JPH0252449U - - Google Patents
Info
- Publication number
- JPH0252449U JPH0252449U JP1988132762U JP13276288U JPH0252449U JP H0252449 U JPH0252449 U JP H0252449U JP 1988132762 U JP1988132762 U JP 1988132762U JP 13276288 U JP13276288 U JP 13276288U JP H0252449 U JPH0252449 U JP H0252449U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- heat sink
- circuit device
- hybrid integrated
- lower plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims 1
- 239000000463 material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図はこの考案の一実施例による混成集積回
路装置の組立装置を示す断面側面図、第２図は従
来の組立装置を示す断面側面図である。 図において、１はセラミツク基板、２ははんだ
材、３は放熱板、４はロボツトハンド、５は可動
発熱体下板、６は固定上板である。なお、図中、
同一符号は同一、又は相当部分を示す。
路装置の組立装置を示す断面側面図、第２図は従
来の組立装置を示す断面側面図である。 図において、１はセラミツク基板、２ははんだ
材、３は放熱板、４はロボツトハンド、５は可動
発熱体下板、６は固定上板である。なお、図中、
同一符号は同一、又は相当部分を示す。
Claims (1)
- 回路を表面構成したセラミツク基板と金属から
なる放熱板とをはんだ材を使用して接合する混成
集積回路装置の組立装置において、放熱板を下か
ら加熱する部分が、上板と、発熱体体ある下板の
２枚で構成され、しかも上記下板に上下の昇降機
能を有していることを特徴とする混成集積回路装
置の組立装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988132762U JPH0252449U (ja) | 1988-10-11 | 1988-10-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988132762U JPH0252449U (ja) | 1988-10-11 | 1988-10-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0252449U true JPH0252449U (ja) | 1990-04-16 |
Family
ID=31390026
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988132762U Pending JPH0252449U (ja) | 1988-10-11 | 1988-10-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0252449U (ja) |
-
1988
- 1988-10-11 JP JP1988132762U patent/JPH0252449U/ja active Pending