JPH0260275U - - Google Patents
Info
- Publication number
- JPH0260275U JPH0260275U JP14061088U JP14061088U JPH0260275U JP H0260275 U JPH0260275 U JP H0260275U JP 14061088 U JP14061088 U JP 14061088U JP 14061088 U JP14061088 U JP 14061088U JP H0260275 U JPH0260275 U JP H0260275U
- Authority
- JP
- Japan
- Prior art keywords
- base material
- insulating base
- wiring board
- printed wiring
- exposed portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 239000004020 conductor Substances 0.000 description 2
- 239000012212 insulator Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Description
第１図ａ及びｂはそれぞれ本考案の第１の実施
例の平面図及びＡ―Ａ′線断面図、第２図は本考
案の第２の実施例の平面図、第３図は従来の印刷
配線板の一例の断面図である。
１……絶縁基材、２……導体、３……端子導体
、４……絶縁樹脂被膜、５……絶縁体、６……面
取り部、７……外周端部。
Figures 1a and b are a plan view and a sectional view taken along line A-A' of the first embodiment of the present invention, Figure 2 is a plan view of the second embodiment of the present invention, and Figure 3 is a conventional FIG. 2 is a cross-sectional view of an example of a printed wiring board. DESCRIPTION OF SYMBOLS 1... Insulating base material, 2... Conductor, 3... Terminal conductor, 4... Insulating resin coating, 5... Insulator, 6... Chamfered portion, 7... Outer peripheral end.
Claims (1)
形成した絶縁基材露出部を有する外部接続用端子
を備える印刷配線板において、少くとも前記絶縁
基材露出部の表面に設ける絶縁性の被膜を有する
ことを特徴とする印刷配線板。 In a printed wiring board comprising an external connection terminal having an exposed portion of the insulating base material formed in a wedge shape on the outer periphery of the insulating base material, an insulating property provided on at least the surface of the exposed portion of the insulating base material. A printed wiring board characterized by having a coating of.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14061088U JPH0260275U (en) | 1988-10-27 | 1988-10-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14061088U JPH0260275U (en) | 1988-10-27 | 1988-10-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0260275U true JPH0260275U (en) | 1990-05-02 |
Family
ID=31404939
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14061088U Pending JPH0260275U (en) | 1988-10-27 | 1988-10-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0260275U (en) |
-
1988
- 1988-10-27 JP JP14061088U patent/JPH0260275U/ja active Pending