JPH0250500A - Device for recognition and correction of nozzle position - Google Patents

Abstract

PURPOSE:To cope with the deviation from an initial set position due to temperature change, ageing change, etc., by comparing recognition position data with reference position data, calculating compared deviation amount, and storing the obtained deviation amount. CONSTITUTION:A recognition camera 16 recognizes the rotary center position of a suction nozzle for sucking to hold a chiplike electronic component. First memory means 23 stores relative reference position data between the camera 16 and the rotary center of the nozzle. Comparing means 24 compares the reference position data stored in the means 23 with the position data recognized by the camera, computing means 25 calculates deviation compared by the means 24, and second memory means 23 stores deviation obtained from the means 25. A suction head 5 is driven by a suction head driver 5A according to a command output from command means 26 on the basis of the deviation, and the nozzle is moved to a position considered with the deviation. Thus, it can cope with the deviation from the initial set position due to temperature change, ageing change, etc.

Description

DETAILED DESCRIPTION OF THE INVENTION 0) Industrial Field of Application This invention is a nozzle position frtlI! that recognizes and corrects the position of the suction nozzle of the suction head driven by the suction head drive unit. Relating to an identification and correction device.

(b) Conventional technology When chip-shaped electronic components are sequentially mounted on a printed circuit board, a suction pin (corresponding to the above-mentioned suction nozzle) images the state in which the K component is suctioned from below with a telepidine camera, A technique for adjusting the position of parts is disclosed in Japanese Patent Laid-Open No. 132399/1983.

However, even if the positions of the pins and the parts are regulated, if the pins expand or contract due to changes in surrounding temperature, for example, the mounting positions of the parts will shift by the amount of deviation.

There have been cases where the initial set position shifts due to so-called temperature changes, changes over time, etc. of components within the device.

eυ Problem to be Solved by the Invention This invention deals with the deviation of the components in the device from the initial set position due to temperature changes, changes over time, etc.

2) Means for Solving the Problems The present invention aims to improve the rotation center position of the suction nozzle that suctions and holds chip-shaped electronic components. ! ! ! A first tc! in which data is stored, including a recognition camera that recognizes the camera, a relative reference position between the camera and the rotation center of the nozzle, and a first tc! a comparison means for comparing the reference position data stored in the storage means with the position data recognized by the camera; a calculation means for calculating the amount of deviation compared by the comparison means; and second storage means for storing the amount of deviation determined.

Furthermore, the present invention includes a recognition camera that recognizes the rotation center position of the suction nozzle of the suction head driven by the suction head sliding part, and a relative reference position data between the camera and the rotation center of the nozzle is stored. a first storage means, a comparison means for comparing the reference position data stored in the storage means and the position data recognized by the camera, a calculation means for calculating the amount of deviation compared by the comparison means; a second storage means for storing the amount of deviation obtained from the calculation means; and a command means for issuing a command to the suction head driving section to take the amount of deviation into consideration when moving the suction head section thereafter. .

) The reference position data stored in the first storage means and IBI! by the action comparison means. The amount of deviation is calculated by the calculation means by comparing the position data recognized by the identification camera. and,
The obtained amount of deviation is stored in the second storage means, and based on this, the suction head drive unit drives the suction head according to the command issued from the command means, and the suction nozzle takes the amount of deviation into account. The position IiK is moved.

(F) EXAMPLE An example of the present invention will be described in detail below with reference to FIGS. 1 to 6.

FIG. 2 is a diagram showing an electronic component automatic mounting apparatus to which an embodiment of the present invention can be applied.

(1) is an electronic component automatic mounting device that attaches chip-shaped electronic components (not shown) to printed circuit boards (2+VcVi).

(31 (43 is a pair of conveyors for conveying the substrate (2).

(5) is a four suction head section having a suction nozzle (6), which is moved to suction by the drive of the do section drive section (5A). That is, the guide body (7) is movable in the x direction by an X direction drive source along the
It is movable along the Y-axis direction guide body (8)<93 by a directional driving source. Therefore, the head portion (5) is
It is possible to move in the force direction.

α0 is a tape feeder unit that is housed in the tape αD and feeds the round portion 66 one pitch at a time, and a supply reel (13) is housed in a box (13).

The α core is a parts magazine in which parts are stored vertically.

α is a component tray on which components are placed.

(161 is a recognition camera provided near the conveyor (4), which recognizes the position of the suction nozzle (6) when it is moved upward by its drive system.

FIG. 1 is a configuration circuit diagram of one embodiment.

an is the keyboard α & as an input device for setting various data, the screen selection key ■ of the monitor TV σ9, and the recognition start switch (20A) that starts nozzle position recognition.
, a start key QI for starting a component mounting operation), and various data are generated by operating each key on the keyboard (181).

r22 is a CPU as a control device, and the recognition camera α
The camera recognized by e (the suction nozzle (6) that has been moved to the Le center and has not picked up any parts)
camera (location data for 161 centers and
RAMel! as a storage means for 3) The recognition camera (Lllll center and the suction nozzle (6) housed in
), a comparison means Q41 that compares the reference position data with which the rotation center of the rotation center coincides with the reference position data, a calculation means (c) that calculates the amount of deviation compared by the comparison means (goods), and the calculation means (c)
Adjust the suction nozzle (6) to RA by taking into account the amount of deviation obtained in
The suction head drive unit (5) moves the suction head unit (5) to the set position stored in the M.
A) has a command means for issuing a command.

Incidentally, the amount of deviation obtained by the calculation means (c) Kj is the above-mentioned R
It is stored in a predetermined area of AM (c).

1fc, the functions of the above-mentioned RAM may be separately provided in two storage means.

The punishment is the RO where programs related to parts installation operations are stored.
It is M.

(Support) is a nozzle rotation part that rotates the suction nozzle (6) by driving the rotation part drive part (28A).
6) is rotated about its axis. Further, the rotation center of this nozzle (6) is not necessarily the axis of the nozzle (6).

is an interface, and (to) is an address counter.

The operation will be explained in detail below based on the drawings.

According to 70-char)K regarding the component mounting operation shown in FIG. 4, the mounting operation on the board (2) is performed.

First, the start key at+ is pressed to start the electronic component automatic mounting device.

Then, when the operator presses the recognition start switch (20A) which causes the position recognition of the suction nozzle (6) to be performed, the position recognition is performed according to the flowchart shown in FIG. That is, by driving the suction head drive unit (5A), the suction head (5) is moved onto the recognition camera αυ, recognizes the arrival position of the suction nozzle (6), and compares the position data with the comparison means. (Foundation) compares the matching position data between the recognition camera αG center stored in the RAM (c) and the rotation sensor of the suction nozzle (6), and if there is no deviation, leave it as it is and remove the deviation. If there is, the calculation method (c)
The amount of deviation is calculated and stored in the RAM (to).

After the amount of deviation of the nozzle (6) is stored in the RAM (231), the component mounting operation is performed taking the amount of deviation into consideration according to the program for the component mounting operation shown in FIG. is cleared, and the board (2) is brought into the component mounting work stage and positioned.

Then, the suction head part (5) picks up the first part (R1))
The suction nozzle (6) picks up the first part (
This nozzle (6) adsorbs the part (R1)
The adsorption state! &! ! ! The component is moved to a component recognition station where the component is recognized, and a recognition camera section (not shown) recognizes the positional shift of the component here, and correction is performed. Adjust the first part (R1) to the angle 2. shown in FIG. The nozzle rotating part (2) is rotated by the rotating part driving part (28A) VC so that the suction head part (5) is at the first mounting position indicated by the address counter (to) At the coordinates (X8, Y,) on the board (2) shown in FIG.
The part (R,) is installed at a position that takes into account the amount of deviation of the nozzle (6) stored in the nozzle (6).

In this example, the amount of deviation of the nozzle (6) is determined by RAMe.
! 31, and when moving it to the installation position, the amount of displacement is taken into account, but this is not limited to this.If the positional displacement of the nozzle (6) is recognized, the above-mentioned component amm stationary nozzle It is also possible to correct the positional deviation in (6) and move it to the mounting position (XI, Yt) according to the program shown in FIG. After that, the address counter (to) is incremented, and the suction head (5) picks up the next part, and goes to 9th.
According to the above operation, mounting position ffK: the component is mounted. This operation is repeated until all parts have been mounted on one board (2).

Then, this board f2) is ejected, the next board (2) is taken in, and the parts are mounted in layers on the second board 12) as described above.

Also, in this embodiment, the position of the suction nozzle (6) is recognized! ! ! ! Although the recognition timing is performed before the board (2) is taken in, the present invention is not limited to this, and can be performed when the operator arbitrarily presses the recognition start switch (20A). Furthermore,
It is also possible to specify the timing of Jin's recognition so that the recognition is automatically performed. Other embodiments using this automatic designation will be described below.

(31) shown in Figure 7 is a suction nozzle (6) that detects the temperature in the room where the automatic electronic component mounting device (1) is installed.
Based on the temperature sensor +33 installed near the temperature sensor +33 and the temperature sensor c3S5, if the temperature exceeds the set temperature,
a temperature sensor (to) that sends the signal to the CPUe3;
It is a temperature detection means having. This temperature detection means afl
When the indoor temperature detected by K exceeds the set temperature, a signal indicating that the temperature has exceeded is sent to CPU K, and the above-mentioned nozzle (6) W1 recognition is performed below.

Also, the (goods) shown in Figure 8 are V! It is a timer that specifies the detection timing in terms of time, and when a certain set time is reached, V! K to make sense. The timer σ00 is set at fixed intervals, that is, how many times the wearing operation must be repeated before the recognition operation is performed, and the temperature is also considered.
In particular, KiE should be performed frequently during the time period.
You may change the interval of R-sensing, as shown in Fig. 9 (to)
When all the components have been mounted on the board (2),
) is a substrate ejection detection sensor that performs recognition when it detects that it has been ejected, and the suction nozzle (6) digit f! K may also be used to perform ll recognition.

Further, the recognition timing may be written in the 7' program.

From the above, it is a matter of course that the recognition timing for performing the eta recognition of the suction nozzle (6) is not limited to the example given as an example.

Furthermore, in the embodiment, in order to recognize the rotation center of the suction nozzle (6), K11j! Although the recognition camera ae is provided, the role of the camera αG may be provided to the recognition camera section of the recognition stage 30, which recognizes the state of suction of the component by the suction nozzle (6)K.

At this time, you can see the parts with the camera section and the nozzle (6).
Since the focal length is slightly different from that for viewing, the suction hept part (
5) must be moved downward by a drive source such as a pulse motor for focusing.

(G) Effects of the Invention With the above-described configuration, even if the components in the device shift from their initial set positions due to temperature changes or changes in pressure over time, the component mounting operation is not affected.

[Brief explanation of the drawing]

Fig. 1 is a circuit diagram showing the main parts of an electronic component automatic #& placing device to which an embodiment of the present invention is applied, Fig. 2 is a perspective view of the opening, Fig. 3 is a diagram showing the installation position of a recognition camera, and Fig. 4 is a diagram showing the installation position of a recognition camera. FIG. 5 is a flow chart showing the nozzle position twill operation; FIG. 6 is a program related to the component mounting operation; FIG.
9 to 9 are diagrams showing other embodiments. (6)...Adsorption nozzle, cle...recognition camera,■
...CPU. (c)...RAM, (goods)...comparison means, ■...
Calculation means, (to)...command means.

Claims (2)

[Claims] (1) a recognition camera that recognizes the rotational center position of a suction nozzle that sucks and holds a chip-shaped electronic component; and a first storage means that stores relative reference position data between the camera and the rotational center of the nozzle; a comparison means for comparing the reference position data stored in the storage means and the position data recognized by the camera; a calculation means for calculating the amount of deviation compared by the comparison means; and an amount of deviation obtained by the calculation means. A nozzle position recognition device comprising: second storage means for storing; (2) A recognition camera that recognizes the rotation center position of the suction nozzle of the suction head driven by the suction head drive unit, and a first camera that stores relative reference position data between the camera and the rotation center of the nozzle. storage means, comparison means for comparing the reference position data stored in the storage means and position data recognized by the camera, calculation means for calculating the amount of deviation compared by the comparison means, and from the calculation means. a second storage means for storing the obtained amount of deviation; a command means for issuing a command to the suction head drive unit to take the amount of deviation into consideration when moving the suction head later;
A nozzle position correction device consisting of: