JPH0252331U - - Google Patents
Info
- Publication number
- JPH0252331U JPH0252331U JP13017088U JP13017088U JPH0252331U JP H0252331 U JPH0252331 U JP H0252331U JP 13017088 U JP13017088 U JP 13017088U JP 13017088 U JP13017088 U JP 13017088U JP H0252331 U JPH0252331 U JP H0252331U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor substrate
- furnace core
- core tube
- processing apparatus
- tube
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 7
- 239000000758 substrate Substances 0.000 claims description 7
- 238000010438 heat treatment Methods 0.000 claims description 3
- 239000012774 insulation material Substances 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
Description
第１図は本考案による第１の実施例を示す半導
体基板の加熱処理装置の断面図、第２図は本考案
による第２の実施例を示す半導体基板の加熱処理
装置の断面図である。
１……炉芯管、２……均熱管、３……ヒータ、
４……引き出し棒、５……管状の容器、６……ガ
ス導入管、７……半導体基板、８……ボート、９
……コロ、１０……断熱材。
FIG. 1 is a cross-sectional view of a semiconductor substrate heat treatment apparatus showing a first embodiment of the present invention, and FIG. 2 is a cross-sectional view of a semiconductor substrate heat treatment apparatus showing a second embodiment of the present invention. 1... Furnace core tube, 2... Soaking tube, 3... Heater,
4... Pull-out rod, 5... Tubular container, 6... Gas introduction tube, 7... Semiconductor substrate, 8... Boat, 9
...Koro, 10...insulation material.
Claims (1)
周囲がヒータで覆われた炉芯管と、この炉芯管の
一端に開放口と、他端に設けられたガス導入管と
を有する半導体基板の加熱処理装置において、前
記半導体基板を収納するとともに前記炉芯管内に
出入する管状の容器を備えたことを特徴とする半
導体基板の加熱処理装置。 Heating of a semiconductor substrate, which has a furnace core tube into which a plurality of semiconductor substrates are inserted and whose outer periphery is covered with a heater, an open port at one end of the furnace core tube, and a gas introduction tube provided at the other end. A heat processing apparatus for a semiconductor substrate, characterized in that the processing apparatus includes a tubular container which houses the semiconductor substrate and which enters and exits the furnace core tube.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13017088U JPH0252331U (en) | 1988-10-03 | 1988-10-03 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13017088U JPH0252331U (en) | 1988-10-03 | 1988-10-03 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0252331U true JPH0252331U (en) | 1990-04-16 |
Family
ID=31385100
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13017088U Pending JPH0252331U (en) | 1988-10-03 | 1988-10-03 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0252331U (en) |
-
1988
- 1988-10-03 JP JP13017088U patent/JPH0252331U/ja active Pending
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