JPH0269232A - Laminated sheet for electricity - Google Patents
Laminated sheet for electricityInfo
- Publication number
- JPH0269232A JPH0269232A JP22104388A JP22104388A JPH0269232A JP H0269232 A JPH0269232 A JP H0269232A JP 22104388 A JP22104388 A JP 22104388A JP 22104388 A JP22104388 A JP 22104388A JP H0269232 A JPH0269232 A JP H0269232A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- impregnated
- glass
- paper
- metallic foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000005611 electricity Effects 0.000 title abstract 2
- 229920005989 resin Polymers 0.000 claims abstract description 32
- 239000011347 resin Substances 0.000 claims abstract description 32
- 239000011521 glass Substances 0.000 claims abstract description 28
- 239000004744 fabric Substances 0.000 claims abstract description 25
- 239000011888 foil Substances 0.000 claims abstract description 18
- 229910052751 metal Inorganic materials 0.000 claims abstract description 13
- 239000002184 metal Substances 0.000 claims abstract description 13
- 238000000465 moulding Methods 0.000 claims description 9
- 238000010030 laminating Methods 0.000 claims description 2
- 239000003822 epoxy resin Substances 0.000 abstract description 18
- 229920000647 polyepoxide Polymers 0.000 abstract description 18
- 239000000123 paper Substances 0.000 abstract description 9
- 238000001035 drying Methods 0.000 abstract description 8
- 239000002655 kraft paper Substances 0.000 abstract description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 abstract description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract description 4
- 229920000877 Melamine resin Polymers 0.000 abstract description 2
- 239000004640 Melamine resin Substances 0.000 abstract description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 abstract description 2
- 229910052782 aluminium Inorganic materials 0.000 abstract description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract description 2
- 229910052742 iron Inorganic materials 0.000 abstract description 2
- 229910052759 nickel Inorganic materials 0.000 abstract description 2
- 239000005011 phenolic resin Substances 0.000 abstract description 2
- 229920006337 unsaturated polyester resin Polymers 0.000 abstract description 2
- 229910052725 zinc Inorganic materials 0.000 abstract description 2
- 239000011701 zinc Substances 0.000 abstract description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 abstract 1
- 229910000881 Cu alloy Inorganic materials 0.000 abstract 1
- 230000008030 elimination Effects 0.000 abstract 1
- 238000003379 elimination reaction Methods 0.000 abstract 1
- 239000004745 nonwoven fabric Substances 0.000 abstract 1
- 229920001568 phenolic resin Polymers 0.000 abstract 1
- 230000001105 regulatory effect Effects 0.000 abstract 1
- 239000002759 woven fabric Substances 0.000 abstract 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 239000004593 Epoxy Substances 0.000 description 6
- 239000003795 chemical substances by application Substances 0.000 description 6
- 239000011889 copper foil Substances 0.000 description 6
- 239000002966 varnish Substances 0.000 description 5
- -1 fluororesin Polymers 0.000 description 4
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 4
- 229910000831 Steel Inorganic materials 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 150000003949 imides Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/036—Multilayers with layers of different types
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
Landscapes
- Laminated Bodies (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は電気機器、電子機器、計算機器、通信機器等に
用すられる′１気用積層版に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a laminate for use in electrical equipment, electronic equipment, computing equipment, communication equipment, etc.
従来の片面金属張電気用積層板にあっては、樹脂含浸基
材の樹脂量は全て同−愉であるため、常態及び電気用積
層板をプリント配線板に加工する時の印刷、エツチング
工程で金属箔側を内側とする凹状反りが発生する。In conventional single-sided metal-clad electrical laminates, the amount of resin in the resin-impregnated base material is the same, so the printing and etching processes when converting normal and electrical laminates into printed wiring boards are different. A concave warp occurs with the metal foil side facing inside.
従来の技術で述べたように、片面金属張電気用積層板の
樹脂含浸基材の樹脂量を全て同一量にすると、常態及び
プリント配線板加工時に凹状反りを発生する。本発明は
従来の技術における上述の問題点に鑑みてなされたもの
で、その目的とするところは、電気用積層板の常態及び
プリント配線板加工時の凹状反りをなくすることにある
。As described in the related art section, if the resin-impregnated base material of a single-sided metal-clad electrical laminate is made to have the same amount of resin, concave warping occurs both in normal conditions and during printed wiring board processing. The present invention has been made in view of the above-mentioned problems in the prior art, and its purpose is to eliminate the concave warpage that normally occurs in electrical laminates and during the processing of printed wiring boards.
本発明は樹脂含浸紙の上下面に、樹脂含浸ガラス布を配
し、更にその上面又は下面に金属箔を配設した積層体を
積層成形してなることを特徴とする電気用積層板にお−
で、金属箔側樹脂含浸ガラス布の樹脂量を、金属箔反対
側の樹脂含浸ガラス布の樹脂量より多くしたことを特徴
とする電気用積層板のため、常態及びプリント配線板加
工時における金属箔側を内側とする凹状反りをなくする
ことができたもので、以下本発明の詳細な説明する。The present invention relates to an electrical laminate, characterized in that it is formed by laminating and molding a laminate in which resin-impregnated glass cloth is arranged on the upper and lower surfaces of resin-impregnated paper, and metal foil is further arranged on the upper or lower surface of the laminate. −
This is an electrical laminate, characterized in that the amount of resin in the resin-impregnated glass cloth on the metal foil side is greater than the amount of resin in the resin-impregnated glass cloth on the opposite side of the metal foil. The present invention will be described in detail below because it is possible to eliminate concave warping with the foil side facing inside.
本発明に用−る樹脂含浸紙の紙としては、クラフト紙、
リンター紙、クラフト、リンター混抄紙等が用いられ、
樹脂含浸ガラス布としては、ガラス織布、ガラス不織布
、ガラスベーパー等が用層られ、これらに含浸させる樹
脂としては、フェノール樹脂、メラミン衝脂、エポキシ
樹脂、不飽和ポリエステル樹脂、クレゾール樹脂、ボ１
１イミド樹脂、ポリアミドイミド樹脂、ポリブタジェン
樹脂、ポリアミド樹脂、フッ素樹脂、シリコン樹脂ポリ
ブチレンテレフタレート樹脂、ポリエチレンテレフタレ
ート樹脂、ポリフェニレンサルファイド樹脂等の里独、
混合物、変性物をｍ−ることができるが、好ましくは耐
熱性、強度のバランスのよりエポキシ樹脂を用Ａること
が望ましく、エポキシ樹脂トシては、ビスフェノールＡ
型エポキシ瘤脂、ノボラック型エポキシ樹脂、ハロゲン
化エポキシ樹脂、グリシジルエステル型エポキシ樹脂、
高分子型エポキシ樹脂、可撓性エポキシ樹脂等のように
エポキシ樹脂全般をｍ−ることができる。金属箔として
は銅、鉄、アルミニウム、ニッケル、亜鉛等の皐独、合
金の金属箔を用いることができ、必要に応じて金属箔の
片面に接着剤層を設けたものを用いることもできる。金
属箔側及び金属箔反対側の樹脂含浸ガラス布の樹脂量差
は乾燥後で５〜２０１ｉｔｔ％（以下旭に係と記す）か
好ましい。即ち５チ未満では反りを改良し難く、２０チ
をこえると成形性が低下する顔向にあるからである。積
層成形手段としては多段プレス法、プレス法、マルチロ
ール法、引抜法、無圧乃至低圧連続成形法、ダブルベル
ト法等が用層られ、特に限定するものではな−。Examples of the resin-impregnated paper used in the present invention include kraft paper,
Linter paper, kraft paper, linter mixed paper, etc. are used.
As the resin-impregnated glass cloth, glass woven cloth, glass non-woven cloth, glass vapor, etc. are used, and the resins to be impregnated with these include phenol resin, melamine resin, epoxy resin, unsaturated polyester resin, cresol resin, and resin.
1 Imide resin, polyamide-imide resin, polybutadiene resin, polyamide resin, fluororesin, silicone resin polybutylene terephthalate resin, polyethylene terephthalate resin, polyphenylene sulfide resin, etc.
Although mixtures and modified products can be used, it is preferable to use epoxy resins due to the balance of heat resistance and strength.
type epoxy resin, novolac type epoxy resin, halogenated epoxy resin, glycidyl ester type epoxy resin,
Epoxy resins in general, such as polymeric epoxy resins and flexible epoxy resins, can be used. As the metal foil, a metal foil made of copper, iron, aluminum, nickel, zinc, etc. or an alloy can be used, and if necessary, a metal foil provided with an adhesive layer on one side can also be used. It is preferable that the difference in the amount of resin between the resin-impregnated glass cloth on the metal foil side and the opposite side of the metal foil is 5 to 201 itt% (hereinafter referred to as "Asahi") after drying. That is, if the thickness is less than 5 inches, it is difficult to improve the warpage, and if it exceeds 20 inches, the moldability tends to deteriorate. As the lamination molding means, a multi-stage press method, a press method, a multi-roll method, a pultrusion method, a pressureless to low pressure continuous molding method, a double belt method, etc. can be used, and there is no particular limitation.
以下本発明を実施例にもとづｂて説明する。The present invention will be explained below based on examples.
実施例
厚さ０．２１１１のクラフト紙に硬化剤含有エポキシ樹
脂ワニスを乾燥後の樹脂量が５０係になるように含浸、
乾燥してエポキシ樹脂含浸紙（以下プリプレグＡと称す
る）を得た。別に厚さｏ、ｉｓｍｘ、重量２０５９／ｄ
のガラス布に硬化剤含有エポキシ樹脂フエスを乾燥後の
樹脂量が４８壬になるように含浸、乾燥してエポキシ樹
脂含浸ガラス布（以下プリプレグＢと称す）を得た。更
に厚さ０．Ｌ８ｘｘ、 重」２０５ノβのガラス布に
硬化剤含有エポキシ樹脂ワニスを乾燥後の樹脂量が３４
チになるように含浸、乾燥してエポキシ樹脂含浸ガラス
布（以下プリプレグＣと称する）を得た。次にプリプレ
グＡ６枚の下面にプリプレグＣ１枚を配し、上面にプリ
プレ７３１枚を介して厚さ０．０３５朋の銅箔を配設し
た積層体を成形圧力４ｏＫｑ／ｃｄ、 １６５℃で１２
０分間積層成形して厚さ１．６ ｚｘの片面…張積層板
を得た。Example: Kraft paper with a thickness of 0.2111 was impregnated with an epoxy resin varnish containing a curing agent so that the amount of resin after drying was 50 parts.
It was dried to obtain epoxy resin-impregnated paper (hereinafter referred to as prepreg A). Thickness o, ismx, weight 2059/d
The glass cloth was impregnated with a curing agent-containing epoxy resin fuss so that the amount of resin after drying was 48 mm, and dried to obtain an epoxy resin-impregnated glass cloth (hereinafter referred to as prepreg B). Furthermore, the thickness is 0. L8xx, hardening agent-containing epoxy resin varnish applied to 205-β glass cloth after drying, the amount of resin is 34
The glass cloth was impregnated with the epoxy resin and dried to obtain an epoxy resin-impregnated glass cloth (hereinafter referred to as prepreg C). Next, a laminate in which one sheet of prepreg C was placed on the bottom surface of six sheets of prepreg A, and copper foil with a thickness of 0.035 mm was placed on the top surface through 731 sheets of prepreg was formed at a molding pressure of 4 kq/cd and at 165°C for 12 hours.
Lamination molding was performed for 0 minutes to obtain a single-sided laminate with a thickness of 1.6 zx.
実施例２
厚さ０．１１Ｈ１ｆｆ、重ｆｉｉ２０５ｆ／ゴのガラス
布に硬化剤含有エポキシ樹脂ワニスを乾燥後の樹脂ｈ１
が４４係になるように含浸、乾燥してエポキシ樹脂含浸
ガラス布（以下プリプレグＤと称する）を得た。別ｔこ
厚さ０．ｉｌｌｌｙｍ％重ｉｔ ２０５ ｋＭのガラス
布に硬化剤含有エポキシ樹脂ワニスを乾燥後の樹脂量が
３６憾になるように含浸、乾燥してエポキシ樹脂含浸ガ
ラス布（以下プリプレグＥと称する）を得た。次に実施
例１と同じプリプレグＡ６枚の下面にプリプレグ８１枚
を配し、上面にプリプレグＣ１枚を介して厚さ０，０３
５１ＥＩの銅箔を配設した積層体を成形圧力４０に９／
ｄ％ １６５℃で１２０分間積層成形して厚さ１．６ｆ
ｆの片面鋼張積層板を得た。Example 2 Resin h1 after drying hardening agent-containing epoxy resin varnish on a glass cloth with a thickness of 0.11H1ff and a heavy duty fii of 205f/g
It was impregnated so that the ratio was 44, and dried to obtain an epoxy resin-impregnated glass cloth (hereinafter referred to as prepreg D). Separate thickness: 0. A glass cloth having a weight of 205 kM was impregnated with an epoxy resin varnish containing a curing agent so that the amount of resin after drying was 36 kg, and dried to obtain an epoxy resin-impregnated glass cloth (hereinafter referred to as prepreg E). Next, 81 sheets of prepreg were arranged on the bottom surface of 6 sheets of prepreg A as in Example 1, and 1 sheet of prepreg C was placed on the top surface with a thickness of 0.03 mm.
A laminate with 51EI copper foil was molded at a molding pressure of 40%.
d% Laminate molding at 165℃ for 120 minutes to a thickness of 1.6f
A single-sided steel clad laminate of f was obtained.
比較例
厚さＱ、１８ｆｆｊ、重量２０５９７？ｎ’のガー７２
布に硬化剤含有エポキシ樹脂ワニスを乾燥後の樹脂量が
４（１になるように含浸、乾燥してエポキシ樹脂含浸ガ
ラス布（以下プリプレグＦと称する）を得た。次に実施
例１と同じプリプレグＡ６枚の上下面にプｊプレグＦを
夫々１枚づつ配し、更に上面に厚さ０．０３５ ｙｘｘ
の銅箔を配設した積層体を成形圧力４ｏＫｇ／ｄ 、
１６５℃テ１２０分間８層成形ｔ、ｒ厚すｉ、６ｎの片
面鋼張積層板を得た。Comparative example thickness Q, 18ffj, weight 20597? n' no gar 72
The cloth was impregnated with a curing agent-containing epoxy resin varnish so that the amount of resin after drying was 4 (1), and dried to obtain an epoxy resin-impregnated glass cloth (hereinafter referred to as prepreg F). Next, the same as in Example 1 was prepared. Arrange one sheet each of Prepreg F on the top and bottom surfaces of six sheets of Prepreg A, and further add a layer of 0.035 yxx thickness on the top surface.
A laminate with copper foil placed thereon was molded at a pressure of 4oKg/d,
A single-sided steel clad laminate having an 8-layer molding process at 165° C. for 120 minutes, a thickness of t, a thickness of r, and a thickness of 6n was obtained.
実施例１と２及び比較例の積層板の反り状態は第１表の
ようである。The warping states of the laminates of Examples 1 and 2 and Comparative Example are shown in Table 1.
注
※ 銅箔側を上にした状態で、銅箔側を内側とする凹状
反りを−反りと−ｂ１銅箔側を外側とする凸状反りを十
反りと論う。Note: With the copper foil side facing up, a concave warp with the copper foil side on the inside is considered a -b1 warp, and a convex warp with the copper foil side on the outside is considered a ten warp.
本発明は上述した如く構成されて因る。特許請求の範囲
第１項に記載した構成を有する電気用積層板においては
常態及びプリント配線板加工時の反りを著るしく減少さ
せる効果がある。The present invention is constructed as described above. The electrical laminate having the structure described in claim 1 has the effect of significantly reducing warpage in normal conditions and during printed wiring board processing.
Claims (1)
、更にその上面又は下面に金属箔を配設した積層体を積
層成形してなることを特徴とする電気用積層板において
、金属箔側樹脂含浸ガラス布の樹脂量を、金属箔反対側
の樹脂含浸ガラス布の樹脂量より多くしたことを特徴と
する電気用積層板。(1) An electrical laminate, characterized in that it is formed by laminating and molding a laminate in which resin-impregnated glass cloth is arranged on the upper and lower surfaces of resin-impregnated paper, and metal foil is further arranged on the upper or lower surface of the resin-impregnated paper, An electrical laminate characterized in that the amount of resin in the resin-impregnated glass cloth on the metal foil side is greater than the amount of resin in the resin-impregnated glass cloth on the opposite side of the metal foil.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22104388A JPH0269232A (en) | 1988-09-02 | 1988-09-02 | Laminated sheet for electricity |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22104388A JPH0269232A (en) | 1988-09-02 | 1988-09-02 | Laminated sheet for electricity |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0269232A true JPH0269232A (en) | 1990-03-08 |
Family
ID=16760595
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22104388A Pending JPH0269232A (en) | 1988-09-02 | 1988-09-02 | Laminated sheet for electricity |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0269232A (en) |
-
1988
- 1988-09-02 JP JP22104388A patent/JPH0269232A/en active Pending
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