JPH0256458U - - Google Patents

Info

Publication number
JPH0256458U
JPH0256458U JP1988135716U JP13571688U JPH0256458U JP H0256458 U JPH0256458 U JP H0256458U JP 1988135716 U JP1988135716 U JP 1988135716U JP 13571688 U JP13571688 U JP 13571688U JP H0256458 U JPH0256458 U JP H0256458U
Authority
JP
Japan
Prior art keywords
pellet
utility
scope
constant voltage
registration request
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988135716U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988135716U priority Critical patent/JPH0256458U/ja
Publication of JPH0256458U publication Critical patent/JPH0256458U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/851Dispositions of multiple connectors or interconnections
    • H10W72/874On different surfaces
    • H10W72/884Die-attach connectors and bond wires
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/701Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips

Landscapes

  • Electrodes Of Semiconductors (AREA)
JP1988135716U 1988-10-17 1988-10-17 Pending JPH0256458U (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988135716U JPH0256458U (enExample) 1988-10-17 1988-10-17

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988135716U JPH0256458U (enExample) 1988-10-17 1988-10-17

Publications (1)

Publication Number Publication Date
JPH0256458U true JPH0256458U (enExample) 1990-04-24

Family

ID=31395592

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988135716U Pending JPH0256458U (enExample) 1988-10-17 1988-10-17

Country Status (1)

Country Link
JP (1) JPH0256458U (enExample)

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