JP3324006B2 - Unnecessary film removal device for coated substrate formed by spin coating - Google Patents
Unnecessary film removal device for coated substrate formed by spin coatingInfo
- Publication number
- JP3324006B2 JP3324006B2 JP15454293A JP15454293A JP3324006B2 JP 3324006 B2 JP3324006 B2 JP 3324006B2 JP 15454293 A JP15454293 A JP 15454293A JP 15454293 A JP15454293 A JP 15454293A JP 3324006 B2 JP3324006 B2 JP 3324006B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- unit
- processing
- unnecessary film
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は，回転塗布によって形成
された膜の不要部分の除去をおこなうための装置に関す
るもので、ＬＳＩ、超ＬＳＩなどの製造に用いられるフ
オトマスク用基板、フオトマスクやＬＣＤ基板等に対す
る塗布に係り、特に微細なパターンを高密度に形成する
際に用いられる位相シフトフオトマスク基板、位相シフ
トフオトマスクのＳＯＧの塗布膜の不要膜除去に有効な
装置に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for removing unnecessary portions of a film formed by spin coating, and more particularly to a substrate for a photomask, a photomask or an LCD substrate used in the manufacture of LSIs, VLSIs and the like. More particularly, the present invention relates to a phase shift photomask substrate used for forming a fine pattern at a high density and an apparatus effective for removing an unnecessary SOG coating film of the phase shift photomask.
【０００２】[0002]
【従来の技術】従来より、ＬＳＩ、超ＬＳＩなどの製造
に用いられるフオトマスク用基板、フオトマスク、ＬＣ
Ｄ基板にたいする塗布膜においては、特に微細なパター
ンを高密度に形成する際に用いられる位相シフトフオト
マスク基板、位相シフトフオトマスクの塗布膜において
は、回転塗布によって形成された塗布膜は、基板が四角
形状のため、基板の周辺部や四辺端部で基板中央部に較
べ塗布膜厚が厚くなり、これらの厚膜化された部分は、
基板周辺部であるため、搬送、プロセス処理において部
分的に破壊され破片が飛散することがあり、その破片が
欠陥の一因となっていることが知られている。位相シフ
トフオトマスク作製におけるＳＯＧ膜の塗布の場合にお
いては、厚膜化され領域では、膜厚自身の応力で、膜自
身が破壊してしまい、基板外周部の亀裂が基板の中央部
まで伸びることもあり、破壊により発生した破片がその
後のプロセス処理等で欠陥の一因となっていることが知
られている。特に、位相シフトフオトマスク作製におけ
るＳＯＧ膜の場合には膜厚制御面でも公差±１０ｎｍ程
度必要と、フオトレジストと比較すると精度が１桁程度
厳しいもので、できるだけ除去処理部からの影響がでな
いことが必要とされているが、通常の溶剤浸漬による除
去法では、基板外周部の処理部からの影響がでて膜厚に
変化が生じてしまうため、厚膜化された部分を除去処理
部以外の領域へ影響しないよう除去することが求められ
ていた。この基板の厚膜部を溶剤により浸漬して除去す
る方法は、四角形の基板の場合、基板の各辺毎に溶剤に
浸漬する必要があり、浸漬後に浸漬部の洗浄乾燥工程も
必要で、手間も時間もかかるものであり、基板が四角形
状であることの特殊性もあり、回転しながら膜を除去す
る溶剤をかけることもできず、人手の要らない、自動処
理の装置としてはよいものがなかった。2. Description of the Related Art Conventionally, photomask substrates, photomasks, and LCs used in the manufacture of LSIs, VLSIs, etc.
In a coating film for the D substrate, a phase shift photomask substrate used particularly when a fine pattern is formed at a high density, and in a coating film of a phase shift photomask, the coating film formed by spin coating is a substrate. Because of the square shape, the coating film thickness becomes thicker at the periphery of the substrate and at the edges of the four sides than at the center of the substrate, and these thickened parts are
It is known that, since it is a peripheral part of the substrate, it may be partially destroyed during transportation and processing, and shards may be scattered, and the shards contribute to defects. In the case of applying an SOG film in the production of a phase shift photomask, in the thickened region, the film itself is broken by the stress of the film thickness itself, and a crack at the outer peripheral portion of the substrate extends to the central portion of the substrate. It is known that fragments generated by the destruction are one of the causes of defects in the subsequent processing and the like. In particular, in the case of an SOG film in the production of a phase shift photomask, a tolerance of about ± 10 nm is required in the film thickness control surface. However, in a normal removal method using a solvent immersion, the thickness of the film is changed due to the influence of the processing portion on the outer peripheral portion of the substrate. It has been demanded to remove so as not to affect the region. In the case of a rectangular substrate, it is necessary to immerse the thick film portion of the substrate in a solvent, and in the case of a rectangular substrate, it is necessary to immerse the substrate in each side of the substrate. It takes a long time, and it has the special feature that the substrate is square, and it cannot be applied with a solvent that removes the film while rotating. Did not.
【０００３】[0003]
【発明が解決しようとする課題】本発明は、位相シフト
マフクブランクスや位相シフトマスクで用いられるＳＯ
Ｇのような高精度薄膜において、後続する工程で悪影響
をもたらす、回転塗布によって形成された膜の不要部分
を、自動的に、短時間に、不要膜部以外に影響を与える
ことなく除去できる装置を提供使用とするものである。SUMMARY OF THE INVENTION The present invention relates to a phase shift mask blank or a phase shift mask used in a phase shift mask.
An apparatus that can automatically, in a short time, remove unnecessary portions of a film formed by spin coating, which has an adverse effect in a subsequent process, on a high-precision thin film such as G without affecting other portions than the unnecessary film portion. Are provided for use.
【０００４】[0004]
【課題を解決するための手段】本発明は、このような状
況のもと、回転塗布によって形成された膜の不要部分の
除去を自動的に、短時間に、不要膜部以外に影響を与え
ることなく除去できる装置を提供するものであり、本発
明の装置は、回転塗布により塗布した基板の周辺部の不
要膜を、基板を直線搬送させ、基板辺方向に移動する
際、基板のサイドから除去治具により、除去する処理を
行う装置であって、少なくとも、処理される塗布基板２
を保持する基板保持部３と、基板保持部３をＸ、Ｙ、Ｚ
駆動するＸＹＺ駆動部９と、基板保持部３とＸＹＺ駆動
部９とを直線搬送する搬送部５と、不要膜を除去するた
めの除去治具４と、上記の基板保持部３、ＸＹＺ駆動部
９、搬送部５、除去治具４とを位置センサー等で関連づ
けて制御する制御部６とからなるものであり、本発明の
基板保持部３は、図６に記載されるように、処理される
塗布基板２を基板端で（四角基板の場合は基板の四隅に
て）ヴァキュームチャックにより保持し、ＸＹＺ駆動部
９と一体で、直線搬送部５により直線搬送される。図１
記載の装置では、処理用基板２は第一カセット７にセッ
トされた後、基板保持部３に搭載され、ＸＹＺ駆動部９
と一体で、直線搬送部５により直線搬送され、直線搬送
部の移動領域で、搬送される処理基板の各サイド側に固
定位置する、少なくとも１ケの不要膜除去治具により、
基板辺方向に移動する際、基板のサイドから除去処理さ
れるものである。不要膜部を除去された後は、処理済み
の基板を収納する第二のカセット８があるアンローデイ
ング部まで、更に搬送され、収納される。Under the above circumstances, the present invention automatically removes unnecessary portions of a film formed by spin coating on a portion other than the unnecessary film portion in a short time. The apparatus of the present invention provides an unnecessary film at the peripheral portion of the substrate, which is applied by spin coating, when the substrate is linearly conveyed and moved in the side direction of the substrate, from the side of the substrate. An apparatus for performing a removing process using a removing jig, at least a coated substrate 2 to be treated.
And X, Y, Z
An XYZ drive unit 9 for driving; a transport unit 5 for linearly transporting the substrate holding unit 3 and the XYZ drive unit 9; a removing jig 4 for removing an unnecessary film; 9, a transport unit 5, and a control unit 6 that controls the removal jig 4 in association with a position sensor or the like. The substrate holding unit 3 of the present invention is processed as shown in FIG. The coated substrate 2 is held by a vacuum chuck at the substrate end (at the four corners of the substrate in the case of a square substrate), and is linearly transported by the linear transport unit 5 integrally with the XYZ drive unit 9. FIG.
In the apparatus described, the processing substrate 2 is set in the first cassette 7 and then mounted on the substrate holding unit 3, and the XYZ driving unit 9
And at least one unnecessary film removing jig, which is linearly conveyed by the linear conveyance unit 5 and is fixedly positioned on each side of the processing substrate to be conveyed in the movement area of the linear conveyance unit.
When moving in the direction of the side of the substrate, the substrate is removed from the side of the substrate. After the unnecessary film portion is removed, it is further transported and stored to the unloading portion where the second cassette 8 for storing the processed substrate is located.
【０００５】本発明の装置の基板の不要膜部を除去する
ための治具は、図３、図４に記載のような処理される塗
布基板の外周の処理部の一部を覆い不要膜除去処理をお
こなう除去ヘッド部を有するもので、その除去ヘッド部
は、位置センサーにより位置管理されながら、ヘッド駆
動部により塗布基板との位置関係を調整され、基板の移
動により移動方向辺の不要膜を除去するもので、直線搬
送される処理基板の移動動領域の、処理基板の移動方向
辺両側に、処理時に処理される塗布基板の外周の処理部
の一部を覆うように固定配置され、その、不要膜を溶剤
分により溶解させ、減圧して除去するための吸引口であ
る、溶剤供給ライン部を減圧ライン部の空間内に設けて
なる減圧ライン端部を基板の厚膜化部に対して接近さ
せ、処理される塗布基板の基板内側にのみ配している。
不要膜除去の基本原理は、図７の、溶剤供給ライン部１
７を減圧ライン部１６の空間内に設けてなる減圧ライン
端部（吸引口）１６ａを基板２の厚膜化部１５に対して
接近させ、減圧ライン部１６を減圧して溶剤供給ライン
部１７より溶剤を作用させて厚膜化部１５を溶解し、溶
解された厚膜化部１５を減圧ライン部１６で吸引する方
式と同じである。（以下、不要膜部を溶剤分により溶解
させ、減圧して除去する方式と言う。）A jig for removing an unnecessary film portion of a substrate of the apparatus of the present invention covers a part of a processing portion on an outer periphery of a coated substrate to be processed as shown in FIGS. It has a removal head unit that performs processing, the removal head unit is controlled in position by a position sensor, the positional relationship with the application substrate is adjusted by the head drive unit, and the unnecessary film on the side in the movement direction is In the removal, the moving area of the processing substrate that is linearly transported, on both sides in the moving direction side of the processing substrate, is fixedly disposed so as to cover a part of the processing portion on the outer periphery of the coating substrate that is processed during processing, The solvent supply line section is provided in the space of the pressure reducing line section, which is a suction port for dissolving the unnecessary film by the solvent component and removing the layer under reduced pressure. Application to be approached and processed It is coordinated only to the substrate inside of the plate.
The basic principle of the unnecessary film removal is shown in FIG.
7 is provided in the space of the decompression line section 16, the end (a suction port) 16 a of the decompression line is brought closer to the thickening section 15 of the substrate 2, and the decompression line section 16 is decompressed to supply the solvent supply line section 17. This is the same as the method in which the solvent is made to act to dissolve the thickened portion 15 and the dissolved thickened portion 15 is sucked by the decompression line portion 16. (Hereinafter, it is referred to as a method of dissolving an unnecessary film portion with a solvent and removing the unnecessary film portion under reduced pressure.)
【０００６】本発明装置の図３、図４に記載の不要膜部
を除去するための治具は、上記の不要膜部を溶剤分によ
り溶解させ、減圧して除去する方式のもので、図４の場
合には、除去ヘット４ａに、ドライポンプ１１で減圧さ
れて溶解用溶液１３が供給され、減圧ライン端部１６ａ
で不要膜の溶解がおこなわれ、溶解された不要膜は、ド
ライポンプ１１で減圧吸引され、減圧ライン端部１６ａ
を通し、溶解溶液トラップ部１２へ除去される。溶剤供
給ライン部１７を減圧ライン部１６の空間内に設けてな
る減圧ライン端部（吸引口）１６ａを基板２の厚膜化部
１５に対して接近させ、減圧ライン１６を減圧して溶剤
供給ライン１７により溶剤を作用させて厚膜化部１５を
溶解し、溶解された厚膜化部１５を減圧ラインで吸引す
る。本発明の装置は、この不要膜除去治具のヘッド部
を、位置センサーにより位置管理し、ヘッド駆動部によ
り塗布基板との位置関係を調整しながら、基板の移動に
より辺方向の不要膜を除去するもので、直線搬送部の移
動領域の、処理基板の移動方向辺両側に、処理時に処理
される塗布基板の外周の処理部の一部を覆うように固定
配置されている。除去ヘッド部は、処理基板の全ての外
周辺側の不要膜を除去できるように、適宜配置固定配置
されるもので、処理基板の各辺側に対し少なくとも１ケ
配置される。ヘッドの形状も、基板の 辺方向の移動に
あわせ、辺に、接することができるよう図３、図４に記
載のようになっている。図４において、１８の排気はハ
ネ防止のための排気部で、減圧端部を処理される基板の
外周の処理部の基板内側に設けてある。The jig for removing the unnecessary film portion shown in FIGS. 3 and 4 of the apparatus of the present invention is of a type in which the above-mentioned unnecessary film portion is dissolved by a solvent component and is removed under reduced pressure. In the case of No. 4, the solution for dissolution 13 is supplied to the removal head 4a by reducing the pressure by the dry pump 11 and the pressure reducing line end 16a
The unnecessary film is dissolved by the vacuum pump, and the dissolved unnecessary film is sucked under reduced pressure by the dry pump 11, and the end of the reduced pressure line 16a.
Through the dissolving solution trap section 12. The solvent supply line section 17 is provided in the space of the pressure reduction line section 16, and the pressure reduction line end (suction port) 16 a is brought close to the thickened section 15 of the substrate 2, and the pressure reduction line 16 is reduced in pressure to supply the solvent. The solvent is caused to act on the line 17 to dissolve the thickened portion 15, and the dissolved thickened portion 15 is sucked by the pressure reduction line. The apparatus of the present invention removes unnecessary films in the side direction by moving the substrate while controlling the position of the head portion of the unnecessary film removing jig by the position sensor and adjusting the positional relationship with the application substrate by the head driving unit. It is fixedly disposed on both sides of the moving area of the linear transport unit in the moving direction side of the processing substrate so as to cover a part of the processing unit on the outer periphery of the coating substrate to be processed at the time of processing. The removal head unit is appropriately arranged and fixed so as to remove all unnecessary films on the outer peripheral side of the processing substrate, and is disposed at least one for each side of the processing substrate. The shape of the head is also as shown in FIGS. 3 and 4 so that the head can be in contact with the side in accordance with the movement of the substrate in the side direction. In FIG. 4, reference numeral 18 denotes an exhaust portion for preventing splashing, which is provided inside the substrate of the processing section on the outer periphery of the substrate to be processed at the reduced pressure end.
【０００７】そして、本発明の装置は、処理の自動化の
ため、上記の構成に加え、処理基板のための基板を用意
して収納しておく第一のカセット部７と、カセット部か
ら基板保持部へ該基板をセットするための基板ローデイ
ング部と、不要膜を除去した後に、処理済み基板を収納
する第二カセット部８と、基板保持部３から第二カセッ
ト部８へ基板をアンロードするアンロード部とを設けて
いる。この基板ローデイング部と、アンロード部につい
ては、従来より、フオトマスク処理、ウエハ処理等で行
われている方式で、基板を複数枚収納したカセット下に
ヴァキュームチャック式基板保持部を位置させ、カセッ
トを上下させ、所定の位置にてヴァキュームチャック式
基板保持部へ基板をローデイング、または、所定の位置
にてヴァキュームチャック式基板保持部からカセットに
アンローデイングさせるものでよい。The apparatus according to the present invention has a first cassette unit 7 for preparing and storing substrates for processing substrates, and a substrate holding unit for storing substrates for processing substrates, in addition to the above-described configuration, in order to automate processing. A substrate loading section for setting the substrate to the section, a second cassette section 8 for storing processed substrates after removing unnecessary films, and unloading a substrate from the substrate holding section 3 to the second cassette section 8. An unload section is provided. For the substrate loading unit and the unloading unit, a vacuum chuck type substrate holding unit is positioned below a cassette containing a plurality of substrates by a method conventionally performed by photomask processing, wafer processing, etc. The substrate may be moved up and down to load the substrate into the vacuum chuck type substrate holding unit at a predetermined position, or may be unloaded from the vacuum chuck type substrate holding unit to a cassette at a predetermined position.
【０００８】[0008]
【作用】本発明の装置においては、 （１）基板の不要膜部を除去するための治具が、処理さ
れる塗布基板の外周の処理部の一部覆う、除去ヘッド
と、溶液トラップがドライポンプを介して配管された溶
剤供給配管部と、真空排気部と、除去された不要部の溶
解溶液のトラップ部とからなり、従来の、溶剤浸漬によ
る不要膜の除去とは異なり、人手の要らない、自動化処
理を可能とし、品質的にも安定したものとしている。 （２）除去ヘッド部は、位置センサーにより位置管理さ
れながら、ヘッド駆動部により塗布基板との位置関係を
調整されていることより、処理基板の移動による振動等
の位置変化に対応できるものとし、除去ヘット部は固定
配置され、処理基板の移動により基板周辺の移動辺方向
の不要膜を除去することにより、その辺方向全体の除去
を、基板の移動による振動等のヘッドとの相対位置変化
にも係わらず、正確に確実にでき、基板の膜除去部以外
の領域への影響がないものとしている。 （３）処理基板の向きを９０度回転板させる回転部を有
していることにより、処理基板の相対する辺部をかえる
ことができ、処理基板の全周にわたり不要膜の除去を可
能としている。したがって、一方方向の直線移動だけ
で、処理基板の全周にわたり不要膜の除去が可能で、装
置のコンパクト化を可能としている。又、インライン化
も可能としている。 （４）又、処理基板は、ヴァキュームチャック基板保持
部により保持され、基板保持部は、Ｘ、Ｙ、Ｚ駆動でき
るため、基板に対する位置管理、除去治具に対する位置
管理、基板のロード、アンロードに対する位置管理が有
効にできる。 （５）又、基板保持部、ＸＹＺ駆動部が一体となって搬
送部により、直線搬送されるだけで、基板のローデイン
グ位置、除去すべき所定の位置（除去治具位置）、アン
ロード位置へ移動でき、装置自体が簡単でコンパクトな
ものとなりえる。 等の作用を奏するものである。According to the apparatus of the present invention, (1) a jig for removing an unnecessary film portion of a substrate covers a part of a processing portion on an outer periphery of a coating substrate to be processed; Consisting of a solvent supply pipe section connected via a pump, a vacuum exhaust section, and a trap section for the dissolved solution of the removed unnecessary section, unlike conventional removal of an unnecessary film by immersion in a solvent, it requires manual operation. No, automatic processing is possible and quality is stable. (2) The position of the removal head unit is controlled by the position sensor, and the positional relationship with the application substrate is adjusted by the head driving unit. The removal head is fixedly arranged, and by removing the unnecessary film in the direction of the moving side around the substrate by moving the processing substrate, the removal of the entire side direction can be changed by the relative position change with the head such as vibration due to the movement of the substrate. Nevertheless, it can be accurately and reliably performed, and has no effect on areas other than the film-removed portion of the substrate. (3) By having a rotating part for rotating the processing substrate by 90 degrees, the opposite side of the processing substrate can be changed, and unnecessary films can be removed over the entire circumference of the processing substrate. . Therefore, the unnecessary film can be removed over the entire circumference of the processing substrate only by linear movement in one direction, and the apparatus can be made compact. It is also possible to inline. (4) The processing substrate is held by the vacuum chuck substrate holding unit, and the substrate holding unit can be driven in X, Y, and Z directions. Therefore, position management for the substrate, position management for the removing jig, loading and unloading of the substrate. Location management can be enabled. (5) In addition, the substrate holding unit and the XYZ drive unit are integrated and linearly transported by the transport unit, and the substrate is moved to the loading position, the predetermined position to be removed (removal jig position), and the unload position. It can be moved and the device itself can be simple and compact. And so on.
【０００９】[0009]
【実施例】本発明の実施例１を以下、図１にそって説明
する。図１は実施例の装置機能の概略を図示したイメー
ジ図である。本装置により、位相シフトフオトマスク用
の基板にシフターとしてのＳＯＧ膜を塗布、乾燥した基
板の不要膜の除去をおこなった。図１において、ＳＯＧ
膜塗布処理基板２をテフロンからなる第一カセット７に
セットし、基板保持部３をローデングの所定の位置に合
わせ、ローダー部より基板２を基板保持部３の所定位置
に搭載した。処理基板２を搭載した基板保持部３は、搬
送部により、直線搬送され、先ず、第一の不要膜処理部
へと移動される。ここには、処理基板の移動方向辺側
に、基板が移動時に基板の外周の不要膜の一部を覆うよ
うに、基板を挟んで一対の不要膜除去治具固定配置され
ており、基板２は第一の不要膜処理部を通過する際、搬
送方向の相対する２辺側の不要膜が除去される。次い
で、基板回転部へと搬送され、基板の向きを９０度変
え、第二の不要膜処理部へと直線搬送移動される。ここ
にも、処理基板の移動方向辺側に、基板が移動時に基板
の外周の不要膜の一部を覆うように、基板を挟んで一対
の不要膜除去治具固定配置されており、基板２は第二の
不要膜処理部を通過する際、搬送方向の相対する２辺側
の不要膜が除去され、基板の全周辺にわたり、不要膜の
除去が完了した。次いで、処理された基板は、更に直線
搬送され、アンロード部のある位置まで移動され、所定
位置にセットした後、第二カセット８収納した。除去ヘ
ッド４は処理基板２の外周の不要膜に対抗接するよう
に、位置センサーにより制御され、所定の位置にセット
された状態で、減圧ライン部（吸引口）を減圧した状態
で、溶剤供給ラインにより溶剤を不要膜に作用させて不
要な厚膜化部を溶解し、溶解された厚膜化部を減圧ライ
ンで吸引しながら、除去を行った。尚、基板、基板保持
部、除去治具、搬送部、カセットローデイング部、アン
ローデイング部の制御はセンサー等により関連づけて制
御部で行っているものである。尚、実施例１は、不要膜
除去処理専用の装置であるが、ロード側を基板を回転塗
布する側とすれば、基板塗布から不要膜除去までを一連
の装置とすることも可で、更にアンロード側を次工程搬
送部とすれば、全体として不要膜除去処理部を一連の処
理装置の中にインライン化してセットすることも可能で
ある。カセット毎の取替を考慮した場合には、他のプロ
セスとのインラインでの連続処理も可能となる。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiment 1 of the present invention will be described below with reference to FIG. FIG. 1 is an image diagram schematically illustrating the device functions of the embodiment. With this apparatus, an SOG film as a shifter was applied to a substrate for a phase shift photomask, and an unnecessary film on the dried substrate was removed. In FIG. 1, SOG
The film-coated substrate 2 was set in the first cassette 7 made of Teflon, the substrate holder 3 was set at a predetermined position for loading, and the substrate 2 was mounted at a predetermined position on the substrate holder 3 by the loader unit. The substrate holding unit 3 on which the processing substrate 2 is mounted is linearly transported by the transport unit, and is first moved to the first unnecessary film processing unit. Here, a pair of unnecessary film removing jigs is fixedly arranged on the side of the processing substrate in the moving direction side so as to cover a part of the unnecessary film on the outer periphery of the substrate when the substrate moves. When passing through the first unnecessary film processing unit, unnecessary films on two opposite sides in the transport direction are removed. Next, the substrate is transported to the substrate rotating unit, the direction of the substrate is changed by 90 degrees, and the substrate is linearly transported and moved to the second unnecessary film processing unit. Here, a pair of unnecessary film removing jigs is fixedly arranged on the side of the processing substrate in the moving direction so as to cover a part of the unnecessary film on the outer periphery of the substrate when the substrate moves. When passing through the second unnecessary film processing unit, the unnecessary films on two opposite sides in the transport direction were removed, and the removal of the unnecessary films was completed over the entire periphery of the substrate. Next, the processed substrate was further linearly conveyed, moved to a position where the unload section was located, set at a predetermined position, and then stored in the second cassette 8. The removal head 4 is controlled by a position sensor so as to come into contact with an unnecessary film on the outer periphery of the processing substrate 2. When the removal head 4 is set at a predetermined position, the pressure in the pressure reducing line section (suction port) is reduced. The solvent was allowed to act on the unnecessary film to dissolve the unnecessary thickened portion, and the dissolved thickened portion was removed while being sucked by a reduced pressure line. The control of the substrate, the substrate holding unit, the removing jig, the transport unit, the cassette loading unit, and the unloading unit is performed by the control unit in association with a sensor or the like. The first embodiment is an apparatus dedicated to unnecessary film removal processing. However, if the load side is a side on which a substrate is spin-coated, a series of apparatuses from substrate application to unnecessary film removal can be used. If the unloading side is the next-step transfer section, the unnecessary film removal processing section as a whole can be set inline in a series of processing apparatuses. When replacement for each cassette is considered, continuous processing in-line with another process is also possible.
【００１０】次に、本発明の実施例２を以下、図２にそ
って説明する。図２も実施例の装置機能の概略を図示し
たイメージ図である。本装置により、位相シフトフオト
マスク用の基板にシフターとしてのＳＯＧ膜を塗布、乾
燥した基板の不要膜の除去をおこなった。本実施例は、
１対の除去治具ヘッドを有する不要膜除去部を１ケ所有
するもので、処理基板２を第一のカセット７から基板保
持部へローデイングする位置と、処理済み基板を基板保
持第二のカセットへ収納するアンローデイング位置を同
じとするものである。先ず、基板２は第一のカセット７
から基板保持部へ搭載され、搬送部により、直線搬送さ
れ、先ず、不要膜処理部へと移動される。、搬送部によ
り、直線搬送され、先ず、不要膜処理部へと移動され
る。ここには、処理基板の移動方向辺側に、基板が移動
時に基板の外周の不要膜の一部を覆うように、基板を挟
んで一対の不要膜除去治具固定配置されており、基板２
は第一の不要膜処理部を通過する際、搬送方向の相対す
る２辺側の不要膜が除去される。次いで、基板回転部へ
と搬送され、基板の向きを９０度変え、搬送の向きを変
え、先の不要膜処理部へと移動され、基板２は不要膜処
理部を通過する際、搬送方向の相対する２辺側の不要膜
が除去され、基板の全周辺にわたり、不要膜の除去が完
了した。次いで、処理された基板は、更に直線搬送さ
れ、アンロード部のある位置まで移動され、所定位置に
セットした後、第二カセット８収納された。実施例２も
カセット毎の取替を考慮した場合には、他のプロセスと
のインラインでの連続処理も可能となる。処理の結果と
しては、上記いずれの実施例の場合も、処理基板２の外
端部全周にわたり、極めてきれいに不要膜は除去されて
おり、処理基板２の不要膜以外への影響はみられず、品
質的にも良好であった。位相シフトマスク作製した後に
おいてもＳＯＧ部に亀裂はみられず良好であった。上記
実施例で用いた、除去治具のヘッド部詳細は、図５に記
載のようなものであり、ヘッド部４ａは位置センサー１
８、１９でその位置管理されながら、ヘッド駆動部２０
により、処理基板の辺方向に移動させられるものであ
る。これにより、基板外周全位置での膜除去を確実にす
るものにしている。尚、ここでの減圧は大気−６００ｍ
ｍＨｇ程度で、ヘッドは約１ｍｍ以下程度にわずかに浮
いた状態で基板と接しながら、使用するのが好ましかっ
た。Next, a second embodiment of the present invention will be described below with reference to FIG. FIG. 2 is an image diagram schematically illustrating the device functions of the embodiment. With this apparatus, an SOG film as a shifter was applied to a substrate for a phase shift photomask, and an unnecessary film on the dried substrate was removed. In this embodiment,
Owns one unnecessary film removing unit having a pair of removal jig heads, and loads the processing substrate 2 from the first cassette 7 to the substrate holding unit and the processed substrate into the substrate holding second cassette. The same unloading position is accommodated. First, the substrate 2 is placed in the first cassette 7
Is transferred to the substrate holding unit, is transferred linearly by the transfer unit, and is first moved to the unnecessary film processing unit. Is transported linearly by the transport unit, and is first moved to the unnecessary film processing unit. Here, a pair of unnecessary film removing jigs is fixedly arranged on the side of the processing substrate in the moving direction side so as to cover a part of the unnecessary film on the outer periphery of the substrate when the substrate moves.
When passing through the first unnecessary film processing unit, unnecessary films on two opposite sides in the transport direction are removed. Next, the substrate 2 is transferred to the substrate rotating unit, the direction of the substrate is changed by 90 degrees, the transfer direction is changed, and the substrate 2 is moved to the unnecessary film processing unit. When the substrate 2 passes through the unnecessary film processing unit, the substrate 2 moves in the transfer direction. Unnecessary films on two opposite sides were removed, and the removal of the unnecessary films was completed over the entire periphery of the substrate. Next, the processed substrate was further linearly conveyed, moved to a position where the unload section was located, set at a predetermined position, and then stored in the second cassette 8. In the second embodiment, when the replacement for each cassette is considered, continuous processing in-line with another process is also possible. As a result of the processing, in any of the above-described embodiments, the unnecessary film is removed extremely cleanly over the entire outer edge of the processing substrate 2, and no influence is observed on the processing substrate 2 other than the unnecessary film. Also, the quality was good. Even after the fabrication of the phase shift mask, no crack was observed in the SOG portion, and the result was good. The details of the head part of the removing jig used in the above embodiment are as shown in FIG. 5, and the head part 4a is the position sensor 1
While the position is managed in 8 and 19, the head driving unit 20 is controlled.
Thus, the substrate can be moved in the side direction of the processing substrate. This ensures that the film is removed at all positions on the outer periphery of the substrate. In addition, the decompression here is -600 m in the atmosphere.
It was preferable that the head be used while being in contact with the substrate with the head slightly floating at about 1 mm or less at about mHg.
【００１１】[0011]
【発明の効果】上記のような構成にすることにより、 （１）本発明の装置よれば、従来の手間も時間もかか
り、品質面でも安定的でない浸漬法と異なり、自動化さ
れた除去が可能で品質的にも安定したものとなる。 （２）又、本発明の膜除去装置は、直線搬送部と基板回
転部を工夫することにより、インライン化することも簡
単で、搬送系も短かくでき、装置全体をコンパク化でき
るもである。又、上記実施例１のようなもので、更に、
基板保持部とＸＹＺ駆動部との数を増やせる構造にすれ
ば、短時間処理能力を上げることも可能となる。 （３）又、本発明の装置は、基板保持部と基板保持部を
Ｘ、Ｙ、Ｚ駆動するＸＹＺ駆動部とが一体となってお
り、基板のローデイング、アンローデイング、除去処理
の位置決め等がスムーズにおこなわれるものとなる。 等の効果を奏する。According to the above-described structure, (1) According to the apparatus of the present invention, unlike the conventional immersion method which requires much labor and time and is not stable in terms of quality, automatic removal is possible. It is also stable in quality. (2) In addition, the film removing apparatus of the present invention can be easily in-lined, the transfer system can be shortened, and the entire apparatus can be made compact by devising the linear transfer section and the substrate rotating section. . In addition, as in the first embodiment,
If the number of the substrate holding units and the number of the XYZ driving units can be increased, it is possible to increase the processing capacity in a short time. (3) In the apparatus of the present invention, the substrate holding unit and the XYZ driving unit that drives the substrate holding unit in X, Y, and Z directions are integrated, and the substrate loading, unloading, and positioning for removal processing and the like can be performed. It will be done smoothly. And so on.
【図１】本発明の装置の実施例のイメージ図FIG. 1 is an image diagram of an embodiment of the apparatus of the present invention.
【図２】本発明の装置の他の実施例のイメージ図FIG. 2 is an image diagram of another embodiment of the apparatus of the present invention.
【図３】本発明装置での不要膜除去治具ヘッド部の拡大
図FIG. 3 is an enlarged view of an unnecessary film removing jig head part in the apparatus of the present invention.
【図４】本発明装置の不要膜除去治具概要及び除去ヘッ
ド断面図FIG. 4 is a schematic view of a jig for removing unnecessary films of the apparatus of the present invention and a sectional view of a removal head.
【図５】本発明装置の不要膜除去治具ヘッド部の位置セ
ンサー及び駆動部図FIG. 5 is a diagram showing a position sensor and a driving unit of a jig head of an unnecessary film removing jig of the apparatus of the present invention.
【図６】本実施例の処理時おける、基板保持部、駆動
部、搬送部を示す拡大図FIG. 6 is an enlarged view showing a substrate holding unit, a driving unit, and a transporting unit during processing according to the present embodiment.
【図７】本発明の装置の不要膜除去治具の原理を説明す
るための図FIG. 7 is a view for explaining the principle of an unnecessary film removing jig of the apparatus of the present invention.
１ 不要膜除去装置 ２ 未処理基板 ２, 処理基板 ３ 基板保持部 ３, ヴァキュームチャック部 ４ 除去治具 ４ａ 除去治具の除去ヘッド ４ｂ 除去治具の除去ヘッド支持部 ５ 搬送部 ６ 制御部 ７ 第一カセット ８ 第二カセット ９ ＸＹＺ駆動部 １０ 基板回転部 １１ ドライポンプ １２ 溶解溶液トラップ部 １３ 溶解用溶液 １４ 平坦部 １５ 厚膜化部 １６ １６, 減圧ライン部 １６ａ １６ａ, 減圧ライン部端部（吸引口） １７ １７, 溶剤供給ライン部 １７ａ １７ａ, 溶剤供給ライン端部 １８ １８ 真空排気 １９ 表面位置センサー（高さ方向位置セ
ンサー） ２０ 基板端部位置センサー ２１ ヘッド駆動部（モータ）DESCRIPTION OF SYMBOLS 1 Unnecessary film removal apparatus 2 Unprocessed substrate 2 , Processing substrate 3 Substrate holding part 3 , Vacuum chuck part 4 Removal jig 4a Removal head of removal jig 4b Removal head support of removal jig 5 Transporting part 6 Control part 7th One cassette 8 Second cassette 9 XYZ drive section 10 Substrate rotating section 11 Dry pump 12 Dissolution solution trap section 13 Dissolution solution 14 Flat section 15 Thickening section 16 16 , Decompression line section 16a 16a , Decompression line section end (suction) Mouth) 17 17 , solvent supply line section 17a 17a , solvent supply line end 18 18 evacuation 19 surface position sensor (height direction position sensor) 20 substrate end position sensor 21 head drive section (motor)
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 平５−114555（ＪＰ，Ａ) 特開 平２−157763（ＪＰ，Ａ) 特開 平６−250380（ＪＰ，Ａ) 特開 昭64−61917（ＪＰ，Ａ) 特開 平２−192717（ＪＰ，Ａ) 特開 平２−218467（ＪＰ，Ａ) 実開 平１−78025（ＪＰ，Ｕ) (58)調査した分野(Int.Cl.7，ＤＢ名) H01L 21/027 B05C 9/12 B05C 13/02 G03F 7/16 H01L 21/304 ──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-5-114555 (JP, A) JP-A-2-157776 (JP, A) JP-A-6-250380 (JP, A) JP-A 64-64 61917 (JP, A) JP-A-2-192717 (JP, A) JP-A-2-218467 (JP, A) JP-A-1-78025 (JP, U) (58) Fields investigated (Int. 7 , DB name) H01L 21/027 B05C 9/12 B05C 13/02 G03F 7/16 H01L 21/304
Claims (3)
不要膜を、基板を直線搬送させ、基板辺方向に移動する
際、基板のサイドから除去治具により、除去する処理を
行う装置であって、少なくとも、処理される塗布基板を
保持する基板保持部と、基板保持部をＸ、Ｙ、Ｚ駆動す
るＸＹＺ駆動部と、基板保持部とＸＹＺ駆動部とを直線
搬送する直線搬送部と処理基板の向きを９０度回転させ
る回転部と、不要膜を除去するための除去治具と、上記
の基板保持部、ＸＹＺ駆動部、搬送部、除去治具とを位
置センサー等で関連づけて制御する制御部とからなり、
該基板保持部は処理される塗布基板を基板端の四隅にて
ヴァキュームチャックにより保持し、ＸＹＺ駆動部と一
体で、直線搬送部により直線搬送され、該不要膜を除去
するための除去治具は、不要膜を溶剤分により溶解さ
せ、減圧して除去する方式のもので、処理される塗布基
板の外周の処理の一部を覆い処理を行う除去ヘッド部を
有し、除去ヘッド部は、位置センサーにより位置管理さ
れながら、ヘッド駆動部により塗布基板との位置関係を
調整され、基板の移動により移動方向辺の不要膜を除去
するもので、直線搬送される処理基板の移動領域の、処
理基板の移動方向辺両側に、処理時に処理される塗布基
板の外周の処理部の一部を覆うように固定配置され、そ
の、不要膜を溶剤分により溶解させ、減圧して除去する
ための吸引口である、溶剤供給ライン部を減圧ライン部
の空間内に設けてなる減圧ライン端部を基板の厚膜化部
に対して接近させ、処理される塗布基板の基板内側にの
み配していることを特徴とする不要膜除去装置。An apparatus for performing a process of removing an unnecessary film on a peripheral portion of a substrate applied by spin coating from a side of the substrate by a removing jig when the substrate is linearly conveyed and moved in a side direction of the substrate. A substrate holding unit for holding at least a coated substrate to be processed, an XYZ driving unit for driving the substrate holding unit in X, Y, and Z directions, and a linear transport unit for linearly transporting the substrate holding unit and the XYZ driving unit. A rotating unit for rotating the direction of the substrate by 90 degrees, a removing jig for removing an unnecessary film, and the substrate holding unit, the XYZ driving unit, the transporting unit, and the removing jig are controlled by associating them with a position sensor or the like. Consisting of a control unit,
The substrate holding unit holds the coated substrate to be processed at the four corners of the substrate end by means of a vacuum chuck, and is integrated with the XYZ drive unit, is linearly transported by the linear transport unit, and has a removal jig for removing the unnecessary film. A method in which an unnecessary film is dissolved by a solvent component and removed under reduced pressure, and has a removal head unit that covers a part of the processing on the outer periphery of the coated substrate to be processed and performs the processing. While the position is controlled by the sensor, the positional relationship with the coating substrate is adjusted by the head drive unit, and unnecessary films on the sides in the movement direction are removed by the movement of the substrate. A suction port for dissolving an unnecessary film with a solvent and removing it under reduced pressure, which is fixedly disposed on both sides in the moving direction side of the substrate so as to cover a part of a processing portion on an outer periphery of a coating substrate to be processed at the time of processing. Is The solvent supply line part is provided in the space of the decompression line part, the end of the decompression line is brought close to the thickened part of the substrate, and it is arranged only inside the substrate of the coated substrate to be processed. Unnecessary film removal equipment.
治具において、除去ヘッドが、溶剤分のハネ防止用の、
排気手段を介して減圧される減圧端部を、処理される塗
布基板の外周の処理部の基板内側に設けたことを特徴と
する不要膜除去装置。2. A removing jig according to claim 1, wherein said removing head is provided for preventing splash of a solvent.
An unnecessary film removing apparatus, wherein a reduced pressure end portion reduced in pressure through an exhaust means is provided inside a substrate of a processing unit on an outer periphery of a coated substrate to be processed.
材質がＳＯＧ膜であることを特徴とする不要膜除去装
置。3. The unnecessary film removing apparatus according to claim 1, wherein the film material of the substrate to be processed is an SOG film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15454293A JP3324006B2 (en) | 1993-06-02 | 1993-06-02 | Unnecessary film removal device for coated substrate formed by spin coating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15454293A JP3324006B2 (en) | 1993-06-02 | 1993-06-02 | Unnecessary film removal device for coated substrate formed by spin coating |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH06342754A JPH06342754A (en) | 1994-12-13 |
| JP3324006B2 true JP3324006B2 (en) | 2002-09-17 |
Family
ID=15586540
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15454293A Expired - Lifetime JP3324006B2 (en) | 1993-06-02 | 1993-06-02 | Unnecessary film removal device for coated substrate formed by spin coating |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3324006B2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006216253A (en) * | 2005-02-01 | 2006-08-17 | Dainippon Screen Mfg Co Ltd | Removing device |
| JP4696165B2 (en) * | 2009-02-03 | 2011-06-08 | 東京エレクトロン株式会社 | Substrate processing apparatus and substrate processing method |
| JP2013043106A (en) * | 2011-08-23 | 2013-03-04 | Dainippon Screen Mfg Co Ltd | Substrate treatment apparatus |
-
1993
- 1993-06-02 JP JP15454293A patent/JP3324006B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH06342754A (en) | 1994-12-13 |
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