JPH0258853A - 厚膜集積回路およびその製造方法 - Google Patents

厚膜集積回路およびその製造方法

Info

Publication number
JPH0258853A
JPH0258853A JP63210344A JP21034488A JPH0258853A JP H0258853 A JPH0258853 A JP H0258853A JP 63210344 A JP63210344 A JP 63210344A JP 21034488 A JP21034488 A JP 21034488A JP H0258853 A JPH0258853 A JP H0258853A
Authority
JP
Japan
Prior art keywords
conductor
thick film
film
resist layer
conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP63210344A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0480539B2 (enExample
Inventor
Hideki Shibuya
渋谷　秀樹
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Chemi Con Corp
Original Assignee
Nippon Chemi Con Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Chemi Con Corp filed Critical Nippon Chemi Con Corp
Priority to JP63210344A priority Critical patent/JPH0258853A/ja
Publication of JPH0258853A publication Critical patent/JPH0258853A/ja
Publication of JPH0480539B2 publication Critical patent/JPH0480539B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Manufacturing Of Printed Wiring (AREA)
  • Wire Bonding (AREA)
JP63210344A 1988-08-24 1988-08-24 厚膜集積回路およびその製造方法 Granted JPH0258853A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63210344A JPH0258853A (ja) 1988-08-24 1988-08-24 厚膜集積回路およびその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63210344A JPH0258853A (ja) 1988-08-24 1988-08-24 厚膜集積回路およびその製造方法

Publications (2)

Publication Number Publication Date
JPH0258853A true JPH0258853A (ja) 1990-02-28
JPH0480539B2 JPH0480539B2 (enExample) 1992-12-18

Family

ID=16587850

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63210344A Granted JPH0258853A (ja) 1988-08-24 1988-08-24 厚膜集積回路およびその製造方法

Country Status (1)

Country Link
JP (1) JPH0258853A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5907488A (en) * 1990-02-14 1999-05-25 Hitachi, Ltd. Method of evaluating easiness of works and processings performed on articles and evaluation apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5907488A (en) * 1990-02-14 1999-05-25 Hitachi, Ltd. Method of evaluating easiness of works and processings performed on articles and evaluation apparatus

Also Published As

Publication number Publication date
JPH0480539B2 (enExample) 1992-12-18

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