JPH0256923A - Treatment apparatus - Google Patents

Abstract

PURPOSE:To stabilize the supply of liquid treatment agent by a method wherein a circumferential trench formed in the circumferential wall of a cup, a plurality of nozzles whose one side ends are connected to a liquid treatment agent supply source and whose other ends are linked with the circumferential trench with a predetermined interval and a partition provided vertically along the inner circumferential wall of the cup are provided. CONSTITUTION:A number of small diameter nozzles 21a, 21a... are drilled from the inner circumference side of the annular circumferential trench 20 of a developer supply mechanism 19 provided in an upper cup 17 to compose a nozzle group 21. A cylindrical partition 22 is formed inside the nozzle group 21 with a predetermined interval so as to form a solution sink 23 and the height of the top surface of the partition 22 is at least equal to the height of the top surface 20a of the circumferential trench 20. Therefore, even if the supply of liquid treatment agent into the circumferential trench 20 is discontinued, the treatment agent remains in the solution sink formed between the partition 22 and the nozzles 21a, 21a..., so that the mingling of bubbles into the circumferential trench 20 can be avoided. With this constitution, even after the long time suspension of the apparatus, the liquid treatment agent can be supplied stably.

Description

[Detailed description of the invention] [Purpose of the invention] (Industrial application field) The present invention relates to a processing device.

(Prior Art) Conventionally, in processes such as the photoresist film coating process and the photoresist film development process in the manufacturing process of semiconductor devices, the substrate to be processed has been Processing equipment that processes each sheet one by one with a liquid processing agent is often used.

As such processing equipment, spin-type processing equipment and immersion-type processing equipment are known. For example, in the case of a developing device, a spin-type processing equipment uses nozzles, sprays, etc. placed above the substrate to be processed. A developer is supplied onto the substrate to be processed. Therefore, there is a limit to the amount of liquid that can rise on the substrate to be processed due to the effect of surface tension. Further, there is a problem that uneven coating may occur depending on the amount of developer supplied. In addition, uneven development is likely to occur due to impact when the developer adheres to the substrate to be processed.

On the other hand, immersion type processing equipment has advantages such as less shock when filling up the liquid, faster filling speed, and the ability to set the height of the filling higher. .

Especially for immersion type processing equipment.

In recent years, when using a developer with low surface tension, such as a developer with surfactants added to improve resolution,
It is becoming an indispensable device.

The immersion-type developing device is equipped with a cup that is in liquid-tight contact with the lower peripheral part of the substrate to be processed and has an internal volume that can sufficiently immerse the substrate, and forms a processing tank with the substrate to be processed. There are known structures that allow this.

Such a developing device is provided with a developer supply mechanism inside a cup located on the side of the substrate to be processed, in order to slowly supply the developer to the substrate to be processed. As shown in FIG. 7, for example, this developer supply mechanism has an annular outer circumferential groove 3 formed inside the cup 2 at a side position of the substrate 1 to be processed. A developer supply pipe 4 is connected to this outer circumferential groove 3, and a slit-shaped nozzle 5 extending in the direction of the substrate 1 to be processed is formed. With such a structure, the developer 32 supplied to the outer circumferential groove 3 is supplied to the processing tank from all directions of the substrate 1 to be processed.

(Problems to be Solved by the Invention) However, in the above-described developing device, the developer 32 in the outer circumferential groove 3 flows out from the nozzle 5 toward the processing tank after the supply of the developer 32 is stopped. For this reason, an air pocket 7 is formed within the outer circumferential groove 3. This air pocket 7 has almost no effect when the developer 32 is continuously discharged. However, if left for a long period of time, the air pocket 7 becomes large, causing variations in the amount of developer discharged.

Further, when the developer is discharged, air is also discharged at the same time. In other words, the discharge is mixed with bubbles, which causes uneven development and poor development.

Furthermore, the above-described developing device has the effect of reducing pressure loss during discharge by making the nozzle shape slit-like. However, there is a problem in that the state of discharge into the processing tank tends to be uneven.

These problems are the same even when a dipping type processing device is used as a resist coating device, for example, and cause uneven resist formation, uneven film thickness, and the like.

SUMMARY OF THE INVENTION An object of the present invention is to provide a processing apparatus that can stabilize the supply of a liquid processing agent such as a developer or a resist solution and prevent processing defects due to inclusion of air bubbles, uneven coating, and the like.

[Structure of the invention]

(Means for Solving the Problems) The present invention constitutes a processing tank that has an opening through which a substrate to be processed is taken in and taken out, and in which the back surface of the accommodated substrate to be processed is brought into liquid-tight contact with the bottom. A cup, an outer circumferential groove formed in a peripheral wall of the cup to communicate with the processing tank, and one end thereof connected to a liquid processing agent supply source.

and a plurality of nozzles connected to the outer circumferential groove at predetermined intervals on the other end side, and a partition plate suspended from the inner circumferential wall of the cup toward the bottom side of the outer circumferential groove from the opening edge of the outer circumferential groove. The present invention provides a processing device characterized by comprising:

(Function) In the processing apparatus of the present invention, a partition plate having at least the same height as the top surface height of the annular outer circumferential groove serving as a supply source of the liquid processing agent is installed in front of the nozzle. Here, the liquid processing agent supplied from the outer circumferential groove through the nozzle passes through the upper part of the partition plate and is supplied into the processing tank, and even if the supply of the liquid processing agent into the outer circumferential groove is stopped, The processing agent remains in the liquid pool formed between the plate and the nozzle. Since the liquid level of this liquid pool is at least the same as the height of the upper surface of the outer circumferential groove, air bubbles are prevented from entering the outer circumferential groove. In addition, since many small diameter nozzles are formed from the outer circumferential groove,
It becomes possible to stably supply the liquid processing agent from all directions of the substrate to be processed. Therefore, it becomes possible to stably supply the liquid processing agent, and it is possible to prevent processing defects due to the inclusion of air bubbles and the like.

(Example) Hereinafter, an example in which the apparatus of the present invention is applied to an immersion type developing apparatus will be described with reference to one drawing.

FIG. 1 is a sectional view of an immersion treatment apparatus according to an embodiment of the present invention. In the figure, 11 is a substrate to be processed, which is made of, for example, a semiconductor wafer. The substrate to be processed 11 is held on a mounting table 12 . The mounting table 12 is connected to a rotation mechanism 13 that rotates the processing target substrate 11 together with the mounting table 12 at high speed. Further, the mounting table 12 is loosely inserted into a through hole 14a formed in the center of the inner cup 14.

A circular suction pad 15 is provided above the inner cup 14 to suction and hold the substrate 11 during immersion development.

The suction pad 15 is connected to a vacuum mechanism such as a vacuum pump, which is not shown.

The suction pad 15 liquid-tightly seals the lower surface of the substrate 11 and the inner cup 14 . inner cup 1
A cleaning nozzle 16 for cleaning the lower surface of the substrate 11 to be processed after development is also provided on the top of the substrate 4 . This inner cup 14 has an inclined surface 14b inclined outwardly and downwardly.
It has a cylindrical shape.

Above the inner cup 14, there is a slope 1 of the inner cup 14.
An inclined surface 17 inclined in the same direction so as to face 4b.
A cylindrical upper cup 17 having a hole 17b on its lower side and forming a side wall of the processing tank is disposed. The inner cup 14 and the upper cup 17 are configured to be in liquid-tight contact with each other by a seal ring 18 installed at the inner lower part of the upper cup 17.

The substrate to be processed 11, the inner cup 14, the seal ring 18, and the upper cup 17 constitute a liquid-tight processing tank.

A developer supply mechanism 19 is provided within the upper cup 17 . As shown in FIGS. 2 and 3, the developer supply mechanism 19 has a nozzle group 21 formed from a large number of small-diameter nozzles 21a, 21a, . ing. The outer circumferential groove 20 may be continuous, or may be an interrupted groove. Inside the nozzle group 21, cylindrical partition plates 22 are formed at predetermined intervals so as to form a liquid pool 23.

The upper surface of this partition plate 22 is at least the same height as the upper surface 20a of the outer circumferential groove 20. This upper surface is preferably slightly higher than the upper surface 20a of the outer circumferential groove 20. Further, inside the partition plate 22, each nozzle 21a is provided.

21a... An abutting plate 25 is provided so as to communicate with the liquid pool 23 and bend the discharge passage 24 formed by the upper part of the partition plate 22 downward. In addition, the outer peripheral groove 20
A number of developer supply pipes z6 corresponding to the amount of liquid to be used are connected to the developer supply pipes z6.

Note that the nozzle group 21 has a small diameter of about 36 nozzles, with a diameter of 2 m for each nozzle 21a, 21a, etc., and a large number of nozzles, for example, when discharging the developer at a rate of about 6Q/win to a 6-inch substrate. shall be. This reduces the pressure loss by 2
) It is possible to suppress the loss to as low as cg/a# or less. Further, uniformity of discharge and discharge amount can be satisfied at the same time.

An outer cup 27 is provided on the outer periphery of the upper cup 17 to prevent liquid from scattering during rinsing/cleaning, drying, etc.

On the other hand, a cylindrical container-shaped lower cup 28 is fixed to the inner lower part of the inner cup 14 so as to surround the lower and side surfaces of the entire developing device. The lower cup 28 has a mounting table 12.
A through hole 28a is formed into which the holder is loosely inserted. A discharge groove 28 is provided on the outer periphery of the lower surface of the lower cup 28 for discharging the developer, etc.
b is provided. A discharge pipe 29 is provided in the discharge groove 28b.
is connected. Further, the discharge groove 28b is provided with a rinse groove.
An exhaust pipe 30 is connected to prevent scattered mist from being drawn into the inside of the substrate 11 to be processed during cleaning, drying, etc. The exhaust pipe 30 is connected to an exhaust mechanism (not shown).

On the lower surface of the lower cup 28, the lower cup 28 and the C cup 1 are arranged.
An elevating and lowering drive mechanism 31 such as an air cylinder, for example, is provided to control the elevating of the motor. By driving the elevating drive mechanism 31, a distinction is made between a developing state and a cleaning/rinsing and drying state.

The immersion type developing device configured as described above performs immersion development processing in the following manner.

First, as shown in FIG. 4, the substrate 11 to be processed is placed on the mounting table 12, which is waiting in a rinsed, cleaned and dry state, and is held by suction. The substrate to be processed 11 is carried in and out by providing, for example, an elevating drive mechanism for elevating the entire cup. That is, the entire cup in the rinsed, washed, and dry state is raised and lowered by the raising and lowering drive mechanism, and placed on the mounting table 12.
The upper surface of the cup is positioned above the outer cup 27. In this state, the substrate to be processed 11 is carried in and carried out by an external transport mechanism.

Next, the lower cup 28 and the inner cup 14 are raised by the elevating drive mechanism 31, and the substrate 11 to be processed is placed on the suction pad 15 from the mounting table 12. When the substrate 11 to be processed is placed on the suction pad 15, the vacuum mechanism is activated. This seals the mounting portion liquid-tight. Subsequently, the elevating drive mechanism 31 is raised to a position where the inclined surface 14b of the inner cup 14 comes into contact with the seal ring 18 provided on the lower side of the upper cup 17. Then, the seal ring 18 and the inner cup 14 are held in a position where they are in liquid-tight contact with each other by the pressing force of the elevating drive mechanism 31. In this way, a processing tank is formed. This state is the state shown in FIG.

Next, a developer is supplied from the developer supply pipe 26 to the outer circumferential groove 20 . The developer 32 supplied to the outer circumferential groove 20 is supplied to the liquid reservoir 23 via the nozzle group 21 . Then,
The developer 32 passes over the upper part of the partition plate 22, passes through the discharge passage 24 formed downward by the abutment plate 25, and is gradually supplied into the processing tank from the lower side of the side surface of the substrate 11 to be processed. At this time, the developer 32 is supplied into the processing tank from the nozzle group 21 composed of a large number of small diameter nozzles 21a, 21a, . . . . For this reason, developer solution 3
2 is uniformly deposited on the substrate 11 to be processed from the entire circumferential direction of the substrate 11 to be processed. Further, even if the supply of the developer 32 is stopped, the developer 32 in the liquid reservoir 23 will not flow out to the processing tank side.
is maintained at the top surface height.

Due to the action of the liquid pool 23 and the partition plate 22, the outer circumferential groove 20 is constantly filled with the developer 32 up to its upper surface 20a. This removes the air pocket from the developer solution 32.
can be prevented from forming inside.

Further, after filling the processing tank with a predetermined amount of developer 32 and performing immersion development processing for a predetermined time, the elevating drive mechanism 31 is lowered. As a result, the inner cup 14 and the upper cup 17, which have been liquid-tightly sealed, are separated. As a result, the developer 32 naturally falls between the upper cup 17 and the inner cup 1.
It flows into the discharge groove 28b along the discharge passage 33 formed between the discharge grooves 28b. The developer 32 is then discharged to the outside through the discharge pipe 29. The developer solution 32 can be discharged quickly because the opening area of the discharge passage can be sufficiently secured.

Furthermore, the lifting drive mechanism 31 is lowered to remove the substrate 11 to be processed.
is placed on the mounting table 12 (the state shown in FIG. 4). In this state, the rotation mechanism 13 is operated. As a result, the substrate 11 to be processed is rotated at high speed. Then, the developer 32 remaining on the substrate 11 to be processed is shaken off. At the same time, a rinsing liquid is discharged from a rinsing nozzle (not shown) to stop the development and rinse the substrate 11 to be processed.

Further, the cleaning liquid is also ejected from the backside cleaning nozzle 16 to clean the backside of the substrate 11 to be processed at the same time.

During this cleaning step, the inside of the cup is exhausted from the exhaust pipe 30 to form an exhaust flow as shown by arrow A in the figure. In other words, the scattered mist of the rinse liquid or the like is prevented from adhering to the substrate 11 to be processed.

After the rinsing and backside cleaning steps are completed, the substrate to be processed 1
1 is further rotated for a certain period of time. Then, the substrate to be processed 1
Dry 1. In this way, a series of immersion development steps is completed.

As described above, according to the immersion type developing device of this embodiment, the developer supply mechanism is constituted by the outer circumferential groove, the nozzle group, and the partition plate having at least the same height as the upper surface height of the outer circumferential groove. Therefore, even after the supply of developer into the outer circumferential groove is stopped, the liquid level in the liquid pool provided on the outer circumferential side of the partition plate is always at least the same as the surface height above the outer circumferential groove. remains. As a result, the inside of the outer circumferential groove is similarly filled with the developer up to the upper surface, and no further developer flows out. Therefore, even after the operation of the device is stopped for a long time, air pockets are not formed in the outer circumferential groove. This makes it possible to constantly discharge a constant amount of developer. Moreover.

No air bubbles are mixed into the developer, and uneven development and poor development due to variations in discharge amount and air bubbles are prevented. Further, the developer is supplied into the processing tank by a nozzle group consisting of a large number of small diameter nozzles.

For this reason, although the pressure loss increases somewhat, since the diameter is small and the number of tubes is large, the overall pressure loss can be reduced to such an extent that the discharge amount is not affected. This small-diameter, large number of nozzle groups makes it possible to uniformly supply the developer from the entire circumference of the substrate to be processed. As a result, uneven development is prevented.

Further, as shown in FIG. 5, the developer supply mechanism may be provided with an air vent passage 34 above the discharge passage 24 after passing through the nozzle group 21. This air vent passage 34 further facilitates the supply of the developer. Stabilize.

This is because developing solutions generally have surface tension. Therefore, the developer may remain in the narrow discharge passage 24 between the partition plate 22 and the abutting plate 25 due to its surface tension. When the developer is discharged in this state, the air within the discharge passage 24 is mixed with the developer and is discharged.

Therefore, as shown in FIG. 5, an air vent passage 34 is provided on the upper surface of the discharge passage 24. As a result, only the discharged developer is discharged through the discharge passage 24.

The remaining air can then be discharged from the air vent passage 34.

It is preferable that the air vent passage 34 be formed toward the outer periphery at the same height as the upper surface of the discharge passage 24 .

Its size is determined by a certain groove width, for example, 0.01 to 0.5
By having such a shape, which is preferably about m, even if the developer flowing upward from the liquid pool 23 comes to the air vent passage 34 side, the liquid does not pass through, and only gas can pass through. .

The processing apparatus of the present invention is suitable for applying a liquid processing agent to the entire surface of a substrate to be processed. It is an effective device.

In addition, as shown in FIG. 6, a gas-liquid separator B is connected to the exhaust pipe 30.
It is desirable to connect the That is, numeral 40 in the figure is a compressed air source constituting the vacuum generating means. The vacuum generating means generates a vacuum by supplying compressed air in order to generate a vacuum for adsorption. A pneumatic vacuum device 44 is provided which supplies compressed air from the compressed air source 40 through an air inlet 41 to generate a vacuum in a vacuum port 42 using an internal venturi and exhausts the vacuum from an exhaust port 43. The vacuum port 42 is connected to the suction pad 15 of the inner cup 14 by a pipe 45 forming a vacuum path.
The piping is connected to the Suction pad 15 and vacuum suction path 4
6 and the pneumatic vacuum device 44 constitute a vacuum suction means. The exhaust port 43 of the pneumatic vacuum device 44 of this vacuum adsorption means is equipped with a gas-liquid separator A for separating gas and liquid.
47 is connected by piping. The separated gas and liquid are discharged from the exhaust port A48 and the liquid from the drain port A49, respectively.

On the other hand, the exhaust pipe 30 of the lower cup 28 is connected to a gas-liquid separator B51 via a pipe 50. This gas-liquid separator B
51 is formed to have a large volume. That is, the gas-liquid separator B51 is configured to collect fine mist and liquefy it using the pressure reduction effect of the exhaust flow and the baffle provided inside. The liquid separated by this gas-liquid separator B51 is discharged from a liquid drain port B52, and the gas is discharged from an exhaust port B53. In addition, the exhaust port B53 is connected to the alkaline exhaust treatment device 5.
4 to complete the exhaust process.

Here, the exhaust port A48 of the gas-liquid separator A41 is connected to the piping, and the gas is processed in the gas-liquid separator B51.

In addition, the drain pipe 29 of the lower cup 28, the gas-liquid separator WIA4
7 drain port A49, liquid drain port B52 of gas-liquid separator B51
The liquid is collected by a liquid collection pipe 55, and is configured to be treated by a waste liquid treatment device (not shown).

Further, the vacuum suction means for suctioning the lower peripheral edge of the substrate to be processed 11 on the upper surface of the inner cup 14 may be configured as follows. That is, the upper surface around the groove-shaped vacuum suction path 46 may be formed on a flat surface. do. Further, the size of the contact surface with the substrate 11 to be processed is set to be equal to or slightly smaller than the size of the substrate 11 to be processed.

Furthermore, an annular suction pad 15 made of a hydroplastic material having a property of repelling liquid, such as trifluoroethylene resin, is provided. Ethylene trifluoride resin has excellent water plasticity and chemical resistance, and is also harder than, for example, tetrafluoroethylene resin, so it is less likely to be damaged when adsorbed with semiconductor wafers, and it is also less susceptible to vacuum suction. There is less leakage due to scratches etc.

Furthermore, the trifluoroethylene resin exhibits a heat insulating effect and enables good development processing even in development processing where it is undesirable for the processing temperature to change during development due to its low thermal conductivity.

As described above, since the suction pad 15 is made of a hydroplastic material and the contact surface with the substrate 11 to be processed is smaller than that of the substrate 11 to be processed, the remaining liquid can be removed simply by rotating the substrate 11 to be processed. It can be shaken off almost completely, and there is almost no remaining liquid.

〔Effect of the invention〕

As explained above, according to the present invention, it is possible to stably supply a liquid processing agent even after a long period of stoppage, and therefore it is possible to reduce the incidence of defects such as processing unevenness.

[Brief explanation of the drawing]

Fig. 1 is a block diagram of an immersion type developing device for explaining one embodiment of the device of the present invention, Fig. 2 is an explanatory diagram of the developer supply section in Fig. 1, and Fig. 3 is a diagram taken along line X-X in Fig. 2. 4 is an explanatory diagram of the operation of the immersion type developing apparatus shown in FIG. 1, FIGS. 5 and 6 are explanatory diagrams of other embodiments of the apparatus of the present invention, and FIG. 7 is a configuration of a conventional immersion processing apparatus. It is a diagram. 11... Substrate to be processed 14... Inner cup 1
5... Suction pad 17... Upper cup 18
... Seal ring 19 ... Developer supply mechanism 20 ... Outer circumferential groove 21 ... Nozzle group 2
1a... Small diameter nozzle 22... Partition plate 24.
...Discharge passage 26...Developer supply pipe 27
...Outer cup 32...Developer

Claims (1)

[Claims] a cup having an opening through which a substrate to be processed can be taken in and taken out and forming a processing tank by bringing the back side of the accommodated substrate to be in liquid-tight contact with the bottom; an outer circumferential groove formed in communication; a plurality of nozzles whose one end side is connected to a liquid processing agent supply source and whose other end side is connected to the outer circumferential groove at predetermined intervals; A processing device comprising: a partition plate hanging down from the inner circumferential wall of the cup toward the bottom side of the outer circumferential groove.