... Aluminum piece 12 ... Epoxy resin 13 ... Sealing plate 14 ... Black gel-like or solid insulating material Each is shown.

Claims (1)

【特許請求の範囲】[Claims] (1)パネル基板と背面基板とを封止樹脂によって張り
合わせた後、両基板間に設けられた空隙に、背面基板側
に設けられた注入孔から絶縁性材料を注入し、次いで注
入孔を封孔する薄膜ELパネルの封止方法において、絶
縁性材料として黒色のゲル状または固体状の絶縁性材料
を用いることを特徴とする薄膜ELパネルの封止方法。
(1) After pasting the panel substrate and the back substrate together with a sealing resin, insulating material is injected into the gap between the two substrates through the injection hole provided on the back substrate side, and then the injection hole is sealed. A method for sealing a thin film EL panel with holes, the method comprising using a black gel-like or solid insulating material as the insulating material.
JP63223634A 1988-09-08 1988-09-08 Sealing method for thin film el panel Pending JPH0275193A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63223634A JPH0275193A (en) 1988-09-08 1988-09-08 Sealing method for thin film el panel

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63223634A JPH0275193A (en) 1988-09-08 1988-09-08 Sealing method for thin film el panel

Publications (1)

Publication Number Publication Date
JPH0275193A true JPH0275193A (en) 1990-03-14

Family

ID=16801268

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63223634A Pending JPH0275193A (en) 1988-09-08 1988-09-08 Sealing method for thin film el panel

Country Status (1)

Country Link
JP (1) JPH0275193A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10333601A (en) * 1997-06-02 1998-12-18 Canon Inc Electroluminescent element and its manufacture
JPH113048A (en) * 1997-06-10 1999-01-06 Canon Inc Electroluminescent element and device and their production
JP2012054248A (en) * 1999-10-29 2012-03-15 Semiconductor Energy Lab Co Ltd Electronic device and manufacturing method thereof
JP2014056242A (en) * 1999-03-02 2014-03-27 Semiconductor Energy Lab Co Ltd Semiconductor device

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10333601A (en) * 1997-06-02 1998-12-18 Canon Inc Electroluminescent element and its manufacture
JPH113048A (en) * 1997-06-10 1999-01-06 Canon Inc Electroluminescent element and device and their production
JP2014056242A (en) * 1999-03-02 2014-03-27 Semiconductor Energy Lab Co Ltd Semiconductor device
US8847316B2 (en) 1999-03-02 2014-09-30 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method of manufacturing the same
US9153604B2 (en) 1999-03-02 2015-10-06 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method of manufacturing the same
JP2012054248A (en) * 1999-10-29 2012-03-15 Semiconductor Energy Lab Co Ltd Electronic device and manufacturing method thereof

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