JPH0258800B2 - - Google Patents
Info
- Publication number
- JPH0258800B2 JPH0258800B2 JP63286776A JP28677688A JPH0258800B2 JP H0258800 B2 JPH0258800 B2 JP H0258800B2 JP 63286776 A JP63286776 A JP 63286776A JP 28677688 A JP28677688 A JP 28677688A JP H0258800 B2 JPH0258800 B2 JP H0258800B2
- Authority
- JP
- Japan
- Prior art keywords
- positioning
- lead
- mounting
- rod
- pressing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000000034 method Methods 0.000 claims description 16
- 210000000078 claw Anatomy 0.000 description 16
- 238000003780 insertion Methods 0.000 description 4
- 230000037431 insertion Effects 0.000 description 4
- 230000032258 transport Effects 0.000 description 4
- 230000006835 compression Effects 0.000 description 3
- 238000007906 compression Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Landscapes
- Supply And Installment Of Electrical Components (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63286776A JPH02133999A (ja) | 1988-11-15 | 1988-11-15 | Ic位置決め方法およびそのためのic位置決め装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63286776A JPH02133999A (ja) | 1988-11-15 | 1988-11-15 | Ic位置決め方法およびそのためのic位置決め装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02133999A JPH02133999A (ja) | 1990-05-23 |
| JPH0258800B2 true JPH0258800B2 (enExample) | 1990-12-10 |
Family
ID=17708902
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63286776A Granted JPH02133999A (ja) | 1988-11-15 | 1988-11-15 | Ic位置決め方法およびそのためのic位置決め装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02133999A (enExample) |
-
1988
- 1988-11-15 JP JP63286776A patent/JPH02133999A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02133999A (ja) | 1990-05-23 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5839186A (en) | Component attracted state detecting system for component mounting machine | |
| US5222293A (en) | System for placing an object on a carrier and method | |
| EP1648026B1 (en) | Thin plate supporting container clamping device | |
| JPH0258800B2 (enExample) | ||
| JPH11239925A (ja) | 部品装着装置及び方法 | |
| JPH06182965A (ja) | クリームはんだ印刷装置 | |
| JP3969819B2 (ja) | 位置合わせ方法及び位置合わせ装置 | |
| JP2575717B2 (ja) | 半導体基板または液晶基板の搬送装置 | |
| JP2560042B2 (ja) | 半導体ウエハのマウント装置 | |
| JPH0964085A (ja) | ボンディング方法 | |
| JPH0544022B2 (enExample) | ||
| JP2547212Y2 (ja) | 基板用測定装置 | |
| JPH0422813B2 (enExample) | ||
| JPH10160631A (ja) | 液晶パネルのアライメント装置 | |
| JP4239049B2 (ja) | 部品装着装置及びその装置における撮像手段の光軸オフセット量測定方法 | |
| JP3405377B2 (ja) | ワークのハンドリング装置 | |
| KR100465785B1 (ko) | Pcb용 납땜검사장치 | |
| JPH07270117A (ja) | 電子部品の観察装置 | |
| CN223198468U (zh) | 一种压件往复式组装装置 | |
| JP2002261152A (ja) | カセットの位置検出方法及び装置 | |
| US6178833B1 (en) | Electronic parts loading device | |
| JPH08262090A (ja) | 液晶表示体用基板の検査装置 | |
| JPS61244417A (ja) | 部品取付装置における基板移動位置決め機構 | |
| JPS62293799A (ja) | プリント基板へのクリ−ム半田印刷方法 | |
| JP2627978B2 (ja) | ボンディング装置 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| S531 | Written request for registration of change of domicile |
Free format text: JAPANESE INTERMEDIATE CODE: R313531 |
|
| R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20081210 Year of fee payment: 18 |
|
| EXPY | Cancellation because of completion of term |