JPS61153278U - - Google Patents
Info
- Publication number
- JPS61153278U JPS61153278U JP1985036587U JP3658785U JPS61153278U JP S61153278 U JPS61153278 U JP S61153278U JP 1985036587 U JP1985036587 U JP 1985036587U JP 3658785 U JP3658785 U JP 3658785U JP S61153278 U JPS61153278 U JP S61153278U
- Authority
- JP
- Japan
- Prior art keywords
- flexible cable
- substrate
- contact portion
- conductor
- multilayer structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 3
- 239000012212 insulator Substances 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 3
Landscapes
- Accessory Devices And Overall Control Thereof (AREA)
- Electronic Switches (AREA)
- Multi-Conductor Connections (AREA)
- Combinations Of Printed Boards (AREA)
Description
第１図は基板２にフレキシブルケーブル１をオ
ーバラツプさせたところを示す平面説明図、第２
図は第１図Ａ―Ａ′断面を示す説明図、第３図は
基板とフレキシブルケーブルとの別の実施例を示
す平面説明図、第４図は第３図Ｂ―Ｂ′断面を示
す説明図である。
１……フレキシブルケーブル、１１……ベース
、１２……第１導電体、１３……中間絶縁物、１
４……第２導電体、１５……カバー、２……基板
、２１，２２……リード、２１′，２２′……コ
ンタクト部。
Figure 1 is an explanatory plan view showing the flexible cable 1 overlapped with the board 2;
The figures are an explanatory diagram showing a cross section along line A-A' in Figure 1, Figure 3 is an explanatory plan view showing another embodiment of the board and flexible cable, and Figure 4 is an explanatory diagram showing a cross section along line B-B' in Figure 3. It is a diagram. DESCRIPTION OF SYMBOLS 1... Flexible cable, 11... Base, 12... First conductor, 13... Intermediate insulator, 1
4...Second conductor, 15...Cover, 2...Substrate, 21, 22...Lead, 21', 22'...Contact portion.
Claims (1)
毎に絶縁物をそれぞれ介在させて多層構造を形成
すると共に、前記多層構造に形成された導電体の
一端を階段状に露出させたフレキシブルケーブル
と、 前記フレキシブルケーブルの端部形状に対応す
るようなコンタクト部を備えた基板とを重ね合わ
せて、前記フレキシブルケーブルの露出させた導
電体の一端と前記基板のコンタクト部とを電気的
に接続したことを特徴とする基板とフレキシブル
ケーブルの接続構造。[Claims for Utility Model Registration] A multilayer structure is formed by interposing an insulator for each of a plurality of conductors through which different signals are transmitted, and one end of the conductor formed in the multilayer structure is formed into a stepped shape. The exposed flexible cable and a substrate having a contact portion corresponding to the end shape of the flexible cable are overlapped, and one end of the exposed conductor of the flexible cable is connected to the contact portion of the substrate. A connection structure between a board and a flexible cable, characterized by electrical connection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985036587U JPS61153278U (en) | 1985-03-13 | 1985-03-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985036587U JPS61153278U (en) | 1985-03-13 | 1985-03-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61153278U true JPS61153278U (en) | 1986-09-22 |
Family
ID=30541910
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985036587U Pending JPS61153278U (en) | 1985-03-13 | 1985-03-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61153278U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03101072A (en) * | 1989-09-13 | 1991-04-25 | Alps Electric Co Ltd | Terminal connection structure of thermal head |
| JPH06267632A (en) * | 1992-11-16 | 1994-09-22 | Internatl Business Mach Corp <Ibm> | Optical module |
| WO2011062061A1 (en) * | 2009-11-17 | 2011-05-26 | コニカミノルタＩｊ株式会社 | Method for manufacturing inkjet head |
| JP2012116042A (en) * | 2010-11-30 | 2012-06-21 | Kyocera Corp | Thermal head |
| JP2012209436A (en) * | 2011-03-30 | 2012-10-25 | Fujifilm Corp | Connection structure of flexible wiring circuit board and method for connecting the same |
-
1985
- 1985-03-13 JP JP1985036587U patent/JPS61153278U/ja active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03101072A (en) * | 1989-09-13 | 1991-04-25 | Alps Electric Co Ltd | Terminal connection structure of thermal head |
| JPH06267632A (en) * | 1992-11-16 | 1994-09-22 | Internatl Business Mach Corp <Ibm> | Optical module |
| WO2011062061A1 (en) * | 2009-11-17 | 2011-05-26 | コニカミノルタＩｊ株式会社 | Method for manufacturing inkjet head |
| JP2012116042A (en) * | 2010-11-30 | 2012-06-21 | Kyocera Corp | Thermal head |
| JP2012209436A (en) * | 2011-03-30 | 2012-10-25 | Fujifilm Corp | Connection structure of flexible wiring circuit board and method for connecting the same |