JPH026364A - 圧電材料組成物 - Google Patents
圧電材料組成物Info
- Publication number
- JPH026364A JPH026364A JP63143297A JP14329788A JPH026364A JP H026364 A JPH026364 A JP H026364A JP 63143297 A JP63143297 A JP 63143297A JP 14329788 A JP14329788 A JP 14329788A JP H026364 A JPH026364 A JP H026364A
- Authority
- JP
- Japan
- Prior art keywords
- piezoelectric
- composition
- dielectric constant
- constant
- coupling coefficient
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Compositions Of Oxide Ceramics (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63143297A JPH026364A (ja) | 1988-06-09 | 1988-06-09 | 圧電材料組成物 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63143297A JPH026364A (ja) | 1988-06-09 | 1988-06-09 | 圧電材料組成物 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH026364A true JPH026364A (ja) | 1990-01-10 |
JPH0566896B2 JPH0566896B2 (enrdf_load_stackoverflow) | 1993-09-22 |
Family
ID=15335468
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP63143297A Granted JPH026364A (ja) | 1988-06-09 | 1988-06-09 | 圧電材料組成物 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH026364A (enrdf_load_stackoverflow) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1637508A2 (en) | 2004-08-25 | 2006-03-22 | Ngk Insulators, Ltd. | Dielectric composition and dielectric film element |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8687349B2 (en) | 2010-07-21 | 2014-04-01 | Teradyne, Inc. | Bulk transfer of storage devices using manual loading |
US9001456B2 (en) | 2010-08-31 | 2015-04-07 | Teradyne, Inc. | Engaging test slots |
US9459312B2 (en) | 2013-04-10 | 2016-10-04 | Teradyne, Inc. | Electronic assembly test system |
US10845410B2 (en) | 2017-08-28 | 2020-11-24 | Teradyne, Inc. | Automated test system having orthogonal robots |
US10948534B2 (en) | 2017-08-28 | 2021-03-16 | Teradyne, Inc. | Automated test system employing robotics |
US11226390B2 (en) | 2017-08-28 | 2022-01-18 | Teradyne, Inc. | Calibration process for an automated test system |
US10983145B2 (en) | 2018-04-24 | 2021-04-20 | Teradyne, Inc. | System for testing devices inside of carriers |
US10775408B2 (en) | 2018-08-20 | 2020-09-15 | Teradyne, Inc. | System for testing devices inside of carriers |
-
1988
- 1988-06-09 JP JP63143297A patent/JPH026364A/ja active Granted
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1637508A2 (en) | 2004-08-25 | 2006-03-22 | Ngk Insulators, Ltd. | Dielectric composition and dielectric film element |
EP1637508A3 (en) * | 2004-08-25 | 2009-08-26 | Ngk Insulators, Ltd. | Dielectric composition and dielectric film element |
Also Published As
Publication number | Publication date |
---|---|
JPH0566896B2 (enrdf_load_stackoverflow) | 1993-09-22 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
LAPS | Cancellation because of no payment of annual fees |