JP2829272B2 - Grounding mechanism of IC package in socket - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a grounding mechanism for an IC package in a socket which forms a grounding structure when the IC package is loaded into the socket.

[0002]

2. Description of the Related Art In an IC package, an IC is sealed in an IC package body made of an insulating material, and the IC is connected to an IC terminal disposed on a side surface or a lower surface of the IC package body by a method such as bonding.

The above-mentioned IC is often damaged by high-voltage static electricity charged on the surface of an IC package body or a socket body made of an insulating material.

Conventionally, as a countermeasure against the static electricity, a part of a contact which comes into contact with an IC terminal of the IC package socket body is used for grounding, or a current collecting metal or socket specially embedded in the IC package socket body. A grounding mechanism or the like for contacting a contact provided on the socket body with a metal shaft member owned by the body is employed.

[0005]

However, any of them is effective for discharging static electricity charged on the surface of the socket body, but it is indirect as a countermeasure against static electricity charged on the surface of the IC package body loaded therein. However, it is not possible to achieve a sufficient effect especially as a direct countermeasure against static electricity for the IC built in the IC package body.

[0006] PGA type ICs where antistatic measures are particularly desired
In the package, a method of connecting a contact projecting from the lower surface of the IC package to the ground line of the wiring board has been adopted. However, this measure has a limited current collecting area and has a poor discharge effect. Either the signal contacts provided on the body must be diverted or
Special grounding means must be provided on the C package body.

[0007]

SUMMARY OF THE INVENTION The present invention overcomes the above circumstances and provides a grounding mechanism for an IC package in a socket which provides a simple and effective grounding effect as a countermeasure against static electricity in an IC built in an IC package body. Things.

More specifically, in a PGA type IC package, as an example of a heat countermeasure for radiating heat generated by the IC in the IC package, an IC built-in chamber opened at the center of the lower surface of the IC package body is provided, and the opening surface is radiated. A method is adopted in which the heat is radiated efficiently from the IC built in the IC built-in chamber by forming a wide area heat dissipation surface by covering with a lid and sealing.
A number of pin terminals protrude from the lower surface of the IC package body around the heat dissipation lid in a sword-like manner. The heat-dissipating lid is formed of a metal plate having a good heat-dissipating effect.

The present invention is based on the idea that the above-mentioned heat-dissipating lid provided as a measure against heat dissipation is used, and this is also used as the measure against static electricity.

The heat dissipation structure of the PGA type IC package is changed from the side of the IC package body to the J-type IC.
J-bend type IC package with terminal protruding or I
A dual in-line type IC package in which one-stage bent IC terminals are projected from the side surface of the C package body, or a gull-wing type IC package in which two-stage bent IC terminals are projected from the side surface of the IC package body, or an IC package. Considering that the present invention can be applied to a flat type IC package in which IC terminals protrude horizontally from the side surface of the main body, or a leadless type IC package in which IC terminals are in close contact with the side surface or lower surface of the IC package main body,
This is used to take measures against static electricity in various IC packages.

In short, the IC package is formed by sealing an IC built-in chamber opened on the upper surface or the lower surface of the IC package body with a metal radiating lid covering the open surface. The IC package socket is provided with a contact for contacting an external terminal of the IC package, and a contact is provided for contacting an outer surface of the heat dissipation lid, and the heat dissipation lid is grounded via the contact. In addition, the heat dissipating lid is used as a heat dissipating means and an electrostatic discharge means in cooperation with the contact.

Further, the contact is displaced to a contact position and a contact release position by a moving plate which moves laterally along the upper surface of the IC package socket. A plurality of the contacts are arranged so as to make pressure contact with the central portion of the outer surface of the radiator lid or to contact symmetrical positions on the outer surface of the radiator lid.

The above-mentioned grounding mechanism can provide a grounding mechanism with a simple structure in which a contact that presses and contacts the heat dissipation lid is attached to the socket side while obtaining a heat dissipation effect with the heat dissipation lid. In addition, a large-area heat-dissipating lid enhances the current collection effect and can be expected to have a good static electricity discharge effect, and can be discharged from the heat-dissipating lid close to the IC to be protected, which is extremely effective as a measure for protecting the IC against static electricity. .

[0014]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 2 to FIG.
FIGS. 6 to 8 show a first embodiment in which a GA type IC package and its socket are configured, and FIGS. 6 to 8 show a second embodiment in which the grounding mechanism is configured in a gull-wing type IC package and its socket. Reference numeral 12 denotes a third embodiment in which the grounding mechanism is constituted by a J-bend type IC package and its socket.

The common structure of the grounding mechanisms will be described with reference to FIG. 1. In various types of IC packages, an IC built-in chamber 2 opened on the upper or lower surface of the IC package body 1 is provided with a metal heat radiator covering the open surface. The IC 3 is built in the IC built-in room 2 with the lid 4 sealed.

The above-mentioned IC is connected to the socket for the IC package.
A contact 6 for contacting an external terminal of the package, and a contact 6
And a grounding mechanism configured to ground the heat-dissipating lid 4 via the contact 6.

First Embodiment (See FIGS. 2 to 5) As shown in FIGS. 2 and 3, the PGA type IC package has an opening at the center at the center of a rectangular and thin IC package body 1 made of an insulating material. The opening surface is covered and sealed by a heat radiating lid 4 made of a square metal plate, and a large number of external terminals (pins) are formed from the lower surface of the IC package body around the heat radiating lid 4. The terminal 7 protrudes like a sword.

As shown in FIG. 3, the heat radiating lid 4 is integrally attached to the lower surface of the IC package body 1 in the peripheral wall of the IC built-in chamber 2, and the IC 3 built in the IC built-in chamber 2 is shown in FIG. As shown in FIG. 3, a structure that overlaps and contacts the inner surface of the heat dissipation lid 4, or as shown in FIG. 3B, a structure that overlaps and contacts the inner bottom wall of the IC built-in chamber 2, or as shown in FIG. The structure is sandwiched between the inner bottom surface of the chamber 2 and the inner surface of the heat radiating lid 4 and is in contact with both surfaces.

The IC 3 is fixed by a method such as bonding, and the IC 3 and the external terminal 7 are connected to each other around the IC built-in room 2 by a method such as bonding. This connection state is not shown.

FIG. 4 shows a socket on which the above-mentioned PGA type IC package is mounted. This socket is made of a known contact and contact release insulating material which traverses along the upper surface of a socket body 8 made of an insulating material. FIG. 4A with plate 9
Indicates a state in which the movable plate 9 is laterally moved in the direction indicated by the arrow. In this state, the contacts 5 held in the socket body 8 are opened, and in this open state, the IC external terminals 7 of the IC package are disconnected. Insert the load.

Next, FIG. 4B shows a state in which the movable plate 9 is laterally moved in a direction opposite to the above direction indicated by an arrow, and the lateral movement closes the contact 5 to elastically hold the IC external terminal 7. Pressure contact is obtained.

The external terminals 7 of the IC package are inserted between the contact pieces of the contacts 5 in the open state through a large number of holes 10 penetrating vertically provided in the moving plate 9.

FIGS. 4A and 4B show the case where the movable plate 9 engages with the contact piece of the contact and opens and closes it.
As a socket type for the GA type IC package, the external terminal 7 of the IC package is inserted into the side of the contact through the through hole 10 of the moving plate 9 with no load, and then the moving plate 9 is laterally moved. There is known a socket of the type in which the external terminal 7 is laterally moved together with the movable plate 9 from the insertion position and elastically forcibly intervenes between the contact pieces of the contact.

As the laterally moving means of the moving plate 9, a known operating lever such as a crank lever provided between the socket body 8 and the moving plate 9 can be used. Alternatively, the movable plate 9 can be moved laterally using a tool or the like without using these operation levers.

A contact body 6 as shown in FIGS. 4A and 4B is attached to a socket body 8 having a moving plate 9 for contact and release of each type described above.
The contact 6 is arranged so as to be brought into pressure contact with the outer surface of the heat radiating cover 4. That is, a contact 6 corresponding to the heat radiating cover 4 is disposed at the center of the socket body 8.
The contact 5 is arranged in the peripheral region of the above. An opening 11 corresponding to the heat radiating lid 4 is provided at the center of the moving plate 9, and the contact 6 is configured to make pressure contact with the heat radiating lid 4 through the opening 11.

The contact 6 is a seat 6 extending in the lateral direction.
a contact piece 6b extending vertically from the seat piece 6a and extending in the lateral direction and having a vertical elasticity, and a mounting contact piece 6c projecting upward at a free end of the elastic contact piece 6b. The mounting piece 6c is disposed so as to be present in the central opening 11 of the moving plate 9, and the mounting piece 6c and the heat-dissipating lid 4 are opposed to each other at the central opening 11, so that the mounting piece 6c is The outer surface of the heat radiation cover 4 is brought into pressure contact. That is, when the IC package is mounted on the movable plate 9, the heat dissipating lid 4 is pressed against the mounting piece 6c, and the contact piece 6b is bent downward against the spring. Pressure contact is obtained.

A male terminal 6d is provided below the seat 6a and extends downward from the seat 6a. The seat 6a is seated on the socket body 8 and the male terminal 6d is connected to the socket body 8a. , And project downward to provide connection to the wiring board. Therefore, the contact 6 serves as grounding means for connecting the heat radiation lid 4 to the ground line of the wiring board while being in contact with the heat radiation lid 4.

The contact 6 is provided singly or plurally, and discharges the static electricity collected in the heat radiating cover 4 through the contact 6. 4A and 4B show an example in which when the PGA type IC package is mounted on the moving plate 9 of the IC socket, the mounting piece 6c is pushed down by the heat dissipating lid 4 so that a press contact with the contact 6 can be obtained. 5A and 5B show an example in which the target contact 6 is elastically displaced by the lateral movement of the movable plate 9 to a position where it comes into contact with the heat radiating lid 4 and a release position.

The contact 6 has an elastic contact piece 6b extending obliquely upward and a mounting contact piece 6c at an upper free end of the elastic contact piece 6b. The male terminal 6d extending vertically from the lower end penetrates through the socket body 8 and protrudes downward to be connected to a ground line of the wiring board.

As shown in FIG. 5A, when the movable plate 9 is moved in one direction, the open state of the contact 5 is formed, and at the same time, the elastic contact piece 6b of the contact 6 is moved. Is pressed down by the pressurizing portion 12 provided in the movable plate 9 to displace the mounting piece 6c to the contact release position which is separated downward from the outer surface of the heat radiating cover 4 of the IC package mounted on the movable plate 9.

After the PGA type IC package is mounted on the moving plate 9 in this state, as shown in FIG. 5B, the moving plate 9 is laterally moved in the opposite direction to the elastic contact piece 6b. The pressing force by the pressure portion 12 is released, the elastic contact piece 6b is restored upward, and the mounting contact piece 6c is brought into pressure contact with the outer surface (lower surface) of the heat radiation lid 4. Mounting piece 6c
Is pressed through the opening 11 provided at the center of the moving plate 9 to the radiating lid 4 facing the opening 11. FIG. 5B
5, the solid line represents the restoring position of the contact 6 when the IC package is not mounted.

Second Embodiment (See FIGS. 6 to 8) As shown in FIGS. 6 and 7, a gull-wing type IC package is formed by bending a rectangular IC package body 1 made of an insulating material in two steps from opposing side surfaces. It has a protruding IC external terminal 7. In the center of the IC package main body, there is provided an IC built-in chamber 2 having an opening at the lower surface, and the opening surface of the IC built-in chamber 2 is covered with a heat radiation cover 4 to seal the IC 3.

The heat dissipating lid 4 is fitted to the inner surface of the IC built-in chamber 2 to be integrated with the main body 1 as shown in FIG. Alternatively, as described with reference to FIG. 3, the heat dissipation lid 4 is overlapped on the lower surface of the peripheral wall defining the IC built-in chamber 2, that is, the lower surface of the IC package main body 1, and is integrated with the main body 1. IC3 is shown in Fig.3A, B, C
Is built in the IC built-in chamber 2 in the same manner as described in (1).

That is, as shown in FIG. 7A, the IC 3 is held between the inner bottom surface of the IC built-in chamber 2 and the inner surface of the heat radiation cover 4 and the IC
3 so that the upper and lower surfaces are in contact with each other, or as shown in FIG.
Is built in with a small gap from the inner surface of the substrate. Alternatively, as shown in FIG. 7C, the IC 3 is superimposed on and contacts the inner surface of the heat dissipation lid 4, and is built in with a small gap from the inner bottom surface of the IC built-in chamber 2.

FIG. 8 exemplifies a socket for the gull-wing type IC package. As shown in FIG. 8, the socket body 8 has contacts 5 corresponding to the external terminals 7 of the IC package and a heat radiation cover. 4 has a contact 6 that comes into pressure contact with the outer surface (lower surface). The contact 5 and the contact 6 have the same seat pieces 5a, 6a, elastic contact pieces 5b, 6b, mounting contact pieces 5c, 6c, and male terminals 5d, 6d as described with reference to the first embodiment. The IC external terminal 7 is in pressure contact with the upper surface of the mounting piece 5c of the contact 5, and the heat dissipation lid 4 is in pressure contact with the upper surface of the mounting piece 6c of the contact 6.

A pressing cover 13 which is opened and closed by the socket body 8 is provided as the pressurizing means, and one end of the pressing cover 13 is rotatably supported on one end of the socket body 8 by a shaft 14. A holding member 16 which is brought into contact with the upper surface of the IC external terminal 7 and pressed down is attached to the cover 13 by a shaft 15 so as to be adjustable.
To be pressed down.

More specifically, the gull-wing type IC package is mounted on the socket body 8, the external contacts 7 are loaded on the mounting pieces 5c of the contacts 5, and when the pressing cover 13 is closed, the pressing member 16 is connected to the IC external terminal. 7, the contact pieces 5c and 6c of the contact 5 and the contact 6 are pushed down,
The elastic contact pieces 5b, 6b are displaced downward against their elasticity,
Due to the reaction force, the IC external terminal 7 is brought into pressure contact with the mounting contact piece 5c of the contact 5, and the heat dissipating lid 4 is brought into pressure contact with the mounting contact piece 6c of the contact 6.

The press contact state is maintained by engaging the free end of the press cover 13 closed to the socket body 8 with the end of the socket body 8 by the lock lever 17. The press contact state between the contact 5 and the contact 6 and the IC external terminal 7 and the heat radiating cover 4 in the first and second embodiments is the pressing cover or the manipulator of the robot or the finger which is not connected to the socket body 8. Can be maintained.

In the second embodiment, the plurality of contacts 6 are brought into pressure contact with the symmetrical positions of the heat sink 4 to apply a uniform lifting force to the IC package body 1.

The above-mentioned symmetric contact state can be implemented also in the first embodiment. Further, as a means for applying a uniform pushing force to the IC package, the contact 6 can be brought into pressure contact with the central portion of the heat radiation lid 4. In both the first and second embodiments, the case where a structure having the seat piece 6a, the elastic contact piece 6b, the mounting contact piece 6c, and the male terminal 6d is used as the contact 6 is shown. Instead, as described in the third embodiment, use of a contact probe that expands and contracts linearly is not prevented.

Third Embodiment (See FIGS. 10 to 12) A J-bend type IC package in this embodiment is shown in FIGS.
As shown in FIG. 10, a rectangular IC package body 1 made of an insulating material has IC external terminals 7 which are bent and protruded into a J shape from two or four sides. The IC package body 1 has a built-in IC chamber 2 which is opened at the lower surface in the center of the IC package main body 1, and the opening surface of the IC built-in chamber 2 is covered with a heat radiating lid 4 to be sealed. Sealed structure by this heat radiation lid 4 and IC
The arrangement of 3 can have the same structure as that described with reference to FIGS. 3A, 3B, and 7A and FIGS. 7A, 7B, and 7C.

As shown in FIGS. 11 and 12, the IC package having the J-bend type external terminal 7 is loaded in an IC accommodating portion opened on the upper surface of the socket body 8, ie, I
Contact 5 arranged opposite along the edge of the C accommodating portion
Forcibly inserted into the gap, and press-contacted the contact piece of the contact 5,
The contact piece of the contact 5 makes the IC package an IC.
Resiliently held in the housing.

The contact 6 corresponding to the heat radiating cover 4 is arranged at the center of the socket body 8. As the contact 6, the contact having the elastic contact piece 6b of the horizontal U-shape described in the first and second embodiments can be used, and it can also expand and contract linearly up and down as shown in FIGS. A simple pin terminal type contact probe can be used. As the contact probe, a probe in which a pin terminal 6f is inserted into the outer cylinder 6e and the pin terminal 6f is urged upward by a tacoil spring or the like built in the outer cylinder 6e can be used.

As shown in FIG. 11, a plurality of the contacts 6 are arranged so as to be in pressure contact with symmetrical positions on the outer surface of the heat radiating plate 4, or as shown in FIG. One or more are arranged so as to be in pressure contact with the lower surface. FIG.
1 and FIG. 12, the contact 6 applies a left-right equal push-up force to the IC package.

[0045]

The grounding mechanism of the IC package in the socket according to the present invention provides a grounding mechanism with a simple structure in which a contact that presses and contacts the heat dissipation lid is provided on the socket side while obtaining a heat effect with the heat dissipation lid. it can. In addition, a large-area heat-dissipating lid enhances the current collection effect and can be expected to have a good electrostatic discharge effect, and can be efficiently discharged from the heat-dissipating lid close to the IC to be protected. .

[Brief description of the drawings]

FIG. 1 is a sectional view showing the principle of a grounding mechanism according to the present invention.

FIG. 2 is a bottom view of the PGA type IC package.

FIGS. 3A, 3B, and 3C are cross-sectional views of the PGA type IC package, each illustrating a built-in mode of the IC; FIGS.

FIGS. 4A and 4B are cross-sectional views showing a grounding mechanism using the PGA type IC package and its socket, showing a state in which contacts are opened and closed by a moving plate.

FIGS. 5A and 5B are cross-sectional views of a main part showing a structural example in which a contact is opened and closed by the moving plate.

FIG. 6 is a bottom view of the gull-wing type IC package.

FIGS. 7A, 7B, and 7C are cross-sectional views of the gull-wing type IC package, each illustrating a built-in mode of the IC;

FIG. 8 is a cross-sectional view showing a grounding mechanism using the gull-wing type IC package and its socket.

FIG. 9 is a bottom view of the J-bend type IC package.

FIG. 10 is a sectional view of the J-bend type IC package.

FIG. 11 is a sectional view showing a grounding mechanism formed by the J-bend type IC package and its socket.

FIG. 12 is a sectional view showing another example of the grounding mechanism.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 IC package main body 2 IC built-in room 3 IC 4 Heat radiation cover 5 Contact 6 Contact 7 IC external terminal 8 Socket main body 9 Moving plate 10 Through hole 12 Pressurizing part 11 Opening 13 Pressing cover 16 Pressing member 17 Lock lever

──────────────────────────────────────────────────続 き Continued on the front page (58) Fields surveyed (Int.Cl. ⁶ , DB name) H01R 33/76 H01L 23/32

Claims (4)

(57) [Claims] An IC package socket in which an IC built-in chamber which is opened at an upper surface or a lower surface of an IC package body is sealed with a metal heat radiating cover which covers the opening surface.
The package socket is provided with a contact for contacting the external terminal of the IC package, and a contact for elastically pressing the outer surface of the heat dissipation lid is provided. The heat dissipation lid is grounded via the contact. A grounding mechanism for an IC package in a socket, characterized in that: 2. A grounding mechanism for an IC package in a socket according to claim 1, wherein said contact is displaced to a contact position and a contact release position by a moving plate which moves laterally along an upper surface of the IC package socket. . 3. A grounding mechanism for an IC package in a socket according to claim 1, wherein said contact contacts the central portion of the outer surface of said heat radiating lid under pressure. 4. The grounding mechanism of an IC package in a socket according to claim 1, wherein a plurality of said contacts are arranged so as to contact symmetrical positions on an outer surface of said heat radiation lid.