JPH01143136U - - Google Patents

Info

Publication number
JPH01143136U
JPH01143136U JP3982988U JP3982988U JPH01143136U JP H01143136 U JPH01143136 U JP H01143136U JP 3982988 U JP3982988 U JP 3982988U JP 3982988 U JP3982988 U JP 3982988U JP H01143136 U JPH01143136 U JP H01143136U
Authority
JP
Japan
Prior art keywords
mounting
metal member
patterned
conductive metal
highly conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3982988U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP3982988U priority Critical patent/JPH01143136U/ja
Publication of JPH01143136U publication Critical patent/JPH01143136U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structure Of Printed Boards (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Description

【図面の簡単な説明】
第1図はこの考案の一実施例である半導体素子
搭載用基板の平面図、第2図は同上半導体素子搭
載用基板の側面図、第3図は従来の半導体素子搭
載用基板の平面図、第4図は同上半導体素子搭載
用基板の側面図である。 1:セラミツク板、2a,2b:金属部材、3
:抵抗部。

Claims (1)

    【実用新案登録請求の範囲】
  1. セラミツク板に良導電性金属部材をパターン化
    して接合させた半導体素子搭載用基板において、
    前記パターン化された良導電性金属部材の一部を
    蛇行状に形成したことを特徴とする半導体素子搭
    載用基板。
JP3982988U 1988-03-25 1988-03-25 Pending JPH01143136U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3982988U JPH01143136U (ja) 1988-03-25 1988-03-25

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3982988U JPH01143136U (ja) 1988-03-25 1988-03-25

Publications (1)

Publication Number Publication Date
JPH01143136U true JPH01143136U (ja) 1989-10-02

Family

ID=31266318

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3982988U Pending JPH01143136U (ja) 1988-03-25 1988-03-25

Country Status (1)

Country Link
JP (1) JPH01143136U (ja)

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