JPH0266992A - Printed wiring board - Google Patents

Printed wiring board

Info

Publication number
JPH0266992A
JPH0266992A JP63218123A JP21812388A JPH0266992A JP H0266992 A JPH0266992 A JP H0266992A JP 63218123 A JP63218123 A JP 63218123A JP 21812388 A JP21812388 A JP 21812388A JP H0266992 A JPH0266992 A JP H0266992A
Authority
JP
Japan
Prior art keywords
pattern
printed
wiring
board
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP63218123A
Other languages
Japanese (ja)
Inventor
Yoshiaki Yazawa
矢沢 芳明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Seiki Co Ltd
Original Assignee
Nippon Seiki Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Seiki Co Ltd filed Critical Nippon Seiki Co Ltd
Priority to JP63218123A priority Critical patent/JPH0266992A/en
Priority to AT89308415T priority patent/ATE130997T1/en
Priority to DE68924943T priority patent/DE68924943T2/en
Priority to EP89308415A priority patent/EP0357307B1/en
Priority to CA000609575A priority patent/CA1303240C/en
Priority to KR1019890012400A priority patent/KR0158674B1/en
Publication of JPH0266992A publication Critical patent/JPH0266992A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

PURPOSE:To judge the deviation of a pattern accurately by printing a deviation detecting pattern for judging suitability of the allowance range of the printing pattern deviation in the vicinity of the cutting position of a board in each product region of each wiring pattern when screen printing of a wiring circuit pattern is performed. CONSTITUTION:A wiring pattern 2, a reference pattern 4 and deviation detecting patterns 5 and 5A are printed on the surface of a board 1 at the same time. A wiring pattern 2A is printed on the rear surface of the board 1. The wiring patterns 2 and 2A and the deviation detecting patterns 5 and 5A are covered with a mask pattern. A hole is provided at a part of the reference pattern, and reference hole 4A for pressing is formed. With the reference hole 4A as a reference, pressing is performed along cutting lines 3 and 3A for product regions at the same time. Thereafter, the sizes between the position of a cutting surface 7 of each printed wiring board 1A and the deviation detecting patterns 5 and 5A are confirmed, and the pass of fail of the printed wiring board 1 is judged. In this way, whether the deviated state of the pattern is within the specified value or not can be judged accurately and readily.

Description

【発明の詳細な説明】 [産業上の利用分野] 本発明はスクリーン印刷により形成された複数列の配線
パターンを有する印刷配線基板に関し、特にパターンず
れの検出に有効な印刷配線基板に関する。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a printed wiring board having a plurality of rows of wiring patterns formed by screen printing, and particularly to a printed wiring board that is effective in detecting pattern displacement.

[従来の技術] 一般に、たとえばスクリーン印刷によって印刷配線基板
を製造するには、スルーホール接続用の孔を形成し孔面
に銅めっきを施し、表裏面の複数列のレジスト回路パタ
ーンを印刷し、回路パターン以外の不必要部の銅をエツ
チングにより除去し、次にマスクパターンを印刷し、プ
レス抜き用の基準孔を形成し、プレス抜きを行なって複
数の印刷配線基板を得るようにしている。
[Prior Art] Generally, in order to manufacture a printed wiring board by screen printing, for example, holes for through-hole connections are formed, copper plating is applied to the hole surfaces, and multiple rows of resist circuit patterns are printed on the front and back surfaces. Copper in unnecessary areas other than the circuit pattern is removed by etching, then a mask pattern is printed, reference holes for press punching are formed, and press punching is performed to obtain a plurality of printed wiring boards.

この種のスクリーン印刷方式を用いて印刷配線基板を製
造するものはスクリーンの伸縮が配線パターンの寸法、
精度に影響するという問題がある。
When manufacturing printed wiring boards using this type of screen printing method, the expansion and contraction of the screen is the size of the wiring pattern.
There is a problem in that it affects accuracy.

[発明が解決しようとする課題] このようにスクリーン印刷方式を用いた場合、スクリー
ンは温度や湿度の関係で伸縮し易いとともに、1つのス
クリーンで使用する回数が多くなるとスクリーンが伸長
してしまうため、特に1つのスクリーンに複数列の配線
パターンを有するものにおいてパターンのずれを発生し
易い。
[Problems to be Solved by the Invention] When using the screen printing method as described above, the screen tends to expand and contract due to temperature and humidity, and if one screen is used many times, the screen will expand. In particular, when one screen has multiple rows of wiring patterns, pattern displacement is likely to occur.

従来、スクリーンの伸長によるパターンのずれは作業員
の目視により検査し、パターンのずれが大きい場合に新
しいスクリーンと交換するようにしている。しかし、パ
ターンのずれを目視によって正確に判別する手段がない
ためスクリーン交換時期を逸し、パターンのずれが許容
範囲を超えても伸長したスクリーンを使用しつづけるこ
とが多く、大量の不良品が発生するという問題があった
Conventionally, a worker visually inspects the pattern for deviation due to screen elongation, and if the pattern deviation is large, the screen is replaced with a new one. However, because there is no way to accurately visually determine the pattern deviation, the timing for screen replacement is often missed, and the stretched screen is often continued to be used even if the pattern deviation exceeds the allowable range, resulting in a large number of defective products. There was a problem.

そこで本発明はパターンのずれを簡単に判別できる安定
した印刷配線基板を提供することを目的とする。
Therefore, an object of the present invention is to provide a stable printed wiring board in which pattern deviation can be easily determined.

[課題を解決するための手段] 本発明はスクリーン印刷により印刷配線基板に配線回路
パターンを複数配列し、この各配線回路パターンに対応
する製品領域の周縁をプレス抜き加工によって切断する
印刷配線基板において、前記配線回路パターンのスクリ
ーン印刷時にプレス抜き位との基準を定めるための基準
パターンを前記印刷配線基板に設けるとともに、各配線
パターンにおける各製品領域の基板切断面位置の近辺に
印刷パターンずれの許容範囲の良否を判別するずれ検出
パターンを印刷して構成される。
[Means for Solving the Problems] The present invention provides a printed wiring board in which a plurality of wiring circuit patterns are arranged on the printed wiring board by screen printing, and the periphery of the product area corresponding to each wiring circuit pattern is cut by press punching. , a reference pattern is provided on the printed wiring board to determine a reference position for press punching when screen printing the wiring circuit pattern, and a printing pattern deviation is allowed in the vicinity of the board cutting surface position of each product area in each wiring pattern. It is constructed by printing a deviation detection pattern that determines whether the range is good or bad.

[作用] 上記構成によってプレス抜き後基板切断面の位置と検出
パターンの位置との間の基準寸法すなわち許容範囲内か
否かを判別してスクリーンを交換する基準としている。
[Operation] With the above configuration, it is determined whether or not the reference dimension between the position of the cut surface of the substrate after press punching and the position of the detection pattern is within the allowable range, and this is used as a criterion for replacing the screen.

[実施例] 以下、本発明の実施例を添付図面を参照して説明する。[Example] Embodiments of the present invention will be described below with reference to the accompanying drawings.

第1図乃至第5図はモータの制御回路用の印刷配線基板
を示しており、lは印刷配線基板であり、この基板1の
表面には第3図に示すように、第1図で示す配線パター
ン2が複数印刷され、裏面には第2図で示す配線パター
ン2Aが前記配線パターン2に対応して複数列印刷され
ている。3,3Aは一点鎖線で示した切断ラインであり
、この切断ライン3.3A内が製品領域である。4は配
線パターン2の円中心および三方に印刷されたプレス抜
き用基準孔の基準パターンであり、この基準パターン印
4部分を穿孔して基準孔4Aを形成するものである。5
は基板1表面の製品領域外周辺の外側に複数印刷された
ずれ検出パターン、5Aは製品領域内周辺の内側に複数
印刷されたずれ検出パターンであり、この実施例では各
ずれ検出パターン5,5Aは製品領域の中心からパター
ンずれの許容範囲に応じた間隔をおいて形成されている
。6はマスクパターンの外周ライン、6Aはその内周ラ
インを示し、外周ライン6と内周ライン6A内に印刷さ
れたマスクパターンによって配線パターン2,2Aおよ
び検出パターン5.5Aが被覆されている。
1 to 5 show a printed wiring board for a motor control circuit, l is a printed wiring board, and the surface of this board 1 has the lines shown in FIG. 1 as shown in FIG. A plurality of wiring patterns 2 are printed, and a plurality of rows of wiring patterns 2A shown in FIG. 2 are printed on the back surface corresponding to the wiring patterns 2. 3.3A is a cutting line indicated by a dashed line, and the area within this cutting line 3.3A is the product area. 4 is a reference pattern of reference holes for press punching printed on the center of the circle and on three sides of the wiring pattern 2, and the reference hole 4A is formed by drilling the reference pattern mark 4 portion. 5
5A is a plurality of displacement detection patterns printed on the outside of the periphery outside the product area on the surface of the substrate 1, and 5A is a plurality of displacement detection patterns printed on the inside of the periphery of the product area. In this embodiment, each of the displacement detection patterns 5, 5A are formed at intervals corresponding to the allowable range of pattern deviation from the center of the product area. Reference numeral 6 indicates the outer circumferential line of the mask pattern, and 6A indicates the inner circumferential line thereof. The wiring patterns 2, 2A and the detection pattern 5.5A are covered by the mask pattern printed within the outer circumferential line 6 and the inner circumferential line 6A.

そして、周知のスクリーン印刷法によって、基板lの表
面に配線パターン2と基準パターン4およびずれ検出パ
ターン5,5Aを同時に印刷するとともに、基板lの裏
面に配線パターン2Aを印刷し、各配線パターン2.2
Aおよびずれ検出パターン5,5Aをマスクパターンに
より核覆し、前記基準パターン4部分を穿孔してプレス
抜き用基準孔4Aを形成し、この基準孔4Aを基準にし
て各製品領域を同時に切断ライン3.3Aからプレス抜
きする。その後プレス抜きされた各印刷配線基板IAの
切断面7位置と前記ずれ検出パターン5,5Aとの間の
寸法を確認して製品となる印刷配線基板lAの良否を判
別する。そして、前記切断面7と検出パターン5.5A
との間隔すなわちパターンずれが許容範囲より大きいと
してスクリーンを新しいものに交換するようにしている
Then, by a well-known screen printing method, the wiring pattern 2, the reference pattern 4, and the deviation detection patterns 5, 5A are simultaneously printed on the front surface of the board 1, and the wiring pattern 2A is printed on the back surface of the board 1, and each wiring pattern 2 .2
A and the deviation detection patterns 5, 5A are covered with a mask pattern, the reference pattern 4 portion is punched to form a reference hole 4A for press punching, and each product area is simultaneously cut along the cutting line 3 using this reference hole 4A as a reference. .Press out from 3A. Thereafter, the dimensions between the cut surface 7 position of each printed wiring board IA pressed out and the deviation detection patterns 5, 5A are checked to determine whether the printed wiring board IA to be a product is good or bad. Then, the cut surface 7 and the detection pattern 5.5A
The screen is replaced with a new one because the gap between the screen and the screen, that is, the pattern deviation, is larger than the allowable range.

このように、上記実施例においては、複数列の配線パタ
ーン2の周辺にパターンずれの許容範囲に対応して検出
パターン5.5Aを設けて印刷配線基板1を構成してい
るため、プレス抜き後各印刷配線基板IAの切断面7位
置と検出パターン5.5Aとの間隔を確認するだけでパ
ターンずれ状態が規格内か否かの判断を正確かつ容易に
行なうことができ、これによってスクリーンの交換時期
を逸することがない。
In this way, in the above embodiment, since the printed wiring board 1 is constructed by providing the detection pattern 5.5A around the plurality of rows of wiring patterns 2 in accordance with the allowable range of pattern deviation, Just by checking the distance between the cut surface 7 position of each printed wiring board IA and the detection pattern 5.5A, it is possible to accurately and easily judge whether the pattern misalignment is within the standard, and this allows the screen to be replaced. Never miss a time.

なお、本発明は上記実施例に限定されるものではなく、
本発明の要旨の範囲内において種々の変形実施が可能で
ある0例えば検出パターンは製品領域の外周辺または内
周辺の一方に設ければよく、その検出パターンは製品領
域の全周辺に設けてもよく、あるいは周辺に複数設ける
ようにしてもよい。
Note that the present invention is not limited to the above embodiments,
Various modifications are possible within the scope of the gist of the present invention. For example, the detection pattern may be provided on either the outer periphery or the inner periphery of the product area, or the detection pattern may be provided on the entire periphery of the product area. Alternatively, a plurality of them may be provided around the area.

[発明の効果] 本発明はスクリーン印刷により印刷配線基板に配線回路
パターンを複数配列し、この各配線回路パターンに対応
する製品領域の周縁をプレス抜き加工によって切断する
印刷配線基板において、前記配線回路パターンのスクリ
ーン印刷時にプレス抜き位置の基準を定めるための基準
パターンを前記印刷配線基板に設けるとともに、各配線
パターンにおける各製品領域の基板切断面位置の近辺に
印刷パターンずれの許容範囲の良否を判別するずれ検出
パターンを印刷する・ことにより、パターンのずれを正
確に判別することが可能な印刷配線基板を提供できる。
[Effects of the Invention] The present invention provides a printed wiring board in which a plurality of wiring circuit patterns are arranged on the printed wiring board by screen printing, and the periphery of a product area corresponding to each wiring circuit pattern is cut by press punching. A reference pattern is provided on the printed wiring board to determine the reference position of the press punching position during screen printing of the pattern, and the acceptability of the printed pattern deviation in the vicinity of the board cutting surface position of each product area in each wiring pattern is determined. By printing a misalignment detection pattern, it is possible to provide a printed wiring board that can accurately determine pattern misalignment.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図乃至第5図は本発明の実施例を示し、第1図は基
板の表面に印刷されたパターンを示す正面図、第2図は
基板の裏面に印刷されたパターンを示す正面図、第3図
は複数列に印刷されたパターンを示す正面図、第4図は
プレス抜きされた印刷配線基板の正面図、第5図はプレ
ス抜き後のブランクの正面図である。 2。 4 ・ 5 。 ・印刷配線基板 2A−・配線パターン ・基準パターン 5A・・検出パターン ・切断面 特 許 出 願 人 日 本 精 機 株 式 手続補正帯(自発) 平成1年8月17日 ■、事件の名称 昭和63年特許願第218123号 2、発明の名称 印刷配線基板 3、補正をする者
1 to 5 show embodiments of the present invention, FIG. 1 is a front view showing a pattern printed on the front surface of a substrate, FIG. 2 is a front view showing a pattern printed on the back surface of a substrate, FIG. 3 is a front view showing patterns printed in a plurality of rows, FIG. 4 is a front view of a printed wiring board that has been press-cut, and FIG. 5 is a front view of the blank after press-cut. 2. 4.5.・Printed wiring board 2A-・Wiring pattern・Reference pattern 5A・・Detection pattern・Cut surface Patent applicant Nippon Seiki stock procedure correction band (voluntary) August 17, 1999■, Name of case 1986 Patent Application No. No. 218123 2, Name of the invention Printed wiring board 3, Person making the amendment

Claims (1)

【特許請求の範囲】[Claims] (1)スクリーン印刷により印刷配線基板に配線回路パ
ターンを複数配列し、この各配線回路パターンに対応す
る製品領域の周縁をプレス抜き加工によって切断する印
刷配線基板において、前記配線回路パターンのスクリー
ン印刷時にプレス抜き位置の基準を定めるための基準パ
ターンを前記印刷配線基板に設けるとともに、各配線パ
ターンにおける各製品領域の基板切断面位置の近辺に印
刷パターンずれの許容範囲の良否を判別するずれ検出パ
ターンを印刷したことを特徴とする印刷配線基板。
(1) In a printed wiring board in which a plurality of wiring circuit patterns are arranged on a printed wiring board by screen printing, and the periphery of a product area corresponding to each wiring circuit pattern is cut by press punching, when the wiring circuit pattern is screen printed, A reference pattern is provided on the printed wiring board for determining the reference position of the press punching position, and a deviation detection pattern is provided in the vicinity of the board cutting surface position of each product area in each wiring pattern to determine whether or not the allowable range of printing pattern deviation is acceptable. A printed wiring board characterized by printing.
JP63218123A 1988-08-31 1988-08-31 Printed wiring board Pending JPH0266992A (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP63218123A JPH0266992A (en) 1988-08-31 1988-08-31 Printed wiring board
AT89308415T ATE130997T1 (en) 1988-08-31 1989-08-18 PRINTED CIRCUIT BOARD.
DE68924943T DE68924943T2 (en) 1988-08-31 1989-08-18 Printed circuit board.
EP89308415A EP0357307B1 (en) 1988-08-31 1989-08-18 Printed-wiring board
CA000609575A CA1303240C (en) 1988-08-31 1989-08-28 Printed-wiring board
KR1019890012400A KR0158674B1 (en) 1988-08-31 1989-08-30 Printed wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63218123A JPH0266992A (en) 1988-08-31 1988-08-31 Printed wiring board

Publications (1)

Publication Number Publication Date
JPH0266992A true JPH0266992A (en) 1990-03-07

Family

ID=16714991

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63218123A Pending JPH0266992A (en) 1988-08-31 1988-08-31 Printed wiring board

Country Status (2)

Country Link
JP (1) JPH0266992A (en)
KR (1) KR0158674B1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100467051B1 (en) * 2001-12-31 2005-01-24 한국조폐공사 Panchromatic material of intaglio plate ink for Super Orlof Intaglio and intaglio plate ink containing the same

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57194303A (en) * 1981-05-26 1982-11-29 Oki Electric Ind Co Ltd Discrimination method for defective and non-defective of thick film ceramic substrate

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57194303A (en) * 1981-05-26 1982-11-29 Oki Electric Ind Co Ltd Discrimination method for defective and non-defective of thick film ceramic substrate

Also Published As

Publication number Publication date
KR0158674B1 (en) 1998-12-15
KR900004227A (en) 1990-03-27

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