JPH0250197B2 - - Google Patents

Info

Publication number
JPH0250197B2
JPH0250197B2 JP179283A JP179283A JPH0250197B2 JP H0250197 B2 JPH0250197 B2 JP H0250197B2 JP 179283 A JP179283 A JP 179283A JP 179283 A JP179283 A JP 179283A JP H0250197 B2 JPH0250197 B2 JP H0250197B2
Authority
JP
Japan
Prior art keywords
flat plate
electrode
etching
upper electrode
plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP179283A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59126778A (ja
Inventor
Isamu Hijikata
Akira Uehara
Hisashi Nakane
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Ohka Kogyo Co Ltd
Original Assignee
Tokyo Ohka Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Ohka Kogyo Co Ltd filed Critical Tokyo Ohka Kogyo Co Ltd
Priority to JP179283A priority Critical patent/JPS59126778A/ja
Publication of JPS59126778A publication Critical patent/JPS59126778A/ja
Publication of JPH0250197B2 publication Critical patent/JPH0250197B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32431Constructional details of the reactor
    • H01J37/32623Mechanical discharge control means

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • ing And Chemical Polishing (AREA)
  • Drying Of Semiconductors (AREA)
JP179283A 1983-01-11 1983-01-11 プラズマエツチング方法及びその装置 Granted JPS59126778A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP179283A JPS59126778A (ja) 1983-01-11 1983-01-11 プラズマエツチング方法及びその装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP179283A JPS59126778A (ja) 1983-01-11 1983-01-11 プラズマエツチング方法及びその装置

Publications (2)

Publication Number Publication Date
JPS59126778A JPS59126778A (ja) 1984-07-21
JPH0250197B2 true JPH0250197B2 (enrdf_load_html_response) 1990-11-01

Family

ID=11511424

Family Applications (1)

Application Number Title Priority Date Filing Date
JP179283A Granted JPS59126778A (ja) 1983-01-11 1983-01-11 プラズマエツチング方法及びその装置

Country Status (1)

Country Link
JP (1) JPS59126778A (enrdf_load_html_response)

Families Citing this family (98)

* Cited by examiner, † Cited by third party
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JPS63164433A (ja) * 1986-12-26 1988-07-07 Matsushita Electric Ind Co Ltd ドライエツチング装置
DE3708717A1 (de) * 1987-03-18 1988-09-29 Hans Prof Dr Rer Nat Oechsner Verfahren und vorrichtung zur bearbeitung von festkoerperoberflaechen durch teilchenbeschuss
US7459098B2 (en) * 2002-08-28 2008-12-02 Kyocera Corporation Dry etching apparatus, dry etching method, and plate and tray used therein
US9324576B2 (en) 2010-05-27 2016-04-26 Applied Materials, Inc. Selective etch for silicon films
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US11257693B2 (en) 2015-01-09 2022-02-22 Applied Materials, Inc. Methods and systems to improve pedestal temperature control
US20160225652A1 (en) 2015-02-03 2016-08-04 Applied Materials, Inc. Low temperature chuck for plasma processing systems
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US10128086B1 (en) 2017-10-24 2018-11-13 Applied Materials, Inc. Silicon pretreatment for nitride removal
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US11121002B2 (en) 2018-10-24 2021-09-14 Applied Materials, Inc. Systems and methods for etching metals and metal derivatives
US11437242B2 (en) 2018-11-27 2022-09-06 Applied Materials, Inc. Selective removal of silicon-containing materials
US11721527B2 (en) 2019-01-07 2023-08-08 Applied Materials, Inc. Processing chamber mixing systems
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Also Published As

Publication number Publication date
JPS59126778A (ja) 1984-07-21

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