JPH0258921U - - Google Patents

Info

Publication number
JPH0258921U
JPH0258921U JP13662188U JP13662188U JPH0258921U JP H0258921 U JPH0258921 U JP H0258921U JP 13662188 U JP13662188 U JP 13662188U JP 13662188 U JP13662188 U JP 13662188U JP H0258921 U JPH0258921 U JP H0258921U
Authority
JP
Japan
Prior art keywords
upper mold
plate
bolt insertion
mold
insertion hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13662188U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0614993Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988136621U priority Critical patent/JPH0614993Y2/ja
Publication of JPH0258921U publication Critical patent/JPH0258921U/ja
Application granted granted Critical
Publication of JPH0614993Y2 publication Critical patent/JPH0614993Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP1988136621U 1988-10-18 1988-10-18 電子部品の樹脂封止成形装置 Expired - Lifetime JPH0614993Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988136621U JPH0614993Y2 (ja) 1988-10-18 1988-10-18 電子部品の樹脂封止成形装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988136621U JPH0614993Y2 (ja) 1988-10-18 1988-10-18 電子部品の樹脂封止成形装置

Publications (2)

Publication Number Publication Date
JPH0258921U true JPH0258921U (US08063081-20111122-C00044.png) 1990-04-27
JPH0614993Y2 JPH0614993Y2 (ja) 1994-04-20

Family

ID=31397299

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988136621U Expired - Lifetime JPH0614993Y2 (ja) 1988-10-18 1988-10-18 電子部品の樹脂封止成形装置

Country Status (1)

Country Link
JP (1) JPH0614993Y2 (US08063081-20111122-C00044.png)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04135805A (ja) * 1990-09-28 1992-05-11 Fanuc Ltd プラテンに対する金型の固定方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58136426A (ja) * 1982-02-08 1983-08-13 Yamada Seisakusho:Kk トランスフアー成形機の金型位置決め方法
JPS62109612A (ja) * 1985-11-08 1987-05-20 Fujitsu Ltd モ−ルド型の固定方法
JPS62159613U (US08063081-20111122-C00044.png) * 1986-03-29 1987-10-09
JPS62183931U (US08063081-20111122-C00044.png) * 1986-05-09 1987-11-21

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58136426A (ja) * 1982-02-08 1983-08-13 Yamada Seisakusho:Kk トランスフアー成形機の金型位置決め方法
JPS62109612A (ja) * 1985-11-08 1987-05-20 Fujitsu Ltd モ−ルド型の固定方法
JPS62159613U (US08063081-20111122-C00044.png) * 1986-03-29 1987-10-09
JPS62183931U (US08063081-20111122-C00044.png) * 1986-05-09 1987-11-21

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04135805A (ja) * 1990-09-28 1992-05-11 Fanuc Ltd プラテンに対する金型の固定方法

Also Published As

Publication number Publication date
JPH0614993Y2 (ja) 1994-04-20

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