JPH0254298B2 - - Google Patents
Info
- Publication number
- JPH0254298B2 JPH0254298B2 JP59113090A JP11309084A JPH0254298B2 JP H0254298 B2 JPH0254298 B2 JP H0254298B2 JP 59113090 A JP59113090 A JP 59113090A JP 11309084 A JP11309084 A JP 11309084A JP H0254298 B2 JPH0254298 B2 JP H0254298B2
- Authority
- JP
- Japan
- Prior art keywords
- sialon
- sintered body
- strength
- crystals
- silicon nitride
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000203 mixture Substances 0.000 claims description 25
- 239000013078 crystal Substances 0.000 claims description 13
- 229910052782 aluminium Inorganic materials 0.000 claims description 10
- 229910052757 nitrogen Inorganic materials 0.000 claims description 10
- 239000002245 particle Substances 0.000 claims description 9
- 229910052710 silicon Inorganic materials 0.000 claims description 9
- 229910052727 yttrium Inorganic materials 0.000 claims description 8
- 229910052791 calcium Inorganic materials 0.000 claims description 7
- 229910052744 lithium Inorganic materials 0.000 claims description 7
- 229910052749 magnesium Inorganic materials 0.000 claims description 7
- 229910052761 rare earth metal Inorganic materials 0.000 claims description 7
- 239000002131 composite material Substances 0.000 claims description 6
- 238000002156 mixing Methods 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 3
- 229910052500 inorganic mineral Inorganic materials 0.000 claims description 3
- 239000011707 mineral Substances 0.000 claims description 3
- 150000001875 compounds Chemical class 0.000 claims description 2
- 239000000470 constituent Substances 0.000 claims description 2
- 239000007858 starting material Substances 0.000 claims description 2
- 238000000034 method Methods 0.000 description 14
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 12
- 239000002994 raw material Substances 0.000 description 12
- 229910052581 Si3N4 Inorganic materials 0.000 description 11
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 11
- 238000005452 bending Methods 0.000 description 5
- 238000000465 moulding Methods 0.000 description 5
- 239000000843 powder Substances 0.000 description 5
- 238000001272 pressureless sintering Methods 0.000 description 5
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 230000001590 oxidative effect Effects 0.000 description 3
- 238000005245 sintering Methods 0.000 description 3
- 239000006104 solid solution Substances 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 229910003564 SiAlON Inorganic materials 0.000 description 2
- 150000001768 cations Chemical class 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000000635 electron micrograph Methods 0.000 description 2
- 239000008187 granular material Substances 0.000 description 2
- 239000010439 graphite Substances 0.000 description 2
- 229910002804 graphite Inorganic materials 0.000 description 2
- 238000000227 grinding Methods 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 1
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 1
- 238000002441 X-ray diffraction Methods 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000009694 cold isostatic pressing Methods 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000000462 isostatic pressing Methods 0.000 description 1
- XGZVUEUWXADBQD-UHFFFAOYSA-L lithium carbonate Chemical compound [Li+].[Li+].[O-]C([O-])=O XGZVUEUWXADBQD-UHFFFAOYSA-L 0.000 description 1
- 229910052808 lithium carbonate Inorganic materials 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000001000 micrograph Methods 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- -1 organic acid salt Chemical class 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000003921 particle size analysis Methods 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 239000011164 primary particle Substances 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 238000007582 slurry-cast process Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
Landscapes
- Ceramic Products (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP59113090A JPS6191065A (ja) | 1984-06-04 | 1984-06-04 | 高強度α−サイアロン質焼結体 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP59113090A JPS6191065A (ja) | 1984-06-04 | 1984-06-04 | 高強度α−サイアロン質焼結体 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6191065A JPS6191065A (ja) | 1986-05-09 |
JPH0254298B2 true JPH0254298B2 (de) | 1990-11-21 |
Family
ID=14603222
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP59113090A Granted JPS6191065A (ja) | 1984-06-04 | 1984-06-04 | 高強度α−サイアロン質焼結体 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6191065A (de) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2563392B2 (ja) * | 1986-11-21 | 1996-12-11 | 株式会社東芝 | 窒化ケイ素系セラミックスおよびその製造方法 |
US5204297A (en) * | 1991-05-22 | 1993-04-20 | Sumitomo Electric Industries, Ltd. | Silicon nitride sintered body and process for producing the same |
JPH05148026A (ja) * | 1991-11-25 | 1993-06-15 | Sumitomo Electric Ind Ltd | 窒化ケイ素系焼結体 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59182276A (ja) * | 1983-03-31 | 1984-10-17 | 株式会社東芝 | 窒化ケイ素焼結体 |
JPS59199579A (ja) * | 1983-04-25 | 1984-11-12 | 三菱マテリアル株式会社 | 耐摩耗性のすぐれたサイアロン基セラミツクス |
-
1984
- 1984-06-04 JP JP59113090A patent/JPS6191065A/ja active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59182276A (ja) * | 1983-03-31 | 1984-10-17 | 株式会社東芝 | 窒化ケイ素焼結体 |
JPS59199579A (ja) * | 1983-04-25 | 1984-11-12 | 三菱マテリアル株式会社 | 耐摩耗性のすぐれたサイアロン基セラミツクス |
Also Published As
Publication number | Publication date |
---|---|
JPS6191065A (ja) | 1986-05-09 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
EXPY | Cancellation because of completion of term |