JPH06342754A - Removing apparatus for undesired film of coated board formed by spin coating - Google Patents
Removing apparatus for undesired film of coated board formed by spin coatingInfo
- Publication number
- JPH06342754A JPH06342754A JP15454293A JP15454293A JPH06342754A JP H06342754 A JPH06342754 A JP H06342754A JP 15454293 A JP15454293 A JP 15454293A JP 15454293 A JP15454293 A JP 15454293A JP H06342754 A JPH06342754 A JP H06342754A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- film
- unit
- unnecessary film
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Coating Apparatus (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は，回転塗布によって形成
された膜の不要部分の除去をおこなうための装置に関す
るもので、ＬＳＩ、超ＬＳＩなどの製造に用いられるフ
オトマスク用基板、フオトマスクやＬＣＤ基板等に対す
る塗布に係り、特に微細なパターンを高密度に形成する
際に用いられる位相シフトフオトマスク基板、位相シフ
トフオトマスクのＳＯＧの塗布膜の不要膜除去に有効な
装置に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for removing an unnecessary portion of a film formed by spin coating, which is a photomask substrate, a photomask or an LCD substrate used in the manufacture of LSI, VLSI and the like. In particular, the present invention relates to a phase shift photomask substrate used when forming a fine pattern with high density, and an apparatus effective for removing an unnecessary film of an SOG coating film of the phase shift photomask.
【０００２】[0002]
【従来の技術】従来より、ＬＳＩ、超ＬＳＩなどの製造
に用いられるフオトマスク用基板、フオトマスク、ＬＣ
Ｄ基板にたいする塗布膜においては、特に微細なパター
ンを高密度に形成する際に用いられる位相シフトフオト
マスク基板、位相シフトフオトマスクの塗布膜において
は、回転塗布によって形成された塗布膜は、基板が四角
形状のため、基板の周辺部や四辺端部で基板中央部に較
べ塗布膜厚が厚くなり、これらの厚膜化された部分は、
基板周辺部であるため、搬送、プロセス処理において部
分的に破壊され破片が飛散することがあり、その破片が
欠陥の一因となっていることが知られている。位相シフ
トフオトマスク作製におけるＳＯＧ膜の塗布の場合にお
いては、厚膜化され領域では、膜厚自身の応力で、膜自
身が破壊してしまい、基板外周部の亀裂が基板の中央部
まで伸びることもあり、破壊により発生した破片がその
後のプロセス処理等で欠陥の一因となっていることが知
られている。特に、位相シフトフオトマスク作製におけ
るＳＯＧ膜の場合には膜厚制御面でも公差±１０ｎｍ程
度必要と、フオトレジストと比較すると精度が１桁程度
厳しいもので、できるだけ除去処理部からの影響がでな
いことが必要とされているが、通常の溶剤浸漬による除
去法では、基板外周部の処理部からの影響がでて膜厚に
変化が生じてしまうため、厚膜化された部分を除去処理
部以外の領域へ影響しないよう除去することが求められ
ていた。この基板の厚膜部を溶剤により浸漬して除去す
る方法は、四角形の基板の場合、基板の各辺毎に溶剤に
浸漬する必要があり、浸漬後に浸漬部の洗浄乾燥工程も
必要で、手間も時間もかかるものであり、基板が四角形
状であることの特殊性もあり、回転しながら膜を除去す
る溶剤をかけることもできず、人手の要らない、自動処
理の装置としてはよいものがなかった。2. Description of the Related Art Conventionally, photomask substrates, photomasks and LCs used for manufacturing LSIs, VLSIs, etc.
In the coating film for the D substrate, particularly, in the case of the phase shift photomask substrate and the coating film of the phase shift photomask used when forming a fine pattern with high density, the coating film formed by spin coating is Because of the quadrilateral shape, the coating film thickness is thicker at the peripheral portion and the four side edge portions of the substrate than at the central portion of the substrate, and these thickened portions are
Since it is the peripheral portion of the substrate, it is known that the fragments may be partially broken during the transportation and the process, and the fragments may be scattered, and the fragments are one of the causes of defects. In the case of applying an SOG film in the production of a phase shift photomask, in the thickened region, the film itself is destroyed by the stress of the film thickness itself, and the crack on the outer peripheral portion of the substrate extends to the central portion of the substrate. Therefore, it is known that the fragments generated by the destruction contribute to the defects in the subsequent process treatments. In particular, in the case of an SOG film in the production of a phase shift photomask, a tolerance of ± 10 nm is required also in terms of the film thickness control surface, and the precision is about one digit stricter than that of the photo resist, and the removal processing unit should not affect it as much as possible. However, in the normal removal method by immersion in a solvent, the thickness of the thickened portion is different from that of the removal treatment portion because the treatment portion on the outer periphery of the substrate affects the film thickness. Was required to be removed so as not to affect the area. The method of removing the thick film portion of the substrate by immersing it in a solvent is such that, in the case of a rectangular substrate, it is necessary to immerse the substrate in each side of the substrate, and a washing and drying process of the immersing part is also required after the immersing. It also takes time and there is a peculiarity that the substrate has a square shape, and it is not possible to apply a solvent that removes the film while rotating, so there is no need for manpower, and there is a good automatic processing device. There wasn't.
【０００３】[0003]
【発明が解決しようとする課題】本発明は、位相シフト
マフクブランクスや位相シフトマスクで用いられるＳＯ
Ｇのような高精度薄膜において、後続する工程で悪影響
をもたらす、回転塗布によって形成された膜の不要部分
を、自動的に、短時間に、不要膜部以外に影響を与える
ことなく除去できる装置を提供使用とするものである。SUMMARY OF THE INVENTION The present invention is an SO used in phase shift mask blanks and phase shift masks.
An apparatus that can automatically remove an unnecessary portion of a film formed by spin coating, which has a bad influence in a subsequent step in a high precision thin film such as G, in a short time without affecting other than the unnecessary film portion. Is provided and used.
【０００４】[0004]
【課題を解決するための手段】本発明は、このような状
況のもと、回転塗布によって形成された膜の不要部分の
除去を自動的に、短時間に、不要膜部以外に影響を与え
ることなく除去できる装置を提供するものであり、本発
明の装置は、回転塗布により塗布した基板の周辺部の不
要膜を、基板を直線搬送させ、基板辺方向に移動する
際、基板のサイドから除去治具により、除去する処理を
行う装置であって、少なくとも、処理される塗布基板２
を保持する基板保持部３と、基板保持部３をＸ、Ｙ、Ｚ
駆動するＸＹＺ駆動部９と、基板保持部３とＸＹＺ駆動
部９とを直線搬送する搬送部５と、不要膜を除去するた
めの除去治具４と、上記の基板保持部３、ＸＹＺ駆動部
９、搬送部５、除去治具４とを位置センサー等で関連づ
けて制御する制御部６とからなるものであり、本発明の
基板保持部３は、図６に記載されるように、処理される
塗布基板２を基板端で（四角基板の場合は基板の四隅に
て）ヴァキュームチャックにより保持し、ＸＹＺ駆動部
９と一体で、直線搬送部５により直線搬送される。図１
記載の装置では、処理用基板２は第一カセット７にセッ
トされた後、基板保持部３に搭載され、ＸＹＺ駆動部９
と一体で、直線搬送部５により直線搬送され、直線搬送
部の移動領域で、搬送される処理基板の各サイド側に固
定位置する、少なくとも１ケの不要膜除去治具により、
基板辺方向に移動する際、基板のサイドから除去処理さ
れるものである。不要膜部を除去された後は、処理済み
の基板を収納する第二のカセット８があるアンローデイ
ング部まで、更に搬送され、収納される。Under the above circumstances, the present invention automatically removes unnecessary portions of a film formed by spin coating in a short time and affects other than the unnecessary film portion. The apparatus of the present invention provides an apparatus capable of removing the unnecessary film on the peripheral portion of the substrate coated by spin coating, while the substrate is conveyed linearly and moved in the substrate side direction from the side of the substrate. A device for performing a removing process by a removing jig, and at least a coated substrate 2 to be processed
And a substrate holder 3 for holding X, Y, Z
An XYZ drive unit 9 to be driven, a transport unit 5 that linearly transports the substrate holding unit 3 and the XYZ drive unit 9, a removal jig 4 for removing an unnecessary film, the substrate holding unit 3 and the XYZ drive unit described above. 9, a transfer unit 5, and a control unit 6 that controls the removal jig 4 by associating them with a position sensor or the like. The substrate holding unit 3 of the present invention is processed as described in FIG. The coated substrate 2 is held at the substrate end (at the four corners of the substrate in the case of a square substrate) by a vacuum chuck, and is linearly transported by the linear transport unit 5 integrally with the XYZ drive unit 9. Figure 1
In the described apparatus, the processing substrate 2 is set in the first cassette 7 and then mounted on the substrate holding unit 3, and the XYZ driving unit 9 is installed.
Integrally with the linear transport unit 5, and at least one unnecessary film removing jig fixedly positioned on each side of the processed substrate to be transported in the moving region of the linear transport unit.
When moving in the substrate side direction, the removal processing is performed from the side of the substrate. After the unnecessary film portion is removed, it is further transported and stored to the unloading portion where the second cassette 8 for storing the processed substrate is located.
【０００５】本発明の装置の基板の不要膜部を除去する
ための治具は、図３、図４に記載のような処理される塗
布基板の外周の処理部の一部を覆い不要膜除去処理をお
こなう除去ヘッド部を有するもので、その除去ヘッド部
は、位置センサーにより位置管理されながら、ヘッド駆
動部により塗布基板との位置関係を調整され、基板の移
動により移動方向辺の不要膜を除去するもので、直線搬
送される処理基板の移動動領域の、処理基板の移動方向
辺両側に、処理時に処理される塗布基板の外周の処理部
の一部を覆うように固定配置されている。不要膜除去の
基本原理は、図７の、溶剤供給ライン部１６, を減圧ラ
イン部１５, の空間内に設けてなる減圧ライン端部（吸
引口）１５ａ, を基板２の厚膜化部１４に対して接近さ
せ、減圧ライン部１５, を減圧して溶剤供給ライン部１
６,より溶剤を作用させて厚膜化部１４を溶解し、溶解
された厚膜化部１４を減圧ライン部１５, で吸引する方
式と同じである。（以下、不要膜部を溶剤分により溶解
させ、減圧して除去する方式と言う。）The jig for removing the unnecessary film portion of the substrate of the apparatus of the present invention removes the unnecessary film by covering a part of the processing portion on the outer periphery of the coated substrate to be processed as shown in FIGS. 3 and 4. It has a removal head part that performs processing, and while the position of the removal head part is controlled by a position sensor, the head drive part adjusts the positional relationship with the coated substrate, and the unnecessary film on the moving direction side is removed by the movement of the substrate. It is to be removed, and is fixedly arranged on both sides of the moving direction region of the processing substrate to be linearly conveyed in the moving direction of the processing substrate so as to cover a part of the processing portion on the outer periphery of the coating substrate to be processed during processing. . The basic principle of the unnecessary film removal, in FIG. 7, vacuum line end formed by providing a space of the solvent supply line 16, vacuum line portion 15 a, (suction port) 15a, a substrate 2 thicker portion 14 To the solvent supply line unit 1 by depressurizing the depressurization line unit 15 .
6, the same as more solvent is caused to act to dissolve the thick film portion 14, dissolved thickened section 14 the vacuum line portion 15 in aspiration to scheme. (Hereinafter, it is referred to as a method in which the unnecessary film portion is dissolved by a solvent component and is removed under reduced pressure.)
【０００６】本発明装置の図３、図４に記載の不要膜部
を除去するための治具は、上記の不要膜部を溶剤分によ
り溶解させ、減圧して除去する方式のもので、図４の場
合には、除去ヘット４ａに、ドライポンプで１０減圧さ
れて溶解用溶液１２が供給され、減圧ライン端部１５ａ
で不要膜の溶解がおこなわれ、溶解された不要膜は、ド
ライポンプ１０で減圧吸引され、減圧ライン端部１５を
通し、溶解溶液トラップ部１１へ除去される。溶剤供給
ライン部１６を減圧ライン部１５の空間内に設けてなる
減圧ライン端部（吸引口）１５ａを基板２の厚膜化部１
４に対して接近させ、減圧ライン１５を減圧して溶剤供
給ライン１６により溶剤を作用させて厚膜化部１４を溶
解し、溶解された厚膜化部１４を減圧ラインで吸引す
る。本発明の装置は、この不要膜除去治具のヘッド部
を、位置センサーにより位置管理し、ヘッド駆動部によ
り塗布基板との位置関係を調整しながら、基板の移動に
より辺方向の不要膜を除去するもので、直線搬送部の移
動領域の、処理基板の移動方向辺両側に、処理時に処理
される塗布基板の外周の処理部の一部を覆うように固定
配置されている。除去ヘッド部は、処理基板の全ての外
周辺側の不要膜を除去できるように、適宜配置固定配置
されるもので、処理基板の各辺側に対し少なくとも１ケ
配置される。ヘッドの形状も、基板の 辺方向の移動に
あわせ、辺に、接することができるよう図３、図４に記
載のようになっている。図４において、１７の排気はハ
ネ防止のための排気部で、減圧端部を処理される基板の
外周の処理部の基板内側に設けてある。The jig for removing the unnecessary film portion shown in FIGS. 3 and 4 of the device of the present invention is of a system in which the above-mentioned unnecessary film portion is dissolved by a solvent and decompressed to remove it. In the case of 4, the removal head 4a is supplied with the dissolving solution 12 after being decompressed by a dry pump 10 and the decompression line end 15a.
The unnecessary film is dissolved in, and the dissolved unnecessary film is sucked under reduced pressure by the dry pump 10, passed through the depressurization line end portion 15, and removed to the dissolution solution trap portion 11. The depressurization line end portion (suction port) 15a provided by providing the solvent supply line portion 16 in the space of the depressurization line portion 15 is provided with the thick film forming portion 1
4, the depressurization line 15 is depressurized, and the solvent is supplied from the solvent supply line 16 to dissolve the thickened portion 14 and the dissolved thickened portion 14 is sucked through the depressurized line. In the apparatus of the present invention, the head portion of the unnecessary film removing jig is position-controlled by the position sensor, and the head driving unit adjusts the positional relationship with the coating substrate while removing the unnecessary film in the lateral direction by moving the substrate. Therefore, it is fixedly arranged on both sides in the moving direction of the processing substrate in the moving region of the linear transport section so as to cover a part of the processing section on the outer periphery of the coating substrate to be processed during processing. The removal head unit is appropriately disposed and fixed so that the unnecessary film on the outer peripheral side of all the processing substrates can be removed, and at least one removal head unit is disposed on each side of the processing substrate. The shape of the head is also as shown in FIGS. 3 and 4 so that the head can be in contact with the side in accordance with the movement of the substrate in the side direction. In FIG. 4, 17 is an exhaust part for preventing splashing, and the decompression end part is provided inside the substrate of the processing part on the outer periphery of the substrate to be processed.
【０００７】そして、本発明の装置は、処理の自動化の
ため、上記の構成に加え、処理基板のための基板を用意
して収納しておく第一のカセット部７と、カセット部か
ら基板保持部へ該基板をセットするための基板ローデイ
ング部と、不要膜を除去した後に、処理済み基板を収納
する第二カセット部８と、基板保持部３から第二カセッ
ト部８へ基板をアンロードするアンロード部とを設けて
いる。この基板ローデイング部と、アンロード部につい
ては、従来より、フオトマスク処理、ウエハ処理等で行
われている方式で、基板を複数枚収納したカセット下に
ヴァキュームチャック式基板保持部を位置させ、カセッ
トを上下させ、所定の位置にてヴァキュームチャック式
基板保持部へ基板をローデイング、または、所定の位置
にてヴァキュームチャック式基板保持部からカセットに
アンローデイングさせるものでよい。In addition to the above-mentioned structure, the apparatus of the present invention has a first cassette section 7 for preparing and accommodating a substrate for a processing substrate and a substrate holding from the cassette section in addition to the above-mentioned configuration. The substrate loading unit for setting the substrate in the unit, the second cassette unit 8 for storing the processed substrate after removing the unnecessary film, and the substrate unloading from the substrate holding unit 3 to the second cassette unit 8 An unload section is provided. For the substrate loading and unloading sections, the vacuum chuck type substrate holding section is located under the cassette containing a plurality of substrates by the method conventionally used for photomask processing, wafer processing, etc. It may be moved up and down to load the substrate to the vacuum chuck type substrate holding unit at a predetermined position, or to unload the substrate from the vacuum chuck type substrate holding unit to the cassette at a predetermined position.
【０００８】[0008]
【作用】本発明の装置においては、 （１）基板の不要膜部を除去するための治具が、処理さ
れる塗布基板の外周の処理部の一部覆う、除去ヘッド
と、溶液トラップがドライポンプを介して配管された溶
剤供給配管部と、真空排気部と、除去された不要部の溶
解溶液のトラップ部とからなり、従来の、溶剤浸漬によ
る不要膜の除去とは異なり、人手の要らない、自動化処
理を可能とし、品質的にも安定したものとしている。 （２）除去ヘッド部は、位置センサーにより位置管理さ
れながら、ヘッド駆動部により塗布基板との位置関係を
調整されていることより、処理基板の移動による振動等
の位置変化に対応できるものとし、除去ヘット部は固定
配置され、処理基板の移動により基板周辺の移動辺方向
の不要膜を除去することにより、その辺方向全体の除去
を、基板の移動による振動等のヘッドとの相対位置変化
にも係わらず、正確に確実にでき、基板の膜除去部以外
の領域への影響がないものとしている。 （３）処理基板の向きを９０度回転板させる回転部を有
していることにより、処理基板の相対する辺部をかえる
ことができ、処理基板の全周にわたり不要膜の除去を可
能としている。したがって、一方方向の直線移動だけ
で、処理基板の全周にわたり不要膜の除去が可能で、装
置のコンパクト化を可能としている。又、インライン化
も可能としている。 （４）又、処理基板は、ヴァキュームチャック基板保持
部により保持され、基板保持部は、Ｘ、Ｙ、Ｚ駆動でき
るため、基板に対する位置管理、除去治具に対する位置
管理、基板のロード、アンロードに対する位置管理が有
効にできる。 （５）又、基板保持部、ＸＹＺ駆動部が一体となって搬
送部により、直線搬送されるだけで、基板のローデイン
グ位置、除去すべき所定の位置（除去治具位置）、アン
ロード位置へ移動でき、装置自体が簡単でコンパクトな
ものとなりえる。 等の作用を奏するものである。In the apparatus of the present invention, (1) the jig for removing the unnecessary film portion of the substrate covers a part of the processing portion on the outer periphery of the coated substrate to be processed, and the removal head and the solution trap are dry. It consists of a solvent supply piping part that is piped through a pump, a vacuum exhaust part, and a trap part for the dissolved solution in the removed unnecessary part. No, it enables automated processing and is stable in quality. (2) Since the removal head unit is position-controlled by the position sensor and the positional relationship with the coating substrate is adjusted by the head driving unit, it is possible to cope with a positional change such as vibration due to movement of the processing substrate, The removal head portion is fixedly arranged, and by removing the unnecessary film in the moving side direction around the substrate by moving the processing substrate, the removal in the entire side direction is performed by changing the relative position with the head such as vibration due to the movement of the substrate. Despite this, it is supposed that it can be done accurately and surely, and there is no effect on the region other than the film removal portion of the substrate. (3) Since the processing substrate has a rotating portion that rotates the orientation of the processing substrate by 90 degrees, the opposite sides of the processing substrate can be changed, and unnecessary films can be removed over the entire circumference of the processing substrate. . Therefore, the unnecessary film can be removed over the entire circumference of the processed substrate only by linear movement in one direction, and the apparatus can be made compact. In addition, it is possible to use inline. (4) Further, since the processed substrate is held by the vacuum chuck substrate holding unit, and the substrate holding unit can be driven in X, Y, and Z, position management for the substrate, position management for the removal jig, loading and unloading of the substrate. Location management for can be enabled. (5) In addition, the substrate holding unit and the XYZ drive unit are integrally moved to the loading position of the substrate, the predetermined position (removing jig position) to be removed, and the unloading position only by being linearly conveyed by the conveying unit. It can be moved and the device itself can be simple and compact. And the like.
【０００９】[0009]
【実施例】本発明の実施例１を以下、図１にそって説明
する。図１は実施例の装置機能の概略を図示したイメー
ジ図である。本装置により、位相シフトフオトマスク用
の基板にシフターとしてのＳＯＧ膜を塗布、乾燥した基
板の不要膜の除去をおこなった。図１において、ＳＯＧ
膜塗布処理基板２をテフロンからなる第一カセット７に
セットし、基板保持部３をローデングの所定の位置に合
わせ、ローダー部より基板２を基板保持部３の所定位置
に搭載した。処理基板２を搭載した基板保持部３は、搬
送部により、直線搬送され、先ず、第一の不要膜処理部
へと移動される。ここには、処理基板の移動方向辺側
に、基板が移動時に基板の外周の不要膜の一部を覆うよ
うに、基板を挟んで一対の不要膜除去治具固定配置され
ており、基板２は第一の不要膜処理部を通過する際、搬
送方向の相対する２辺側の不要膜が除去される。次い
で、基板回転部へと搬送され、基板の向きを９０度変
え、第二の不要膜処理部へと直線搬送移動される。ここ
にも、処理基板の移動方向辺側に、基板が移動時に基板
の外周の不要膜の一部を覆うように、基板を挟んで一対
の不要膜除去治具固定配置されており、基板２は第二の
不要膜処理部を通過する際、搬送方向の相対する２辺側
の不要膜が除去され、基板の全周辺にわたり、不要膜の
除去が完了した。次いで、処理された基板は、更に直線
搬送され、アンロード部のある位置まで移動され、所定
位置にセットした後、第二カセット８収納した。除去ヘ
ッド４は処理基板２の外周の不要膜に対抗接するよう
に、位置センサーにより制御され、所定の位置にセット
された状態で、減圧ライン部（吸引口）を減圧した状態
で、溶剤供給ラインにより溶剤を不要膜に作用させて不
要な厚膜化部を溶解し、溶解された厚膜化部を減圧ライ
ンで吸引しながら、除去を行った。尚、基板、基板保持
部、除去治具、搬送部、カセットローデイング部、アン
ローデイング部の制御はセンサー等により関連づけて制
御部で行っているものである。尚、実施例１は、不要膜
除去処理専用の装置であるが、ロード側を基板を回転塗
布する側とすれば、基板塗布から不要膜除去までを一連
の装置とすることも可で、更にアンロード側を次工程搬
送部とすれば、全体として不要膜除去処理部を一連の処
理装置の中にインライン化してセットすることも可能で
ある。カセット毎の取替を考慮した場合には、他のプロ
セスとのインラインでの連続処理も可能となる。Embodiment 1 Embodiment 1 of the present invention will be described below with reference to FIG. FIG. 1 is an image diagram showing the outline of the device function of the embodiment. With this apparatus, the SOG film as a shifter was applied to the substrate for the phase shift photomask, and the unnecessary film on the dried substrate was removed. In FIG. 1, SOG
The film coating substrate 2 was set in the first cassette 7 made of Teflon, the substrate holder 3 was aligned with a predetermined position for loading, and the substrate 2 was mounted on the substrate holder 3 by the loader unit. The substrate holding unit 3 on which the processed substrate 2 is mounted is linearly transported by the transport unit and first moved to the first unnecessary film processing unit. Here, a pair of unnecessary film removing jigs are fixedly disposed on the side of the processing substrate in the moving direction so that the substrate covers a part of the unnecessary film on the outer periphery of the substrate when the substrate is moved. When passing through the first unnecessary film processing unit, the unnecessary films on the two opposite sides in the transport direction are removed. Next, the substrate is transported to the substrate rotating unit, the orientation of the substrate is changed by 90 degrees, and linearly transported to the second unnecessary film processing unit. Also here, a pair of unnecessary film removing jigs are fixedly arranged on both sides of the processing substrate in the moving direction so that the substrate covers a part of the unnecessary film on the outer periphery of the substrate when the substrate is moved. When passing through the second unnecessary film processing section, the unnecessary films on the two sides opposite to each other in the transport direction were removed, and the removal of the unnecessary film was completed over the entire periphery of the substrate. Next, the processed substrate was further conveyed linearly, moved to a position where the unloading section was located, set at a predetermined position, and then stored in the second cassette 8. The removal head 4 is controlled by a position sensor so as to oppose the unnecessary film on the outer periphery of the processing substrate 2, and is set at a predetermined position. With the decompression line section (suction port) decompressed, the solvent supply line The solvent was applied to the unnecessary film to dissolve the unnecessary thickened portion, and the dissolved thickened portion was removed while sucking the dissolved thickened portion in the decompression line. The control of the substrate, the substrate holding unit, the removing jig, the transfer unit, the cassette loading unit, and the unloading unit is performed by the control unit in association with each other by a sensor or the like. Although Example 1 is an apparatus dedicated to the unnecessary film removal processing, if the loading side is the side on which the substrate is spin-coated, it is possible to provide a series of apparatuses from substrate coating to removal of the unnecessary film. If the unload side is used as the next process transporting unit, it is possible to set the unnecessary film removal processing unit as a whole in-line in a series of processing apparatuses. In consideration of replacement for each cassette, in-line continuous processing with other processes is also possible.
【００１０】次に、本発明の実施例２を以下、図２にそ
って説明する。図２も実施例の装置機能の概略を図示し
たイメージ図である。本装置により、位相シフトフオト
マスク用の基板にシフターとしてのＳＯＧ膜を塗布、乾
燥した基板の不要膜の除去をおこなった。本実施例は、
１対の除去治具ヘッドを有する不要膜除去部を１ケ所有
するもので、処理基板２を第一のカセット７から基板保
持部へローデイングする位置と、処理済み基板を基板保
持第二のカセットへ収納するアンローデイング位置を同
じとするものである。先ず、基板２は第一のカセット７
から基板保持部へ搭載され、搬送部により、直線搬送さ
れ、先ず、不要膜処理部へと移動される。、搬送部によ
り、直線搬送され、先ず、不要膜処理部へと移動され
る。ここには、処理基板の移動方向辺側に、基板が移動
時に基板の外周の不要膜の一部を覆うように、基板を挟
んで一対の不要膜除去治具固定配置されており、基板２
は第一の不要膜処理部を通過する際、搬送方向の相対す
る２辺側の不要膜が除去される。次いで、基板回転部へ
と搬送され、基板の向きを９０度変え、搬送の向きを変
え、先の不要膜処理部へと移動され、基板２は不要膜処
理部を通過する際、搬送方向の相対する２辺側の不要膜
が除去され、基板の全周辺にわたり、不要膜の除去が完
了した。次いで、処理された基板は、更に直線搬送さ
れ、アンロード部のある位置まで移動され、所定位置に
セットした後、第二カセット８収納された。実施例２も
カセット毎の取替を考慮した場合には、他のプロセスと
のインラインでの連続処理も可能となる。処理の結果と
しては、上記いずれの実施例の場合も、処理基板２の外
端部全周にわたり、極めてきれいに不要膜は除去されて
おり、処理基板２の不要膜以外への影響はみられず、品
質的にも良好であった。位相シフトマスク作製した後に
おいてもＳＯＧ部に亀裂はみられず良好であった。上記
実施例で用いた、除去治具のヘッド部詳細は、図５に記
載のようなものであり、ヘッド部４ａは位置センサー１
８、１９でその位置管理されながら、ヘッド駆動部２０
により、処理基板の辺方向に移動させられるものであ
る。これにより、基板外周全位置での膜除去を確実にす
るものにしている。尚、ここでの減圧は大気−６００ｍ
ｍＨｇ程度で、ヘッドは約１ｍｍ以下程度にわずかに浮
いた状態で基板と接しながら、使用するのが好ましかっ
た。Next, a second embodiment of the present invention will be described below with reference to FIG. FIG. 2 is also an image diagram showing the outline of the device function of the embodiment. With this apparatus, the SOG film as a shifter was applied to the substrate for the phase shift photomask, and the unnecessary film on the dried substrate was removed. In this example,
One owns an unnecessary film removing unit having a pair of removing jig heads, and a position for loading the processed substrate 2 from the first cassette 7 to the substrate holding unit, and a second cassette for holding the processed substrate. The same unloading position is stored in the. First, the substrate 2 is the first cassette 7
From the substrate to the substrate holding unit, and is linearly transported by the transport unit, and is first moved to the unnecessary film processing unit. Then, it is linearly transported by the transport unit and first moved to the unnecessary film processing unit. Here, a pair of unnecessary film removing jigs are fixedly disposed on the side of the processing substrate in the moving direction so that the substrate covers a part of the unnecessary film on the outer periphery of the substrate when the substrate is moved.
When passing through the first unnecessary film processing unit, the unnecessary films on the two opposite sides in the transport direction are removed. Next, the substrate 2 is transferred to the substrate rotating unit, the direction of the substrate is changed by 90 degrees, the direction of the transfer is changed, and the substrate is moved to the previous unnecessary film processing unit. The unnecessary film on the opposite two sides was removed, and the removal of the unnecessary film was completed over the entire periphery of the substrate. Next, the processed substrate was further linearly conveyed, moved to a position where the unloading section was located, set at a predetermined position, and then stored in the second cassette 8. In the second embodiment as well, in consideration of replacement for each cassette, in-line continuous processing with other processes is possible. As a result of the treatment, in any of the above-described examples, the unnecessary film was removed extremely cleanly over the entire outer peripheral portion of the processing substrate 2, and no influence was observed on the processing substrate 2 other than the unnecessary film. The quality was also good. Even after the phase shift mask was manufactured, no crack was found in the SOG portion, which was good. The details of the head portion of the removing jig used in the above embodiment are as shown in FIG. 5, and the head portion 4a is the position sensor 1
The head drive unit 20 while its position is controlled by 8 and 19
Is moved in the side direction of the processing substrate. This ensures film removal at all positions on the outer periphery of the substrate. The decompression here is atmospheric-600m.
It was preferable to use the head while contacting the substrate with the head slightly floating to about 1 mm or less at about mHg.
【００１１】[0011]
【発明の効果】上記のような構成にすることにより、 （１）本発明の装置よれば、従来の手間も時間もかか
り、品質面でも安定的でない浸漬法と異なり、自動化さ
れた除去が可能で品質的にも安定したものとなる。 （２）又、本発明の膜除去装置は、直線搬送部と基板回
転部を工夫することにより、インライン化することも簡
単で、搬送系も短かくでき、装置全体をコンパク化でき
るもである。又、上記実施例１のようなもので、更に、
基板保持部とＸＹＺ駆動部との数を増やせる構造にすれ
ば、短時間処理能力を上げることも可能となる。 （３）又、本発明の装置は、基板保持部と基板保持部を
Ｘ、Ｙ、Ｚ駆動するＸＹＺ駆動部とが一体となってお
り、基板のローデイング、アンローデイング、除去処理
の位置決め等がスムーズにおこなわれるものとなる。 等の効果を奏する。EFFECTS OF THE INVENTION With the above-mentioned configuration, (1) According to the device of the present invention, it is possible to perform automated removal unlike the conventional dipping method which is labor-intensive and time-consuming and is not stable in terms of quality. The quality will be stable. (2) Further, the film removing apparatus of the present invention can be easily inlined by devising the linear transfer section and the substrate rotating section, the transfer system can be shortened, and the entire apparatus can be compacted. . Also, as in Example 1 above, further,
If the structure is such that the number of substrate holding units and XYZ driving units can be increased, it is possible to increase the processing capacity for a short time. (3) Further, in the apparatus of the present invention, the substrate holding part and the XYZ driving part for driving the substrate holding part in X, Y, and Z are integrated, so that the loading, unloading, positioning of the removal process, etc. of the substrate can be performed. It will be done smoothly. And so on.
【図１】本発明の装置の実施例のイメージ図FIG. 1 is an image diagram of an embodiment of the apparatus of the present invention.
【図２】本発明の装置の他の実施例のイメージ図FIG. 2 is an image diagram of another embodiment of the apparatus of the present invention.
【図３】本発明装置での不要膜除去治具ヘッド部の拡大
図FIG. 3 is an enlarged view of an unnecessary film removing jig head portion in the device of the present invention.
【図４】本発明装置の不要膜除去治具概要及び除去ヘッ
ド断面図FIG. 4 is an outline of a jig for removing an unnecessary film and a sectional view of a removing head of the apparatus of the present invention.
【図５】本発明装置の不要膜除去治具ヘッド部の位置セ
ンサー及び駆動部図FIG. 5 is a diagram of a position sensor and a driving unit of a head portion of an unnecessary film removing jig of the device of the present invention.
【図６】本実施例の処理時おける、基板保持部、駆動
部、搬送部を示す拡大図FIG. 6 is an enlarged view showing a substrate holding unit, a drive unit, and a transfer unit during the processing of this embodiment.
【図７】本発明の装置の不要膜除去治具の原理を説明す
るための図FIG. 7 is a diagram for explaining the principle of the unnecessary film removing jig of the apparatus of the present invention.
１ 不要膜除去装置 ２ 未処理基板 ２, 処理基板 ３ 基板保持部 ３, ヴァキュームチャック部 ４ 除去治具 ４ａ 除去治具の除去ヘッド ４ｂ 除去治具の除去ヘッド支持部 ５ 搬送部 ６ 制御部 ７ 第一カセット ８ 第二カセット ９ ＸＹＺ駆動部 １０ 基板回転部 １１ ドライポンプ １２ 溶解溶液トラップ部 １３ 溶解用溶液 １４ 平坦部 １５ 厚膜化部 １６ １６, 減圧ライン部 １６ａ １６ａ, 減圧ライン部端部（吸引口） １７ １７, 溶剤供給ライン部 １７ａ １７ａ, 溶剤供給ライン端部 １８ １８ 真空排気 １９ 表面位置センサー（高さ方向位置セ
ンサー） ２０ 基板端部位置センサー ２１ ヘッド駆動部（モータ）1 Unnecessary Film Removal Device 2 Unprocessed Substrate 2 , Processed Substrate 3 Substrate Holding Section 3 , Vacuum Chuck Section 4 Removal Jig 4a Removal Jig Removal Head 4b Removal Jig Removal Head Support 5 Conveyor 6 Control 7 One cassette 8 Second cassette 9 XYZ drive unit 10 Substrate rotation unit 11 Dry pump 12 Dissolution solution trap unit 13 Dissolution solution 14 Flat part 15 Thick film formation unit 16 16 , Decompression line part 16a 16a , Decompression line part end (suction Mouth) 17 17 , solvent supply line part 17a 17a , solvent supply line end part 18 18 vacuum exhaust 19 surface position sensor (height direction position sensor) 20 substrate end position sensor 21 head drive part (motor)
─────────────────────────────────────────────────────
─────────────────────────────────────────────────── ───
【手続補正書】[Procedure amendment]
【提出日】平成５年８月６日[Submission date] August 6, 1993
【手続補正１】[Procedure Amendment 1]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】特許請求の範囲[Name of item to be amended] Claims
【補正方法】変更[Correction method] Change
【補正内容】[Correction content]
【特許請求の範囲】[Claims]
Claims (3)
不要膜を、基板を直線搬送させ、基板辺方向に移動する
際、基板のサイドから除去治具により、除去する処理を
行う装置であって、少なくとも、処理される塗布基板を
保持する基板保持部と、基板保持部をＸ、Ｙ、Ｚ駆動す
るＸＹＺ駆動部と、基板保持部とＸＹＺ駆動部とを直線
搬送する直線搬送部と処理基板の向きを９０度回転させ
る回転部と、不要膜を除去するための除去治具と、上記
の基板保持部、ＸＹＺ駆動部、搬送部、除去治具とを位
置センサー等で関連づけて制御する制御部とからなり、
該基板保持部は処理される塗布基板を基板端の四隅にて
ヴァキュームチャックにより保持し、ＸＹＺ駆動部と一
体で、直線搬送部により直線搬送され、該不要膜を除去
するための除去治具は、不要膜を溶剤分により溶解さ
せ、減圧して除去する方式のもので、処理される塗布基
板の外周の処理の一部を覆い処理を行う除去ヘッド部を
有し、除去ヘッド部は、位置センサーにより位置管理さ
れながら、ヘッド駆動部により塗布基板との位置関係を
調整され、基板の移動により移動方向辺の不要膜を除去
するもので、直線搬送される処理基板の移動領域の、処
理基板の移動方向辺両側に、処理時に処理される塗布基
板の外周の処理部の一部を覆うように固定配置されてい
ることを特徴とする不要膜除去装置。1. An apparatus for performing a process of removing an unnecessary film on a peripheral portion of a substrate coated by spin coating from a side of the substrate by a removal jig when the substrate is linearly conveyed and moved in the substrate side direction. And at least a substrate holding unit that holds the coated substrate to be processed, an XYZ driving unit that drives the substrate holding unit in X, Y, and Z, and a linear transport unit that linearly transports the substrate holding unit and the XYZ driving unit, and processing. A rotating unit for rotating the orientation of the substrate by 90 degrees, a removing jig for removing an unnecessary film, the substrate holding unit, the XYZ driving unit, the transfer unit, and the removing jig are associated with each other by a position sensor and controlled. It consists of a control unit,
The substrate holding unit holds the coated substrate to be processed by vacuum chucks at the four corners of the substrate end, is integrated with the XYZ driving unit, is linearly conveyed by the linear conveying unit, and is a removal jig for removing the unnecessary film. , A method in which an unnecessary film is dissolved by a solvent content and removed under reduced pressure, and has a removal head section for covering a part of processing on the outer periphery of a coated substrate to be processed, and the removal head section While the position is controlled by the sensor, the head drive unit adjusts the positional relationship with the coating substrate, and the unnecessary film on the side in the moving direction is removed by the movement of the substrate. An unnecessary film removing device, which is fixedly disposed on both sides in the moving direction of the device so as to cover a part of the processing portion on the outer periphery of the coated substrate to be processed during processing.
治具において、除去ヘッドが、溶剤分のハネ防止用の、
排気手段を介して減圧される減圧端部を、処理される塗
布基板の外周の処理部の基板内側に設けたことを特徴と
する不要膜除去装置。2. A removal jig for removing an unnecessary film according to claim 1, wherein the removal head is for preventing the solvent component from splashing.
An unnecessary film removing device characterized in that a decompression end portion for decompressing through an exhaust means is provided inside a substrate of a processing portion on the outer periphery of a coated substrate to be processed.
材質がＳＯＧ膜であることを特徴とする不要膜除去装
置。3. The unnecessary film removing device according to claim 1, wherein the film material of the substrate to be processed is an SOG film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15454293A JP3324006B2 (en) | 1993-06-02 | 1993-06-02 | Unnecessary film removal device for coated substrate formed by spin coating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15454293A JP3324006B2 (en) | 1993-06-02 | 1993-06-02 | Unnecessary film removal device for coated substrate formed by spin coating |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH06342754A true JPH06342754A (en) | 1994-12-13 |
| JP3324006B2 JP3324006B2 (en) | 2002-09-17 |
Family
ID=15586540
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15454293A Expired - Lifetime JP3324006B2 (en) | 1993-06-02 | 1993-06-02 | Unnecessary film removal device for coated substrate formed by spin coating |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3324006B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006216253A (en) * | 2005-02-01 | 2006-08-17 | Dainippon Screen Mfg Co Ltd | Removing device |
| JP2010182755A (en) * | 2009-02-03 | 2010-08-19 | Tokyo Electron Ltd | Substrate processor and substrate processing method |
| JP2013043106A (en) * | 2011-08-23 | 2013-03-04 | Dainippon Screen Mfg Co Ltd | Substrate treatment apparatus |
-
1993
- 1993-06-02 JP JP15454293A patent/JP3324006B2/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006216253A (en) * | 2005-02-01 | 2006-08-17 | Dainippon Screen Mfg Co Ltd | Removing device |
| JP2010182755A (en) * | 2009-02-03 | 2010-08-19 | Tokyo Electron Ltd | Substrate processor and substrate processing method |
| JP4696165B2 (en) * | 2009-02-03 | 2011-06-08 | 東京エレクトロン株式会社 | Substrate processing apparatus and substrate processing method |
| JP2013043106A (en) * | 2011-08-23 | 2013-03-04 | Dainippon Screen Mfg Co Ltd | Substrate treatment apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3324006B2 (en) | 2002-09-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2919925B2 (en) | Processing equipment | |
| JPH1043666A (en) | Method and apparatus for forming applied film | |
| JP4570054B2 (en) | Substrate processing equipment | |
| KR19980019115A (en) | COATING APPARATUS FOR SEMICONDUCTOR PROCESS | |
| JP2000124127A (en) | Resist application/developing apparatus, substrate heat treatment device and substrate transfer apparatus used therefor | |
| JPH06342754A (en) | Removing apparatus for undesired film of coated board formed by spin coating | |
| JP2002334918A (en) | Treating apparatus | |
| JP2002233808A (en) | Liquid treatment apparatus | |
| JP3324008B2 (en) | Unnecessary film removal device for coated substrate formed by spin coating | |
| JP4400877B2 (en) | Substrate processing equipment | |
| JPH07135153A (en) | Needless film removing device of coated substrate formed by spin-coating step | |
| JP2003047925A (en) | Treatment apparatus | |
| JP3353119B2 (en) | Unnecessary film removal device for coated substrate formed by spin coating | |
| JP3324011B2 (en) | Unnecessary film removal device for coated substrate formed by spin coating | |
| JP2004079614A (en) | Work processing method and its processing apparatus | |
| JPH11251405A (en) | Substrate treating equipment | |
| JP7350114B2 (en) | Substrate processing equipment and substrate processing method | |
| JP7405884B2 (en) | Substrate processing equipment | |
| JP2926593B2 (en) | Substrate processing apparatus, resist processing apparatus, substrate processing method, and resist processing method | |
| JPH09153538A (en) | Substrate processor | |
| JP2002151404A (en) | Peripheral edge removing and processing apparatus | |
| JP2005270932A (en) | Coating film forming apparatus | |
| TW202339075A (en) | Substrate processing apparatus and substrate processing method | |
| JP2000150357A (en) | Method and device for resist coating process | |
| JP2926214B2 (en) | Apparatus and method for manufacturing substrate to be processed |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20020514 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080705 Year of fee payment: 6 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090705 Year of fee payment: 7 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090705 Year of fee payment: 7 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100705 Year of fee payment: 8 |