JPH0250992U - - Google Patents
Info
- Publication number
- JPH0250992U JPH0250992U JP12873488U JP12873488U JPH0250992U JP H0250992 U JPH0250992 U JP H0250992U JP 12873488 U JP12873488 U JP 12873488U JP 12873488 U JP12873488 U JP 12873488U JP H0250992 U JPH0250992 U JP H0250992U
- Authority
- JP
- Japan
- Prior art keywords
- socket
- terminal
- wrapping post
- main body
- wrapping
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000037431 insertion Effects 0.000 claims description 6
- 238000003780 insertion Methods 0.000 claims description 6
- 238000010618 wire wrap Methods 0.000 claims description 4
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 239000011810 insulating material Substances 0.000 claims 1
- 239000002184 metal Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Landscapes
- Connecting Device With Holders (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Description
第１図は本考案の実施例の斜視図。第２図は第
１図のＡ―Ａ断面図。第３図、第４図は本考案の
他の実施例。第５図、第６図は本考案のＩＣソケ
ツトを標準基板に実装したときの正面透視図であ
る。第７図は従来のワイヤーラツピング用ＩＣソ
ケツトの斜視図。第８図は従来のワイヤーラツピ
ング用ＩＣソケツトのプリント基板への実装の全
面図。第９図は第８図の半田面正面図。第１０図
は部品面ラツピングの従来例。第１１図は第１０
図の半田面正面図。第１２図は第１０図の部品面
正面図。
１……ラツピングポスト、２……ＩＣ端子挿入
口、３……樹脂モールド、４……導電金具、５…
…ＩＣ挿着部、６……基板、７……ＩＣ、８……
ＩＣ端子、１３……ピン番号、１７……ソケツト
端子、３０……ワイヤーラツピング用ＩＣソケツ
ト。
FIG. 1 is a perspective view of an embodiment of the present invention. FIG. 2 is a sectional view taken along line AA in FIG. 3 and 4 show other embodiments of the present invention. 5 and 6 are front perspective views of the IC socket of the present invention mounted on a standard board. FIG. 7 is a perspective view of a conventional IC socket for wire wrapping. FIG. 8 is a full view of a conventional wire wrapping IC socket mounted on a printed circuit board. FIG. 9 is a front view of the solder surface of FIG. 8. Figure 10 shows a conventional example of part surface wrapping. Figure 11 is the 10th
A front view of the solder surface in the figure. FIG. 12 is a front view of the parts shown in FIG. 10. 1... Wrapping post, 2... IC terminal insertion slot, 3... Resin mold, 4... Conductive metal fitting, 5...
...IC insertion part, 6...board, 7...IC, 8...
IC terminal, 13... Pin number, 17... Socket terminal, 30... IC socket for wire wrapping.
Claims (1)
と、 この本体の表面に設けられた複数のＩＣ端子挿
入口と、 この挿入口の各々に、ＩＣに設けられＩＣ端子
が挿入された際、一端が前記ＩＣ端子に接続され
他端が前記本体の底面に突出されたソケツト端子
に接続されるＩＣソケツトにおいて、 一端が前記本体の表面に突出されたラツピング
ポストを前記本体に固着し、前記ＩＣ端子挿入口
及びソケツト端子とラツピング端子を接続する導
電部材を前記本体に設けて成るラツピングポスト
付きＩＣソケツト。 (2) ソケツト端子とラツピングポストの各々の
中心間隔が２．５４mm×０．５×ｎ（ｎは任意の
自然数）であることを特徴とする請求項第１項記
載のラツピングポスト付きＩＣソケツト。 (3) ソケツト端子及び／またはラツピングポス
トがプリント基板に半田付けされることを特徴と
する請求項第１項及び第２項記載のラツピングポ
スト付きＩＣソケツト。 (4) ラツピングポストが部品面と半田面の両方
にワイヤーラツピングできるだけの長さを有して
いることを特徴とする請求項第１項及び第２項記
載のラツピングポスト付きＩＣソケツト。 (5) ＩＣソケツトの挿入口とラツピングポスト
の取付部の間の本体表面上にピン番号を形成する
ことを特徴とする請求項第１項及び第２項記載の
ラツピングポスト付きＩＣソケツト。[Claims for Utility Model Registration] (1) An IC socket body formed of an insulating material, a plurality of IC terminal insertion openings provided on the surface of this body, and an IC socket provided in each of the insertion openings. In the IC socket, one end is connected to the IC terminal and the other end is connected to the socket terminal protruding from the bottom surface of the main body when the IC terminal is inserted, the wrapping post having one end protruding from the surface of the main body. An IC socket with a wrapping post, wherein the IC socket is fixed to the main body, and the main body is provided with a conductive member for connecting the IC terminal insertion opening, the socket terminal, and the wrapping terminal. (2) The IC with a wrapping post according to claim 1, wherein the distance between the centers of each of the socket terminal and the wrapping post is 2.54 mm x 0.5 x n (n is any natural number). socket. (3) The IC socket with a wrapping post according to claim 1 or 2, wherein the socket terminal and/or the wrapping post are soldered to a printed circuit board. (4) The IC socket with a wrapping post according to claim 1 or 2, wherein the wrapping post has a length that allows wire wrapping on both the component side and the solder side. (5) The IC socket with wrapping post according to claim 1 or 2, characterized in that a pin number is formed on the surface of the main body between the insertion opening of the IC socket and the attachment part of the wrapping post.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12873488U JPH0250992U (en) | 1988-09-30 | 1988-09-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12873488U JPH0250992U (en) | 1988-09-30 | 1988-09-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0250992U true JPH0250992U (en) | 1990-04-10 |
Family
ID=31382352
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12873488U Pending JPH0250992U (en) | 1988-09-30 | 1988-09-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0250992U (en) |
-
1988
- 1988-09-30 JP JP12873488U patent/JPH0250992U/ja active Pending