JPH0259677A - 電子ビームを用いた非接触試験方法 - Google Patents
電子ビームを用いた非接触試験方法Info
- Publication number
- JPH0259677A JPH0259677A JP88211420A JP21142088A JPH0259677A JP H0259677 A JPH0259677 A JP H0259677A JP 88211420 A JP88211420 A JP 88211420A JP 21142088 A JP21142088 A JP 21142088A JP H0259677 A JPH0259677 A JP H0259677A
- Authority
- JP
- Japan
- Prior art keywords
- electron beam
- voltage
- measured
- pattern
- measurement
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000010894 electron beam technology Methods 0.000 title claims abstract description 40
- 238000012360 testing method Methods 0.000 title claims abstract description 14
- 238000005259 measurement Methods 0.000 claims abstract description 21
- 238000000034 method Methods 0.000 claims abstract description 19
- 230000001133 acceleration Effects 0.000 claims abstract description 5
- 238000002347 injection Methods 0.000 claims description 4
- 239000007924 injection Substances 0.000 claims description 4
- 230000001678 irradiating effect Effects 0.000 claims description 3
- 238000010998 test method Methods 0.000 claims description 3
- 229910021420 polycrystalline silicon Inorganic materials 0.000 abstract description 12
- 229920005591 polysilicon Polymers 0.000 abstract description 12
- 238000007689 inspection Methods 0.000 abstract description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract description 4
- 229910052710 silicon Inorganic materials 0.000 abstract description 4
- 239000010703 silicon Substances 0.000 abstract description 4
- 239000000758 substrate Substances 0.000 abstract description 4
- 238000004148 unit process Methods 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 8
- 239000003990 capacitor Substances 0.000 description 7
- 230000005856 abnormality Effects 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000000523 sample Substances 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 230000001066 destructive effect Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 238000007726 management method Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
Landscapes
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
- Measurement Of Current Or Voltage (AREA)
- Testing Electric Properties And Detecting Electric Faults (AREA)
- Tests Of Electronic Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP88211420A JPH0259677A (ja) | 1988-08-25 | 1988-08-25 | 電子ビームを用いた非接触試験方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP88211420A JPH0259677A (ja) | 1988-08-25 | 1988-08-25 | 電子ビームを用いた非接触試験方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0259677A true JPH0259677A (ja) | 1990-02-28 |
| JPH0587789B2 JPH0587789B2 (de) | 1993-12-17 |
Family
ID=16605661
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP88211420A Granted JPH0259677A (ja) | 1988-08-25 | 1988-08-25 | 電子ビームを用いた非接触試験方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0259677A (de) |
-
1988
- 1988-08-25 JP JP88211420A patent/JPH0259677A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0587789B2 (de) | 1993-12-17 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20071217 Year of fee payment: 14 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20081217 Year of fee payment: 15 |
|
| EXPY | Cancellation because of completion of term | ||
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20081217 Year of fee payment: 15 |