JPH11251405A - Substrate treating equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To shorten the transfer course of a substrate and transfer the substrate in a short time by freely movably arranging a perpendicularly stretched transfer course, and installing a transferring mechanism which carries in/out the substrate to and from a treating mechanism which constitutes a first and a second treating parts. SOLUTION: A semiconductor wafer before treatment in a carrier mounted on a loader part 1 is carried out by holding the wafer with an arm installed on a transfer course 7, and carried in and mounted on an alignment stage part 6. The semiconductor wafer mounted on the alignment stage part 6 is carried in and mounted on a coating mechanism 8 and a prebaking mechanism 9, as a first treating part, by a wafer transferring mechanism 12, in which a perpendicularly stretched transfer path is movably arranged, and subjected to a specified treatment. After the treatment is finished, the semiconductor wafer is carried in and mounted on a developing mechanism 10 and a postbaking mechanism 11, as a second treating part which is arranged at a position different from the mechanism 8, 9 by the wafer transferring mechanism 12, and is subjected to a series of treatments.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate processing apparatus for performing processing such as application and development of a resist solution on a substrate such as a semiconductor wafer or an LCD substrate.

[0002]

2. Description of the Related Art In a photoresist processing apparatus, a wafer transfer apparatus using an air bearing between an application spinner section, a pre-bake section, a photosensitive section, a development spinner section, and a post-bake section is disclosed in Japanese Patent Application Laid-Open No. Sho 52-152. 2736
No. 7 discloses this.

[0003] A transfer belt is stretched between two pulleys, and a wafer placed on the transfer belt is transferred by moving the transfer belt.
No. 7 discloses this.

Japanese Patent Laid-Open Publication No. Hei 1-209737 discloses a robot in which a robot for transferring a wafer while holding it on an arm is movably provided on a rail, and transfers the wafer between a coating mechanism, a developing mechanism and a heat treatment mechanism. It is disclosed in the gazette.

[0005]

Problems to be Solved by the Invention
In the photoresist processing apparatus disclosed in Japanese Patent Publication No. 7, the wafer is linearly moved using an air bearing on a transfer path, and the wafer is transferred between many processing apparatuses. Another advantage is that the wafer transfer time is unnecessarily increased and the efficiency is reduced.

In the method of transferring a wafer using a transfer belt disclosed in Japanese Patent Application Laid-Open No. 56-91427, since the transfer path of the wafer is also linear, the size of the apparatus is increased similarly to the above-described technique, and the transfer time of the wafer is reduced. Has the advantage of increasing efficiency and decreasing efficiency.

In the technique disclosed in Japanese Patent Application Laid-Open No. Hei 1-209737, a plurality of processing mechanisms are provided separately from each other, and a wafer transfer mechanism for loading and unloading a wafer between these processing mechanisms holds the wafer on an arm. The robot unit for transferring the wafer is provided on the rail so that it can be moved on the rail. The wafer transfer path is also long, and the size of the equipment is increased as in the above-mentioned technology. Have a point.

[0008] The present invention has been made in view of the above points,
Provided is a substrate processing apparatus which can transfer a substrate between a plurality of processing mechanisms, has a short substrate transfer path, can be downsized, can perform the substrate transfer in a short time, and has a high apparatus efficiency. With the goal.

[0009]

In order to solve the above-mentioned problems, a first aspect of the present invention is to provide a vertically extending transport path, and a circumferentially arranged transport path around the transport path to process a substrate. A first processing unit having a plurality of processing mechanisms for performing processing on the substrate, the first processing unit being provided at a different height from the first processing unit, and being arranged circumferentially around the transport path; A second processing unit having a processing mechanism, and the transfer path is provided movably,
There is provided a substrate processing apparatus comprising a transfer mechanism for loading and unloading a substrate to and from a processing mechanism constituting the first processing unit and the second processing unit.

According to a second aspect of the present invention, there is provided a loader for mounting a storage container capable of storing a substrate before processing and / or a substrate after processing.
An unloader unit, and a transport mechanism for loading or unloading a substrate before processing or a substrate after processing with respect to the storage container,
A processing station provided with a plurality of processing mechanisms for performing predetermined processing on the substrate, and a substrate provided between the loader / unloader unit and the processing station, for temporarily transferring a substrate loaded or unloaded by the transport mechanism; The processing station includes a stage section on which the substrate is mounted, and the processing station includes a transport path that extends vertically, and a plurality of processing mechanisms that are disposed circumferentially around the transport path and that perform processing on the substrate. A first processing unit, which is disposed at a different height from the first processing unit;
And a second processing unit that is disposed circumferentially around the transport path and includes a plurality of processing mechanisms that perform processing on the substrate; and a second processing unit that is movably provided on the transport path and is provided with the first processing unit. There is provided a substrate processing apparatus having a transfer mechanism for loading and unloading a substrate to and from a processing mechanism constituting a second processing unit. In this case, it is preferable that the stage section is provided at a position around the transport path where the transfer mechanism can access.

According to a third aspect of the present invention, there is provided a first processing unit having a vertically extending transfer path, and a plurality of processing mechanisms disposed circumferentially around the transfer path and performing processing on a substrate. A second processing unit having a plurality of processing mechanisms arranged at a height different from that of the first processing unit and arranged circumferentially around the transfer path, for processing a substrate; A transfer mechanism that is provided movably along a path, and that loads and unloads a substrate to and from a processing mechanism that forms the first processing unit and the second processing unit; and a transfer mechanism that surrounds the transfer path. A substrate processing apparatus is provided, which is provided at an accessible position and includes a buffer unit that transfers a substrate to and from another apparatus.

According to a fourth aspect of the present invention, there is provided a loader for mounting a storage container capable of storing a substrate before processing and / or a substrate after processing.
An unloader unit, and a transport mechanism for loading or unloading a substrate before processing or a substrate after processing with respect to the storage container,
A processing station provided with a plurality of processing mechanisms for performing predetermined processing on the substrate, and a substrate provided between the loader / unloader unit and the processing station, for temporarily transferring a substrate loaded or unloaded by the transport mechanism; The processing station includes a stage section on which the substrate is mounted, and the processing station includes a transport path that extends vertically, and a plurality of processing mechanisms that are disposed circumferentially around the transport path and that perform processing on the substrate. A first processing unit, which is disposed at a different height from the first processing unit;
And a second processing unit that is disposed circumferentially around the transport path and includes a plurality of processing mechanisms that perform processing on the substrate; and a second processing unit that is movably provided on the transport path and is provided with the first processing unit. A transfer mechanism for loading and unloading a substrate to and from a processing mechanism constituting a second processing unit, and the transfer mechanism around the transport path are provided at accessible positions, and are connected to another apparatus. A substrate processing apparatus comprising: a buffer unit that transfers a substrate.

Here, the loader / unloader section can be configured to have a plurality of storage containers arranged on the same plane. Further, a cooling mechanism may be provided at a transferable position of the transport mechanism. Further, the stage section may have an alignment mechanism for positioning the substrate.

According to a fifth aspect of the present invention, there is provided a first processing unit having a vertically extending transfer path and a plurality of processing mechanisms disposed circumferentially around the transfer path and performing processing on a substrate. A second processing unit having a plurality of processing mechanisms arranged at a height different from that of the first processing unit and arranged circumferentially around the transfer path, for processing a substrate; A transfer mechanism that is provided movably along a path, and that loads and unloads a substrate to and from a processing mechanism that forms the first processing unit and the second processing unit; and forms a downflow of clean gas in the transfer path. A substrate processing apparatus, comprising: a downflow forming unit, wherein a substrate is transferred in a downflow clean gas atmosphere formed in the transport path.

In any one of the above inventions, the transfer mechanism may include at least two arms for holding the substrate. Preferably, the at least two arms are each independently drivable. In this case, in the transfer mechanism, when a substrate is carried in and out of a predetermined processing mechanism, one arm carries out a processed substrate from the processing mechanism, and the other arm carries an unprocessed substrate. It is preferable to carry it into the processing mechanism. It is preferable that the arm is covered with a cover and the inside of the cover is exhausted, or the inside of the cover is set to a negative pressure.

In any of the above inventions, a plurality of transfer mechanisms that move on the transport path can be provided. Also,
A filter mechanism for cleaning gas outside the apparatus and taking it into the apparatus can be provided above the transport path. Then, the gas purified through the filter mechanism can be formed in the transport path. As this filter, a HEPA filter can be used.

[0017] In any of the above inventions, the plurality of processing mechanisms may be provided integrally in a housing and be detachable from the housing. Further, the plurality of processing mechanisms and the transfer mechanism may be integrally provided in a housing, and the transfer mechanism may be separable from the housing.

Further, in any of the above inventions, the plurality of processing mechanisms may include a liquid processing mechanism for performing liquid processing and a thermal processing mechanism for performing thermal processing.
In this case, the first processing unit and the second processing unit may have a liquid processing mechanism and a thermal processing mechanism, respectively.

[0019]

According to the present invention, a first processing section having a plurality of processing mechanisms for processing a substrate circumferentially around a vertically extending transport path, and the first processing section. Part and arranged at a different height, and arranged circumferentially around the conveyance path,
A second processing unit having a plurality of processing mechanisms for performing processing on the substrate is disposed, and the transfer path is movable by the transfer mechanism.
Since the substrates are loaded and unloaded to and from the processing mechanisms constituting the first processing unit and the second processing unit, it is possible to load and unload the substrates to and from each processing mechanism without horizontally moving the transfer mechanism itself. As a result, the substrate transfer path can be shortened when the substrate is transferred. Therefore, it is possible to shorten the time for transferring the substrate and to achieve the miniaturization of the apparatus.

[0020]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A resist processing apparatus according to an embodiment of the present invention will be described below in detail with reference to the accompanying drawings. In FIG. 1, a loader unit 1 for mounting a carrier in which 25 semiconductor wafers before processing are stored and a carrier in which semiconductor wafers subjected to predetermined processing in the processing apparatus are mounted. Unloader unit 2 and interface unit 3 for loading and unloading wafers to and from an exposure apparatus (not shown)
A cooling unit 4 for cooling the wafer, a buffer unit 5 for temporarily storing the wafer before or after a predetermined wafer process, and an alignment stage unit 6 for adjusting the position of the placed wafer. Wafer transfer unit 7 for holding and holding a wafer between arms and loading / unloading the wafer
Are provided so as to be capable of horizontal rotation, horizontal movement, and vertical movement.

A resist coating mechanism 8 for applying a photoresist to a semiconductor wafer, a pre-bake mechanism 9 for heating and evaporating a solvent remaining in the applied photoresist, and a developing processing for a photoresist on the exposed wafer. The developing mechanism 10 and the post-baking mechanism 11 for evaporating and removing the developing solution and cleaning water remaining on the photoresist patterned by the development to enhance the adhesion between the wafer and the photoresist are substantially flush with each other. Provided,
Further, as shown in FIG. 2, the processing mechanism planes are stacked in multiple stages, and a wafer transfer mechanism 12 for loading and unloading a wafer between the processing mechanism and the alignment stage 6 is vertically moved by two. A set is provided.
The resist coating mechanism 8, the pre-bake mechanism 9, the developing mechanism 10, the post-bake mechanism 11, and the wafer transfer mechanism 12 are provided in a single housing and constitute a processing station. As shown, the interface unit 3 is provided outside the access range of the wafer transfer mechanism 12.

Each of the above-mentioned processing mechanisms is the above-mentioned wafer transfer mechanism 12.
Are provided, for example, around the circumference of the same radius. Further, the wafer transfer mechanism 12 is provided with a plurality of sets, for example, two sets of arms 13 for holding a semiconductor wafer.
Each of the arms 13 is configured to be independently extendable and retractable in the horizontal direction. When loading / unloading a semiconductor wafer into / from each of the processing mechanisms, a wafer processed by one arm 13 is unloaded from each of the processing mechanisms, and then the other. The unprocessed semiconductor wafer held by the arm 13 is carried into each of the above-described processing mechanisms so that the wafer can be efficiently loaded and unloaded. Such a loading operation is performed by the arm 13.
It moves back and forth in the same plane when viewed from the axis. In this same plane, there is some vertical movement in each processing mechanism.

At the top of each of the two sets of wafer transfer mechanisms 12, there is provided a filter section 14 for supplying a clean gas flow, such as a HEPA filter, and when loading and unloading semiconductor wafers to and from each processing mechanism. The semiconductor wafer can be transferred in, for example, a down-flow clean gas atmosphere so that dust generated from the semiconductor device does not adhere to the semiconductor wafer and lower the yield of semiconductor devices.

As shown in FIG. 3, a pulley 17 is provided on a side plate 16 which is configured to be separable from the apparatus main body, and the side plate 16 can be easily moved.
Are provided with two sets of elevating mechanisms 18 which can be independently moved up and down on rails by a motor (not shown),
The elevating mechanism 18 is provided with the wafer transfer mechanism 12. Positioning pins 19 are provided at four places around the side plate 16.
Are provided in the main body of the apparatus, and are fitted to a concave portion (not shown) to obtain a mounting reproducibility of ± 100 μm or less, so that assembly, inspection and repair of the apparatus are facilitated. In addition, for example, as shown in FIG.
In order to facilitate repairs, the apparatus is configured so that it can be rotated around the support shaft 20 and taken out of the apparatus main body.

Similarly, the pre-bake mechanism 9, the developing mechanism 10, and the post-bake mechanism 11 are configured to be able to be rotated around the support shaft 20 and taken out of the apparatus main body. As described above, the processing apparatus of this embodiment is configured.

Next, the operation of the processing apparatus of this embodiment when coating, exposing and developing a semiconductor wafer will be described. First, the unprocessed semiconductor wafer in the carrier placed on the loader unit 1 is carried out while being held by an arm provided in the transfer unit 7, and is carried in and placed on the alignment stage unit 6.

The semiconductor wafer mounted on the alignment stage 6 is positioned at a predetermined position on the alignment stage 6 by a positioning mechanism (not shown). Due to the expansion, contraction and rotation of the semiconductor wafer, the semiconductor wafer is carried out while being held by the arm 13, and is carried into the coating mechanism 8. A photoresist is applied to the semiconductor wafer loaded and placed in the application mechanism 8 and spin processing is performed, and the photoresist is uniformly applied to the surface.

The semiconductor wafer on which the photoresist is applied is applied to the coating mechanism 8 by the horizontal expansion and contraction and rotation of the arm 13 provided on the wafer transfer mechanism 12 in the same manner as described above.
And carried into the pre-bake mechanism 9.

The semiconductor wafer placed on the pre-bake mechanism 9 is subjected to a predetermined heat treatment, carried out by the wafer transfer mechanism 12 and carried on the alignment stage 6. The semiconductor wafer that has been subjected to the predetermined alignment by the alignment stage unit 6 is carried into the interface unit 3 by a predetermined operation of the wafer transfer unit 7.

The semiconductor wafer carried into the interface unit 3 is carried out to an exposure device (not shown), subjected to a predetermined exposure process, and then carried back into the interface unit. The semiconductor wafer that has been subjected to the exposure processing is subjected to predetermined wafer processing by the history of development 10 and the post-bake mechanism 11 by the same operation of the transfer unit 7 and the wafer transfer mechanism 12 as described above, and then loaded onto the unloader unit 2. The semiconductor wafer is loaded and loaded into the loaded carrier, and a series of coating, exposure, and development processes are completed.

In this embodiment, since a plurality of sets of the same processing mechanism are provided in multiple stages, each of the processing mechanisms having been processed is selected, the semiconductor wafer is loaded / unloaded, and a large number of semiconductor wafers are loaded in a short time. It is configured to process efficiently.

Further, for example, each of the upper processing mechanism portions provided with the filter section 14 for supplying a cleaning gas is used as a coating processing step, for example, a semiconductor wafer cleaning mechanism, a hydrophobic heat treatment mechanism for drying and removing moisture, and a semiconductor wafer. HMDS processing mechanism for improving the adhesion with the photoresist film,
Then, a coating mechanism and a pre-bake mechanism are provided, and each processing mechanism part below the filter unit 14 is provided as a development processing step, for example, a development mechanism, a post-bake mechanism, and a resist cure for improving heat resistance of a photoresist pattern. A mechanism may be provided. In this case,
The coating mechanisms are arranged at the same height at the upper part, and the developing mechanisms are arranged at the same height at the lower part. This arrangement has an advantage that the liquid supply system and the waste liquid system do not become complicated.

When a processing mechanism is additionally provided, for example, a buffer section 21 is provided within the movement range of the arm 13 of the wafer transfer mechanism 12, and another processing apparatus is provided on a side surface of the apparatus of the present embodiment. Alternatively, the semiconductor wafer may be loaded and unloaded for processing.

As described above, the processing apparatus of the present embodiment is provided on the same plane because a plurality of processing units are provided in multiple stages around the circumference centered on the wafer transfer mechanism. The loading and unloading of semiconductor wafers into and from the processing mechanism can be performed by the horizontal rotation of the wafer transfer mechanism and the expansion and contraction operation (back and forth operation) of the arm 13. When loading and unloading semiconductor wafers to and from the processing mechanisms stacked in multiple stages. Is the lifting mechanism 18
Should be activated.

The horizontal rotating portion of the wafer transfer mechanism 12 is provided with a sealing mechanism so that dust from the rotating portion is not scattered. The telescopic portion of the arm 13 is covered with a cover. In order to prevent the dust generated in the telescopic portion from adhering to the semiconductor wafer, the inside of the cover is evacuated to a negative pressure by a fan or the like to the outside of the apparatus. It may be.

In the above-described operation, the master computer and the local computer can execute the process in the same horizontal plane and three-dimensionally in the vertical direction, so that the speed of the process can be increased. In these processes, processing steps can be stored by an ID code provided on the wafer.

The present invention is not limited to the above embodiment, and various modifications can be made within the scope of the present invention. The arm that holds the wafer may place and hold the wafer, or hold a part of the back surface of the wafer by vacuum suction.

The substrate is not limited to a semiconductor wafer but may be a glass substrate or the like, and the shape is not limited to a circle but may be any shape such as a square or a rectangle. Therefore, it can be effectively used not only in the semiconductor processing apparatus but also in the process of the liquid crystal substrate processing apparatus. Further, the processing to which the present invention is applied is not limited to resist coating and development.

[0039]

As described above, according to the present invention,
When a substrate is transferred between a plurality of processing mechanisms, the substrate can be carried in and out of each processing mechanism without horizontally moving the transfer mechanism itself. It is possible to provide a substrate processing apparatus that can perform transfer in a short time and can be downsized.

[Brief description of the drawings]

FIG. 1 is a plan view showing a resist processing apparatus according to one embodiment of the present invention.

FIG. 2 is a side view of the apparatus of FIG.

FIG. 3 is a perspective view showing a side plate provided with a lifting mechanism in the apparatus of FIG. 1;

FIG. 4 is a perspective view showing an application mechanism in the apparatus of FIG.

[Explanation of symbols]

 8 coating mechanism 9 pre-bake mechanism 10 developing mechanism 11 post-bake mechanism 12 wafer transfer mechanism

Claims (22)

[Claims] A first processing unit having a vertically extending transport path, a plurality of processing mechanisms disposed circumferentially around the transport path, and performing processing on the substrate; A second processing unit disposed at a height different from that of the first processing unit and circumferentially arranged around the transport path and provided with a plurality of processing mechanisms for performing processing on the substrate; A substrate processing apparatus, comprising: a transfer mechanism arbitrarily provided and configured to transfer a substrate into and out of a processing mechanism constituting the first processing unit and the second processing unit. 2. A loader / unloader section on which a storage container capable of storing a substrate before processing and / or a substrate after processing is placed, and loading or unloading of a substrate before processing or a substrate after processing into the storage container. A transfer mechanism for unloading, a processing station including a plurality of processing mechanisms for performing predetermined processing on the substrate, and a transfer mechanism provided between the loader / unloader unit and the processing station; A stage section for temporarily mounting a substrate to be processed, wherein the processing station has a vertically extending transport path, and is disposed circumferentially around the transport path to perform processing on the substrate. A first processing unit having a plurality of processing mechanisms for performing processing on the substrate, the plurality of processing units being arranged at a different height from the first processing unit, and being arranged circumferentially around the transport path; Processing mechanism A second processing unit, and a transfer mechanism movably provided on the transport path, for loading and unloading a substrate to and from a processing mechanism constituting the first processing unit and the second processing unit. A substrate processing apparatus characterized by the above-mentioned. 3. The substrate processing apparatus according to claim 2, wherein the stage is provided at a position around the transfer path and accessible by a transfer mechanism. 4. A first processing unit having a vertically extending transport path, a first processing unit having a plurality of processing mechanisms disposed circumferentially around the transport path and performing processing on a substrate, A second processing unit disposed at a height different from that of the first processing unit and circumferentially arranged around the transport path and provided with a plurality of processing mechanisms for performing processing on the substrate; A transfer mechanism that is freely provided and that loads and unloads a substrate from and to a processing mechanism that forms the first processing unit and the second processing unit; and the transfer mechanism around the transport path is accessible. A substrate processing apparatus, comprising: a buffer unit that is provided at a position and transfers a substrate to and from another apparatus. 5. A loader / unloader section for mounting a storage container capable of storing a substrate before processing and / or a substrate after processing, and loading or unloading a substrate before processing or a substrate after processing into the storage container. A transfer mechanism for unloading, a processing station including a plurality of processing mechanisms for performing predetermined processing on the substrate, and a transfer mechanism provided between the loader / unloader unit and the processing station; A stage section for temporarily mounting a substrate to be processed, wherein the processing station has a vertically extending transport path, and is disposed circumferentially around the transport path to perform processing on the substrate. A first processing unit having a plurality of processing mechanisms for performing processing on the substrate, the plurality of processing units being arranged at a different height from the first processing unit, and being arranged circumferentially around the transport path; Processing mechanism A transfer mechanism provided movably on the transport path, for loading and unloading a substrate to and from a processing mechanism constituting the first processing unit and the second processing unit; A substrate processing apparatus, comprising: a buffer unit that is provided at a position accessible by the transfer mechanism around a transport path and that transfers a substrate to and from another apparatus. 6. The substrate processing apparatus according to claim 2, wherein the loader / unloader unit has a plurality of storage containers arranged on the same plane. . 7. The substrate processing apparatus according to claim 2, further comprising a cooling mechanism at a transferable position of said transport mechanism. 8. The substrate processing apparatus according to claim 2, wherein the stage section has an alignment mechanism for aligning the substrate. 9. A first processing unit including a vertically extending transport path, a plurality of processing mechanisms disposed circumferentially around the transport path, and performing processing on a substrate; A second processing unit disposed at a height different from that of the first processing unit and circumferentially arranged around the transport path and provided with a plurality of processing mechanisms for performing processing on the substrate; A transfer mechanism that is freely provided and that carries a substrate into and out of a processing mechanism that forms the first processing unit and the second processing unit; and a downflow formation that forms a downflow of clean gas in a transport path. Means for transporting a substrate in a down-flow clean gas atmosphere formed in the transport path. 10. The substrate processing apparatus according to claim 1, wherein the transfer mechanism includes at least two arms for holding a substrate. 11. The substrate processing apparatus according to claim 10, wherein the at least two arms are independently drivable. 12. In the transfer mechanism, when a substrate is carried in and out of a predetermined processing mechanism, one arm carries out a processed substrate from the processing mechanism, and the other arm carries out an unprocessed substrate. The substrate processing apparatus according to claim 11, wherein the substrate is carried into the processing mechanism. 13. The substrate processing apparatus according to claim 10, wherein the arm is covered with a cover, and the inside of the cover is exhausted. 14. The substrate processing apparatus according to claim 10, wherein the arm is covered with a cover, and the inside of the cover is under a negative pressure. 15. The substrate processing apparatus according to claim 1, wherein the transfer path includes a plurality of transfer mechanisms for moving the transfer path. 16. The apparatus according to claim 1, further comprising a filter mechanism provided above the transport path for purifying gas outside the apparatus and taking the gas into the apparatus. A substrate processing apparatus according to any one of the preceding claims. 17. The substrate processing apparatus according to claim 16, wherein a downflow of the gas cleaned through the filter mechanism is formed in the transport path. 18. The apparatus according to claim 10, wherein the filter mechanism has a HEPA filter.
2. The substrate processing apparatus according to 1. 19. The apparatus according to claim 1, wherein the plurality of processing mechanisms are integrally provided in a housing, and are detachable from the housing.
A substrate processing apparatus according to any one of the preceding claims. 20. The apparatus according to claim 1, wherein the plurality of processing mechanisms and the transfer mechanism are integrally provided in a housing, and the transfer mechanism is separable from the housing. The substrate processing apparatus according to claim 1. 21. The apparatus according to claim 1, wherein the plurality of processing mechanisms include a liquid processing mechanism for performing liquid processing and a thermal processing mechanism for performing thermal processing. Substrate processing equipment. 22. The substrate processing apparatus according to claim 21, wherein the first processing unit and the second processing unit have a liquid processing mechanism and a thermal processing mechanism, respectively.