JPH025381A - Socket for semiconductor device - Google Patents

Abstract

PURPOSE:To improve the contact property with an IC, heat radiation property and workability by boring an IC adsorbing hole on a housing made of an elastic body and using spring bodies incorporating springs in the housing of a socket as contact sections. CONSTITUTION:An IC 9 is mounted on a socket 1, its leads 10 are brought into contact with the upper faces of heads 8 of contact sections 3, the IC 9 is vacuum-adsorbed through a through hole 2 provided nearly at the center of a housing 4. The housing 4 made of an elastic body such as rubber is flexed into close contact with the IC 9, the leads 10 and the contact sections 3 push down springs 7 to satisfactorily maintain the electric contact. The heads 10 are connected to socket leads 5 via metallized layers 6. The fitting or removal of the socket to the IC is facilitated, workability is improved, the heat radiation property is improved because no cover is required, it can be made small-sized.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a socket for a semiconductor device, and more particularly to a technique for improving a socket used for measuring flat pack packages.

[Conventional technology]

Sockets for semiconductor devices (hereinafter simply referred to as sockets) used for testing (measuring) semiconductor devices (hereinafter referred to as ICs) include dual in-line packages, single-line packages, pin-grit array packages, and flat pack packages. Various proposals have been made depending on the various uses.

There are also various types of lid-type types that allow the IC's external connection terminals (leads) to come into contact with the contacts of the socket by covering the lid, and insertion-type types that are inserted by operating a lever with a cam mechanism. be.

Conventionally, in such sockets, the housing, which is the main body of the socket, is generally made of resin, and the IC is mounted on the resin housing, and the leads of the IC are in contact with the contact portions thereof.

Examples of patents that describe the socket are:
JP-A-54-79989 is mentioned.

[Problem to be solved by the invention]

However, with conventional sockets, for example the one with lid 2 mentioned above, because the lid is attached, it becomes large.
Since the IC is put in and taken out by opening and closing the lid, the workability is poor, or the lid seals the IC, which results in poor heat dissipation from the IC. In addition, recently LCC (IJ-
Surface mount type packages such as dress chip carrier) packages, PLCC (plastic chip carrier), PPP (French plastic package), and 5OP (small outline package) are increasing, and conventional sockets are There are many poor contacts with the IC, resulting in C.

The present invention eliminates the drawbacks of the prior art and
The purpose of the present invention is to provide a technology that has good contact with the machine, has good heat dissipation, is compact, and can improve workability.

The above and other objects and novel features of the present invention include:
It will become clear from the description of this specification and the accompanying drawings.

[Means to solve the problem]

A brief overview of typical inventions disclosed in this application is as follows.

In the present invention, the housing of the socket is made of an elastic body, and a hole is formed in the housing for adsorbing the IC.
A spring body with a built-in spring is used as a contact part inside the housing of the socket.

[Effect]

As a result, the housing is made of an elastic material and has a hole for suction, so the IC to be measured is placed on the socket, and the IC to be measured is placed on the socket from below using the hole for suction. By vacuum suction, the housing flexes and the IC can be brought into close contact with the socket.
Good contact is made between the leads and the contacts of the socket.

At this time, since the contact part is made of a spring body having a spring, it is pressed downward in parallel with the bending of the housing.

On the other hand, when removing the IC from the socket, by releasing the vacuum suction, the elastic body, the nozzle, returns to its original state due to its elastic action, and the contact portion returns to its original state due to its spring action. do.

Therefore, it is easy to attach and detach an IC to and from the socket, improving workability, and since there is no need to attach a lid, the socket can be made smaller. Since the socket is in an open state, heat dissipation is good, and Due to the suction effect and the spring effect of the contact part, the contact part of the socket and the IC
Good contact with lead, LCC and PLCCJpF
Even in surface-mount type IC packages such as PP, the contact state can be maintained well.

〔Example〕

Next, embodiments of the present invention will be described based on the drawings.

As shown in FIG. 1, a circular through hole 2 is provided approximately at the center of a socket 1, and a large number of contact portions 3 are provided around the through hole 2. As shown in FIG. A socket lead 5 connected to the contact portion 3 is vertically provided at the bottom of the housing 4 of the socket 1.

The housing 4 is made of an elastic material (such as rubber or sponge).
It has the elasticity to collapse and reduce its thickness when pressed, and return to its original thickness when it is removed.

The housing is made of, for example, a silicone rubber elastic body. It may also be made of glass foam or the like. As shown in FIG. 2, in this embodiment, the contact part 3 has a metallized layer 6 formed on the wall surface of a hole with a U-shaped cross section formed in the housing 4, and has a spring 7 inside the metallized layer 6. The upper part of the spring 7 is connected to the head part 8 which contacts the leads of the IC, and the lower part of the spring 6 is connected to the bottom part of the metallized layer 6. A socket lead 5 is vertically provided on the outer bottom surface of the metallized layer 6. A portion of the do portion 8 protrudes from the upper surface of the housing 4, and the other portion is located inside the metallized layer 6 and is in contact with the metallized layer 6. A part of the socket lead 5 is connected to the housing 4
The other parts are pulled out from the bottom of the housing 4.

The do part 8 can be moved up and down by the action of a spring 70.

As shown in FIG. 3, an IC 9 is placed on the upper surface of the socket 1, and the leads 10 of the IC 9 are brought into contact with the upper surface of the head portion 8 of the contact portion 3, and a through hole is formed approximately in the center of the housing 4. By vacuum suction using 2, the housing 4 is bent and the bottom of the IC 9 is brought into close contact with the socket 1.
The IJ-dore 10 is in close contact with the contact portion 3. At this time, the spring 7 at the bottom of the contact portion 3 is pressed downward.

In FIG. 1, reference numeral 11 denotes a metallized layer for positioning, and by forming it at the four corners of the upper surface of the housing 4, the IC 9
It is possible to easily determine the mounting position when placing the device on the socket 1 for measurement.

According to the present invention, the housing 4 of the socket 1 is made of an elastic body, the through hole 2 for suction is provided in the housing 4, and the contact portion 3 of the socket 1 is made of a spring body having a spring 7. There is good contact between the lead 10 and the contact part 3, and there is no need for a lid like in the past.
It is easy to attach and detach the IC9, and the socket 1 can be made smaller.
It has good heat dissipation, the structure can be simplified and manufactured at low cost, it is possible to install a large number of contact parts 3, and the IC9 is less likely to be damaged because it is adsorbed by an elastic body. was able to take advantage of this.

Although the invention made by the present inventor has been specifically explained above based on Examples, it goes without saying that the present invention is not limited to the above Examples and can be modified in various ways without departing from the gist thereof. Nor.

〔Effect of the invention〕

A brief explanation of the effects obtained by typical inventions disclosed in this application is as follows.

According to the present invention, it has been possible to provide a socket that eliminates the drawbacks of conventional sockets and has numerous advantages.

[Brief explanation of the drawing]

FIG. 1 is a perspective view showing an embodiment of the present invention, FIG. 2 is a sectional view thereof, and FIG. 3 is a sectional view illustrating a mode of use of the present invention. DESCRIPTION OF SYMBOLS 1...Socket, 2...Adsorption hole, 3...Contact part, 4...Housing, 5...Socket lead, 6...Metallized layer, 7...Spring, 8...・Head part, 9...IC110...IC lead〆'-6・Representative Patent attorney Masaru Ogawa ゛□、ノCtsu＼(

Claims (1)

[Claims] 1. In a socket for a semiconductor device, the housing of the socket is made of an elastic body made of an elastic material such as rubber or sponge, and has a suction hole for vacuum suction of the semiconductor device to the housing. 1. A socket for a semiconductor device, which has a hole in the housing, and a contact portion of the socket that makes contact with an external connection terminal of the semiconductor device is a spring body having a spring built into the housing. 2. The socket for a semiconductor device according to claim 1, wherein the elastic body is made of silicone rubber.