JPH027465Y2 - - Google Patents
Info
- Publication number
- JPH027465Y2 JPH027465Y2 JP1983164379U JP16437983U JPH027465Y2 JP H027465 Y2 JPH027465 Y2 JP H027465Y2 JP 1983164379 U JP1983164379 U JP 1983164379U JP 16437983 U JP16437983 U JP 16437983U JP H027465 Y2 JPH027465 Y2 JP H027465Y2
- Authority
- JP
- Japan
- Prior art keywords
- tank
- chuck
- wafer
- gutter
- nitrogen gas
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000007788 liquid Substances 0.000 claims description 21
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 17
- 229910001873 dinitrogen Inorganic materials 0.000 claims description 17
- 238000005530 etching Methods 0.000 claims description 8
- 239000004065 semiconductor Substances 0.000 claims description 7
- 230000002093 peripheral effect Effects 0.000 claims description 5
- 235000012431 wafers Nutrition 0.000 description 24
- 239000007789 gas Substances 0.000 description 4
- 230000032683 aging Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- -1 polypropylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 239000012495 reaction gas Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Landscapes
- Weting (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16437983U JPS6073234U (ja) | 1983-10-24 | 1983-10-24 | 半導体ウエハ−の処理装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16437983U JPS6073234U (ja) | 1983-10-24 | 1983-10-24 | 半導体ウエハ−の処理装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6073234U JPS6073234U (ja) | 1985-05-23 |
JPH027465Y2 true JPH027465Y2 ( ) | 1990-02-22 |
Family
ID=30360402
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16437983U Granted JPS6073234U (ja) | 1983-10-24 | 1983-10-24 | 半導体ウエハ−の処理装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6073234U ( ) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57159029A (en) * | 1981-03-25 | 1982-10-01 | Seiichiro Sogo | Oxidized film etching device for semiconductor wafer |
-
1983
- 1983-10-24 JP JP16437983U patent/JPS6073234U/ja active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57159029A (en) * | 1981-03-25 | 1982-10-01 | Seiichiro Sogo | Oxidized film etching device for semiconductor wafer |
Also Published As
Publication number | Publication date |
---|---|
JPS6073234U (ja) | 1985-05-23 |
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