JPH0254527A - Spin dryer - Google Patents
Spin dryerInfo
- Publication number
- JPH0254527A JPH0254527A JP20390188A JP20390188A JPH0254527A JP H0254527 A JPH0254527 A JP H0254527A JP 20390188 A JP20390188 A JP 20390188A JP 20390188 A JP20390188 A JP 20390188A JP H0254527 A JPH0254527 A JP H0254527A
- Authority
- JP
- Japan
- Prior art keywords
- orientation flat
- cassette
- wafer
- hold down
- spin dryer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims abstract description 5
- 235000012431 wafers Nutrition 0.000 claims description 21
- 238000001035 drying Methods 0.000 claims description 10
- 238000003780 insertion Methods 0.000 claims description 2
- 230000037431 insertion Effects 0.000 claims description 2
- 239000002245 particle Substances 0.000 abstract description 15
- 238000000034 method Methods 0.000 abstract description 6
- 238000009434 installation Methods 0.000 abstract description 3
- 238000002474 experimental method Methods 0.000 description 6
- 230000007547 defect Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 241000257465 Echinoidea Species 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Landscapes
- Cleaning Or Drying Semiconductors (AREA)
Abstract
Description
【発明の詳細な説明】
[産業上の利用分野1
本発明はウェハ乾燥器に関し、特に回転機構を有するス
ピンドライヤに係るものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application 1] The present invention relates to a wafer dryer, and particularly to a spin dryer having a rotation mechanism.
LSI製造工程はその微細化が進むと共に、工程は複雑
になり、かつ工程数も増え、洗浄、乾燥工程はLSI製
造工程の中でも最も多い工程の分野に属する。As the LSI manufacturing process progresses in miniaturization, the process becomes more complex and the number of steps increases, and cleaning and drying processes are among the most common processes in the LSI manufacturing process.
従来半導体ウェハの乾燥にはスピンドライヤが用いられ
ている。このスピンドライヤとしては第3図に平面図を
示すようなウェハ4を収納したカセット5を1個処理で
きるもの、および第4図に断面図を示すような、ウェハ
4を収納したカセット5を2個以上処理できるもの(特
開昭62−189735号公報)があった、第3図、第
4図において、ウェハ4は、カセット5に収納され、オ
リフラ8をウェハ挿入側に位置させている。さらにカセ
ット5はカセット収納部2に収納されている。第4図で
は乾燥槽6内に装入されたカセットを回転させるターン
テーブル9は軸lOにより駆動される。スピンドライヤ
はウニ八表面に沿って流れる乾燥用空気の風速および回
転による遠心力によってウェハを乾燥させる。Conventionally, spin dryers have been used to dry semiconductor wafers. The spin dryer is one that can process one cassette 5 containing wafers 4, as shown in a plan view in FIG. In FIGS. 3 and 4, the wafer 4 is housed in a cassette 5, and the orientation flat 8 is positioned on the wafer insertion side. Further, the cassette 5 is stored in the cassette storage section 2. In FIG. 4, a turntable 9 for rotating a cassette placed in a drying tank 6 is driven by a shaft lO. The spin dryer dries the wafer using the speed of the drying air flowing along the surface of the urchin and the centrifugal force generated by rotation.
〔発明が解決しようとする課題]
ところが以上のようなスピンドライヤでは、ウェハ乾燥
処理中において遠心力によりウェハ相互間に回転が発生
し、オリフラ8が乱れるということが発生していた。L
SIを製造するに当たってウェハ乾燥の全工程において
オリフラを合わせる必要があるため、ウェハのオリフラ
をハンドリングで合わせる時間も無視することはできな
いばかりでなく、この時ハンドリングによるパーティク
ルが発生してしまう。[Problems to be Solved by the Invention] However, in the spin dryer as described above, rotation occurs between the wafers due to centrifugal force during the wafer drying process, and the orientation flat 8 is disturbed. L
In manufacturing SI, it is necessary to align the orientation flats during the entire process of drying the wafer, so not only can the time required to align the orientation flats of the wafers during handling cannot be ignored, but also particles are generated during handling.
本発明は上記のような従来の欠点を除去するためになさ
れたもので、ウェハ乾燥時にウェハのオリフラを乱すこ
となく、乾燥後のウェハのオリフラ合わせおよびこれに
よるパーティクル発生防止、オリフラ合わせ時間削除を
目的とする。The present invention was made in order to eliminate the above-mentioned drawbacks of the conventional technology, and it is possible to align the orientation flat of the wafer after drying without disturbing the orientation flat of the wafer, prevent the generation of particles due to this, and eliminate the time required for aligning the orientation flat. purpose.
[課題を解決するための手段]
本発明はスピンドライヤを構成するカセット設置部のオ
リフラ部分にオリフラ固定部材を設けると共に、このオ
リフラ固定部材をカセットに収納したウニへのオリフラ
部に押付ける付勢部材を設けたことを特徴とする。[Means for Solving the Problems] The present invention provides an orientation flat fixing member on the orientation flat portion of a cassette installation part constituting a spin dryer, and provides an urging force that presses the orientation flat fixing member against the orientation flat portion of the sea urchin stored in the cassette. It is characterized by the provision of a member.
オリフラ固定部材としては、板状のものの他に棒状のも
のや、これらの組み合わせによるもの等が挙げられるが
、オリフラ部を固定することができる形状であれば、形
状は限定されない。また板や捧の設置数も特に限定され
ず、さらに材質もパーティクルの発生を伴わなければ特
に限定されるものではない。Examples of the orientation flat fixing member include a plate-shaped member, a rod-shaped member, and a combination thereof, but the shape is not limited as long as the orientation flat part can be fixed. Further, the number of plates and plates to be installed is not particularly limited, and the material is also not particularly limited as long as it does not generate particles.
付勢部材としては各種のばねを用いることができるがウ
ェハを固定する作用があれば特に限定しない。Various types of springs can be used as the biasing member, but there is no particular limitation as long as it has the effect of fixing the wafer.
[作用]
本発明における又ビンドライヤの基本構造を第1図に示
す。[Function] The basic structure of the bind dryer according to the present invention is shown in FIG.
この発明ではカセット設置部のオリフラ部分にオリフラ
固定部材として板が装備されており、この固定部材はオ
リフラ部分に付勢部材により押付けられているのでオリ
フラ部れがなくなる。In this invention, the orientation flat part of the cassette installation part is equipped with a plate as an orientation flat fixing member, and since this fixing member is pressed against the orientation flat part by a biasing member, the orientation flat part does not shift.
従ってオリフラ合わせ工程を不要としパーティクル発生
などを生じない。Therefore, there is no need for an orientation flat alignment process, and no particles are generated.
[実施例]
第1図、第2図に本発明の実施例装置を示した。半導体
ウェハ4はカセット5に収納されており、そのオリフラ
8の部分にオリフラ固定部材3を付勢部材(ばね1)で
押付けている。以上の実施例装置および第3図、第4図
に示す従来装置を用いて、純水洗浄後のウェハを乾燥さ
せる実験を行った。[Example] FIG. 1 and FIG. 2 show an example device of the present invention. The semiconductor wafer 4 is housed in a cassette 5, and the orientation flat fixing member 3 is pressed against the orientation flat 8 by a biasing member (spring 1). Using the apparatus of the above embodiment and the conventional apparatus shown in FIGS. 3 and 4, an experiment was conducted to dry a wafer after cleaning with pure water.
実験回数に対する所要時間とパーティクルおよび疵の発
生数を第1表に示した。ここで、1回の実験には3分の
水洗と2分の乾燥が含まれる。また従来装置ではオリフ
ラ合わせを行った後にパーティクルおよび疵の発生があ
るため、これらの個数を示した。Table 1 shows the time required for the number of experiments and the number of particles and defects generated. Here, one experiment includes 3 minutes of water washing and 2 minutes of drying. In addition, since particles and flaws are generated after alignment of orientation flats in conventional equipment, the number of these particles is shown.
(1)実験回数1回では、実施例装置においては所要時
間5分、パーティクルおよび疵が0個であり、従来装置
では、それぞれ10分および10個であった。(1) In one experiment, it took 5 minutes and no particles or flaws in the example device, and 10 minutes and 10 particles, respectively, in the conventional device.
(2)実験回数5回では実施例装置を使用した場合、所
要時間25分、パーティクルおよび疵の数0個であるの
に対し、従来装置ではそれぞれ50分および100個で
あった。(2) When the example device was used for five experiments, the required time was 25 minutes and the number of particles and defects was zero, whereas with the conventional device, the number of particles and defects was 50 minutes and 100, respectively.
(3)実験回数10回では実施例装置を使用した場合は
所要時間50分、パーティクルおよび疵の数0個である
のに対し、従来装置ではそれぞれ100分、200個で
あった。(3) In 10 experiments, it took 50 minutes and 0 particles and 0 defects using the example device, whereas the conventional device required 100 minutes and 200 particles, respectively.
[発明の効果1
本発明装置を用いると、ウェハ乾燥工程の短時間化およ
びLSI製造に最も悪影響を与える配線の断線、ビット
および成膜むらの発生等の原因となるパーティクルの発
生および疵の発生を著しく減少させることができる。[Effect of the invention 1] When the apparatus of the present invention is used, the wafer drying process is shortened and the generation of particles and scratches that cause disconnection of wiring, generation of bits and uneven film formation, etc., which have the most adverse effect on LSI manufacturing. can be significantly reduced.
第1図は1カセツト処理型の実施例装置の平面図、第2
図は多数カセット処理型の実施例装置の断面図、第3図
は従来の1カセツト処理型装置の平面図、第4図は従来
の多数カセット処理型装置の断面図である。
■・・・ばね、2・・・カセット収納部、3・・・オリ
フラ固定部材、4・−・ウェハ、5・・・カセット、6
−・乾燥槽、7・・−スピンドライヤ、8・・−オリフ
ラ、9・・・ターンテーブル、IO・・・軸。Figure 1 is a plan view of a one-cassette processing type apparatus;
3 is a plan view of a conventional one-cassette processing apparatus, and FIG. 4 is a cross-sectional view of a conventional multi-cassette processing apparatus. ■... Spring, 2... Cassette storage section, 3... Orientation flat fixing member, 4... Wafer, 5... Cassette, 6
- Drying tank, 7... - spin dryer, 8... - orientation flat, 9... turntable, IO... axis.
Claims (1)
を収納するカセットのウェハ挿入側にオリフラ固定部材
を設けると共に、前記カセットに収納した半導体ウェハ
のオリフラ部に前記オリフラ固定部材を押し付ける付勢
部材を設けたことを特徴とするスピンドライヤ。1. In a spin dryer for drying semiconductor wafers, an orientation flat fixing member is provided on the wafer insertion side of a cassette for storing wafers, and an urging member is provided for pressing the orientation flat fixing member against the orientation flat portion of the semiconductor wafer stored in the cassette. A spin dryer featuring:
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63203901A JPH0695513B2 (en) | 1988-08-18 | 1988-08-18 | Spin dryer |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63203901A JPH0695513B2 (en) | 1988-08-18 | 1988-08-18 | Spin dryer |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0254527A true JPH0254527A (en) | 1990-02-23 |
JPH0695513B2 JPH0695513B2 (en) | 1994-11-24 |
Family
ID=16481587
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP63203901A Expired - Fee Related JPH0695513B2 (en) | 1988-08-18 | 1988-08-18 | Spin dryer |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0695513B2 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0523530U (en) * | 1991-08-30 | 1993-03-26 | 大日本スクリーン製造株式会社 | Wafer rotary dryer |
US8009249B2 (en) | 2004-04-30 | 2011-08-30 | Fujitsu Limited | Liquid crystal display device |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5954925U (en) * | 1982-10-01 | 1984-04-10 | 東邦化成株式会社 | Rotary dryer for wafers |
JPS62152136A (en) * | 1985-12-26 | 1987-07-07 | Toshiba Corp | Spinning chuck for semiconductor wafer |
-
1988
- 1988-08-18 JP JP63203901A patent/JPH0695513B2/en not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5954925U (en) * | 1982-10-01 | 1984-04-10 | 東邦化成株式会社 | Rotary dryer for wafers |
JPS62152136A (en) * | 1985-12-26 | 1987-07-07 | Toshiba Corp | Spinning chuck for semiconductor wafer |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0523530U (en) * | 1991-08-30 | 1993-03-26 | 大日本スクリーン製造株式会社 | Wafer rotary dryer |
US8009249B2 (en) | 2004-04-30 | 2011-08-30 | Fujitsu Limited | Liquid crystal display device |
Also Published As
Publication number | Publication date |
---|---|
JPH0695513B2 (en) | 1994-11-24 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |