JPH0258341U - - Google Patents
Info
- Publication number
- JPH0258341U JPH0258341U JP13740288U JP13740288U JPH0258341U JP H0258341 U JPH0258341 U JP H0258341U JP 13740288 U JP13740288 U JP 13740288U JP 13740288 U JP13740288 U JP 13740288U JP H0258341 U JPH0258341 U JP H0258341U
- Authority
- JP
- Japan
- Prior art keywords
- die
- cover
- pad
- semiconductor device
- polyimide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 3
- 239000004642 Polyimide Substances 0.000 claims description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 2
- 229910052782 aluminium Inorganic materials 0.000 claims description 2
- 229920001721 polyimide Polymers 0.000 claims description 2
- 239000000463 material Substances 0.000 claims 1
- 239000011368 organic material Substances 0.000 claims 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図は本考案の半導体装置の縦断面図、第２
図は従来の半導体装置の縦断面図である。 １……ポリイミド、２……ダイ、３……アルミ
電極パツド、４……樹脂、５……ボンデイングワ
イヤー、６……リード、７……ダイ側面、８……
ダイパツド。
図は従来の半導体装置の縦断面図である。 １……ポリイミド、２……ダイ、３……アルミ
電極パツド、４……樹脂、５……ボンデイングワ
イヤー、６……リード、７……ダイ側面、８……
ダイパツド。
Claims (1)
- ワイヤーボンデイング後に、ポリイミド等の柔
軟で絶縁性に優れた有機材料を塗布し、ダイ表面
とアルミニウム電極パツドとを完全に前記有機材
料で覆うとともに、ダイ側面のＳｉ面からダイパ
ツドまでも上記材料で覆つたことを特徴とする半
導体装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13740288U JPH0258341U (ja) | 1988-10-20 | 1988-10-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13740288U JPH0258341U (ja) | 1988-10-20 | 1988-10-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0258341U true JPH0258341U (ja) | 1990-04-26 |
Family
ID=31398793
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13740288U Pending JPH0258341U (ja) | 1988-10-20 | 1988-10-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0258341U (ja) |
-
1988
- 1988-10-20 JP JP13740288U patent/JPH0258341U/ja active Pending