JPH0263577U - - Google Patents
Info
- Publication number
- JPH0263577U JPH0263577U JP14290488U JP14290488U JPH0263577U JP H0263577 U JPH0263577 U JP H0263577U JP 14290488 U JP14290488 U JP 14290488U JP 14290488 U JP14290488 U JP 14290488U JP H0263577 U JPH0263577 U JP H0263577U
- Authority
- JP
- Japan
- Prior art keywords
- mold
- molding
- jig
- multilayer copper
- jig plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14290488U JPH0263577U (OSRAM) | 1988-10-31 | 1988-10-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14290488U JPH0263577U (OSRAM) | 1988-10-31 | 1988-10-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0263577U true JPH0263577U (OSRAM) | 1990-05-11 |
Family
ID=31409246
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14290488U Pending JPH0263577U (OSRAM) | 1988-10-31 | 1988-10-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0263577U (OSRAM) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004028775A1 (ja) * | 2002-09-25 | 2004-04-08 | Matsushita Electric Works, Ltd. | 積層板の製造方法および積層板製造用ずれ防止装置 |
-
1988
- 1988-10-31 JP JP14290488U patent/JPH0263577U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004028775A1 (ja) * | 2002-09-25 | 2004-04-08 | Matsushita Electric Works, Ltd. | 積層板の製造方法および積層板製造用ずれ防止装置 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP0411142B1 (en) | Outer layer material of multilayer printed wiring board and production thereof | |
| EP0032932A1 (en) | Backup material and method for drilling | |
| JPH0564097B2 (OSRAM) | ||
| DE4208610C1 (en) | Rigid-flexible PCB with flexible circuit foil mfg. - having flexible PCB in flexible region with fracture lines in rigid outer layers along rigid-flexible transition allowing rigid part to be removed along fracture lines after processing | |
| JPH0263577U (OSRAM) | ||
| JPH05343847A (ja) | 多層印刷配線板の製造方法 | |
| KR100366411B1 (ko) | 다층 인쇄회로기판 및 그 제조방법 | |
| JPH11112149A (ja) | 多層プリント配線板 | |
| JPH0434993A (ja) | 可撓部を有する多層プリント配線板の製造方法 | |
| JPS62269391A (ja) | プリント配線板の製造方法 | |
| JP3612972B2 (ja) | フラットケーブル接合体 | |
| JP2764750B2 (ja) | 多層基板の製造方法 | |
| JP2762604B2 (ja) | 多層プリント配線板の積層方法 | |
| CN109348629B (zh) | 一种制作凸台pcb的加工方法 | |
| JPS5968995A (ja) | 多層配線板の製造方法 | |
| JPH02241091A (ja) | 多層積層板の積層方法 | |
| KR200267933Y1 (ko) | 다층인쇄회로기판 | |
| JP2001199005A (ja) | 銅箔積層体、銅箔積層体の製造方法及びプリント回路基板の製造方法 | |
| KR20020023888A (ko) | 다층인쇄회로기판 및 그 제조 방법 | |
| JPH0249494A (ja) | 多層プリント配線板の製造方法 | |
| JPS58148969U (ja) | 多層接着用固定治具 | |
| CN1427661A (zh) | 具有阶梯式高密度互连结构的印刷电路板的制造方法 | |
| JP2002261438A (ja) | プリント配線板の製造方法 | |
| JPS6125547B2 (OSRAM) | ||
| JPS586686Y2 (ja) | 銅張積層板 |