JPH02500907A - Ceramic/glass/metal composite - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed description of the invention] Ceramic/Glass/Gold Muichi Although the present invention can be used in a wide range of applications, it is particularly applicable to superconductor chips individually or in groups. Suitable for use as parts that are assembled and manufactured. To name a few, the present invention , electronic component packages, artificial human body substitutes, grinding wheels, engine parts and ceramics. concrete with desired properties that can be particularly adapted to special applications such as engine engines. Describes the bonding of ceramic particles together to form a composite composite. Ru.

Traditionally, glass-ceramic composites have been formed into complex shapes using a one-step process. This person The method has been found to be effective for many applications. However, the final product For more complex shapes, greater pressure is applied to form the composite in the mold. is necessary, so that the molten glass is squeezed out between the particles and the ceramic particles The result is that they are fixed to each other. This makes it even more difficult to flow, resulting in the desired final shape. more pressure is required to densify and shape the composite, or it The present invention solves this problem by combining ceramic particles, glass, and metal. The solution is to increase the flow of the composite within the mold by combining the particles with Ru.

Composites may be formed from a combination of materials that are electrically conductive or non-conductive. Can be done. The coefficient of thermal expansion can also be adjusted according to the requirements of the particular application.

Composites that are non-conductive but have a low coefficient of thermal expansion are particularly useful in the electronics industry It is. Currently, for semiconductor packages, hybrid packages and chip carriers, Low expansion materials are widely used in the microelectronics industry as substrate materials for It is. These materials have a limited coefficient of thermal expansion (CTE) of the base material. When the silicon chip or low-expansion wireless chip carrier is directly attached to the substrate This is particularly useful when

Alumina ceramic is a substrate material that is currently widely used. alumina There is a slight mismatch between the coefficient of thermal expansion and the coefficient of thermal expansion of the silicon chip. This inconsistency When a chip attached to a lumina substrate is subjected to thermal fluctuations, it is difficult to tolerate it. This degree of CTE mismatch, which does not necessarily result in extremely large stresses, Even when the size is relatively large or the chip is firmly adhered to the substrate, the permissible come. Alumina ceramics are less expensive than most other low expansion substrate materials. And it's particularly attractive. However, alumina ceramics made using traditional methods is difficult to adjust within tolerance and has low thermal conductivity, i.e., about 10 to about 20 watts. Conductivity in the range of T/M'', limited to alumina substrate areas less than about 50 in. There are many drawbacks, such as poor manufacturability.

Conventional ceramic articles, in particular ceramic substrates, may be manufactured according to the following methods: , alumina or other ceramic material powder mixed together with glass powder and organic matter do.

In the traditional "green tape" or "cold press" method, organics such as terpinol are It is a two-phase mixture consisting of a solvent such as polymethyl methacrylate and a solute such as polymethyl methacrylate. child A special solvent-solute mixture is one example, and other organic mixtures can be used instead. Good too. The organic mixture becomes a paste when combined with the glass and ceramic powder mixture. form a slurry or slurry. The solute-to-solvent ratio and type of organic mixtures are , i.e. the preferred paste for the "green tape" or "cold press" method. selected according to

In the green tape method, a controlled amount of slurry is placed between two plastic plates. Ru. The slurry sandwiched between plastic plates is passed through a roll mill to a uniform thickness. do.

The sheet of material is then cut or punched to the desired size and fired. cold press The method uses glass and ceramic powders with a lower proportion of solvent compared to the raw tape method. The mixture of glasses, ceramics and organics is then pressed into the desired shape. , to be fired.

In both methods, the organic matter is removed by firing or treating the ceramic object or substrate. volatilize at a temperature substantially below the operating temperature. Solvents are typically heated to temperatures below 100°C. The solute evaporates at temperatures below about 450°C. solute and solvent are lost This creates porosity in the green tape or cold pressed object. Maximum firing temperature (conventional At about 1600℃ for ceramics and about 900℃ for low-temperature fired ceramics), glass The gas phase melts and sintering of the alumina particles takes place, resulting in densification of the object. It will be done. A fired substrate with no open pores provides very limited gas permeability. (< I This latter property of makes them useful for producing hermetically sealed semiconductor enclosures. be particularly suitable for

However, densification results in large shrinkage in the linear direction, amounting to 17%. Therefore, direct It is not practical to economically produce final parts with a linear tolerance of better than about ±1%. Therefore, the size tolerances of standard fired ceramic substrates are limited by the manufacturer. Typically, it is said to be ±1%. stricter size tolerance Volume errors are also significantly more expensive to offset the loss in yield.

In the electronics industry, manufacturing plants are becoming increasingly automated. automatic Machines generally handle parts, such as the substrate mentioned above, at a rate far greater than ±1% in the can be arranged to meet tight tolerances.

In fact, the tolerances on ceramic components are almost always limited to the desired level of automation. It is a factor that restricts achievement.

The present invention is suitable for firing at conventional ceramic firing temperatures, i.e., approximately 1600°C or Even if the firing temperature of "Mick" is about 900℃, it can be done by conventional means at a temperature sufficiently lower than that. Manufacture ceramic, glass, and metal structures into their final shapes in a one-step process using The method of the present invention provides a unique method for producing This imparts unique properties to the manufactured articles.

The present invention is an article that fundamentally improves the CERD IP method and a method for manufacturing those articles. It also relates to how to Currently, the CBRDIP method uses a base and a lid. The package is sealed at a relatively low temperature, approximately 470°C, using a glass sealant. Seal. A metal conductor structure is present in the sealant. CERD I P sealing part strength The strength of the glass seal, the length and width of the seal, the presence of porosity or other discontinuities , and ultimately depends on the nature of the bond between the glass and the metal conductor structure6 typically , the glass is the weakest part of the CERD IP package. conductor frame and glass Adhesion to the encapsulant is relatively poor in most package constructions.

Seals may easily break when subjected to significant mechanical or thermal/mechanical loads. Ru. Under the same conditions, the more expensive ceramic sidewall brazing with metal sealant In the page, it will remain as it was.

CERD IP structures have been modified to compensate for their inherent weaknesses . They have a larger sealing area compared to the package with sidewall brazing of the same size. has.

As a result, when sidewall brazing is used, the width of the cavity for chip attachment is narrower than for packages. It becomes. If the amount of space accommodating the package is limited, the CER The narrow size of DIP makes it impossible to fit the tip into the cavity. Larger chips can be attached to ceramic packages without more expensive sidewall brazing. The present invention solves this problem by separating the conductor frame from the inside of the glass seal. This can be solved by The conductor structure is packaged with side wall brazing. It can be securely fixed to the base or lid of the package. obtained A good package resists the stress caused by bending the conductors, which often occurs during package handling. will not be communicated to the entire sealed section.

At the same time, tip mounting can increase the cavity size, resulting in Sidewall brazing offers the same reliability as packaging, but is competitive at a much lower price. can be matched.

The present invention provides pin grid arrays and sidewall soldering for multilayer packages such as packages. It is also suitable for manufacturing cages.

Around the world, fine ceramics are of paramount importance for the 1990s and the 21st century. It is considered to be one of the basic materials. This expectation is based on the following reasons: Ru. First, fine ceramics are used in electronics, information technology, and biotechnology. new foundations to develop and advance cutting-edge technologies such as medical electronics, medical electronics, etc. It is expected to play an important role as a basic material. The future of these technologies is new depends on the development of new materials. They are heat resistant, corrosion resistant, radioactive, etc., and are currently available. There is a need for materials that have greater capabilities than those that can be used. They are chemistry, light There is also a need for new functional materials that exhibit advanced performance in terms of mechanical and electromagnetic functionality.

Fine ceramics can meet these demands and therefore can meet these advanced technologies. It is a material that can act as one of the key materials supporting the anticipated development of It is believed that Second, the excellent properties of fine ceramics are The technology is expected to help improve the quality of those products. Self Ceramic engines are a perfect example for the automobile industry. Obviously, F. Fine ceramics is an important material for the currently stagnant basic materials industry. We hope that by becoming a supplier of has been done. Third, fine ceramics are important from the perspective of each country's national economic defense. It is considered important since. Each country has natural resources, including oil and precious metals. We are concerned about preservation. Therefore, the development of ceramic engines , which is what is being aspired to to preserve oil. Nickel, cobalt and There is also hope for the development of ceramics as a substitute for precious metals such as ROM. Ru.

Currently, the main fields of application are electromagnetic and mechanical components. The former is an electrocell It is called Lamix, and is used for IC packages, electric capacitors, thermistors, and other materials. Includes a resistor.

Mechanical and heat resistant ceramics are called engineered ceramics and are traditionally It is used in applications such as engines, turbo-loaded turbines, and ceramic engines.

Ceramics can be applied to information electronics, and functional ceramics are already available. This is one of the main fields in which it is used. Ceramics as structural materials are actually It's not that widely used. However, they are automobiles, industrial machinery It is expected to play an important role in improving the efficiency of energy use in equipment, etc. There is. Structural ceramics with excellent mechanical and thermal capabilities are engineered ceramics It is also known as ``S'' and is considered to be of great importance in the future. Furthermore, electricity Functional ceramics such as ceramics and optical ceramics are As a result of the miniaturization and packaging of Nix Industry's new equipment, expected to be long. Biothera used as artificial teeth and replacement joints mix is also beginning to show rapid growth, likely to be spurred by advances in medical technology. cormorant.

The innovative features of the present invention make composites suitable for many segments of the growing ceramics industry. It will be possible to use it effectively in the field. The composite contains a large amount of ceramic particles. Even if it contains, it is then molded at gentle pressure and temperature into a complex final shape. can do. The key to this discovery is that metal or The purpose is to add metal alloy particles at low concentrations. Traditionally, the required high pressures were mainly relatively It could only be used to form simple shapes. metal or metal alloy particles Additives can be used to create complex shapes with tight tolerances.

This is because the composite flows very easily at processing temperatures. The molding method is It is somewhat similar to that involved in plastic injection molding. Currently, complex shapes Ceramic products with are manufactured due to factors including shrinkage and hardness of the ceramic. Once a ceramic article has been formed into its general final shape, it Machining the design is very time consuming and expensive.

Even with this geometrical constraint, ceramic materials are known for their great strength and chemical resistance. For example, ceramics are used in many products that take advantage of their durability and light weight. Mixes are used in engines, artificial limbs, and cutting tools, to name a few. It is.

A ceramic-glass-metal composite whose physical properties can be determined through judicious selection. can be tailored to provide specific mechanical, electrical, thermal and chemical properties. Manufacturing electrical component packages incorporating complexes that can This is a problem.

One advantage of the present invention is that it overcomes one or more of the limitations and disadvantages of conventional structures discussed above. Electrical component package incorporating a composite body and method for forming the composite body It is to give.

A further advantage of the present invention is that it incorporates a composite that provides a substrate with good bending strength. An object of the present invention is to provide a method for forming an electrical component package and a composite thereof.

Yet another advantage of the present invention is the ability to manufacture parts with tight tolerances. To provide an electrical component package incorporating coalescence and a method for forming a composite thereof. That is.

Yet another advantage of the present invention is that it incorporates composites that can be fired at low temperatures. An object of the present invention is to provide a method of forming an electrical component package and composite thereof.

A further advantage of the present invention is that it incorporates composites that can be processed at low cost. An object of the present invention is to provide a method for forming an electrical component package and a composite thereof.

A further advantage of the present invention is that parts formed from ceramic-metal-glass composites It involves burying metal parts inside.

A further advantage of the present invention is that ceramics formed from ceramic-metal-glass composites Provides an electrical component package incorporating a conductor structure embedded in a microsubstrate That's true.

A further advantage of the present invention is that metal parts can be incorporated into ceramic-glass-metal composites as desired. An electrical component package incorporating a multilayer device fabricated from that composite embedded in the location of It is to provide a package.

A further advantage of the present invention is that ceramic glass can be formed into complex shapes. - To provide engineered ceramic products formed from metals.

Therefore, a component for surrounding a semiconductor device and a method for forming the component are required. Given. These parts are made of a unique ceramic-glass-metal composite material; Ceramic particles, metal particles and ceramic and metal particles dispersed throughout the composite formed from a composite material consisting of a glass phase and a glass phase for adhering them together. complex is a hot process in a mold, which can simplify the manufacturing of semiconductor packages. It may be formed in one step by conventional processes such as forging and hot pressing.

The present invention allows metal parts to be embedded into the composite during a hot pressing process. , especially for forming hybrid packages, circuit boards and multilayer devices for CERD IP It can be applied to

Engineered ceramic products formed from ceramic-glass-metal composites are also provided. It will be done. These products are strong, durable, can be formed into complex shapes, and can be modified. It has good thermal conductivity. These include rotors, engine brakes, to name a few. Includes locks, body part replacements, and grinding wheels. Ceramic/Glass/Metal The composite includes ceramic particles, glass and glass for adhering the ceramic particles together. Contains metal particles to improve flow properties at high and processing temperatures.

The present invention and its further development will be described below using the preferred embodiments shown in the attached figures. Explain.

Brief description of the drawing FIG. 1 is a diagram illustrating a conventional CERD IP package.

FIG. 2 is a diagram illustrating a conventional substrate in which a conductive wire structure is bonded with glass. .

FIG. 3A is a diagram illustrating a CERD IP package according to the present invention.

Figure 3B shows the ceramic glass gold of Figure 3A with the conductor structure embedded therein. FIG. 3 is a diagram illustrating a cross-sectional view through a genus substrate;

FIG. 4 shows a CERD I with metal square plates in the cavities of the base and lid according to the invention. It is a figure which illustrates a P package.

FIG. 5 is a diagram illustrating a ceramic-glass-metal composite substrate according to the present invention. be.

Figure 6A shows a ceramic-glass-metal composite layer with openings passing through it. It is a figure which illustrates the composite layer which has.

FIG. 6B is a cross-sectional view taken along line BB in FIG. 6A.

Figure 7A illustrates a layer of ceramic-glass-metal composite with an aperture therethrough. This is a diagram.

FIG. 7B is a cross-sectional view taken along line BB in FIG. 7A.

FIG. 8 is a diagram illustrating parts of a multilayer device before hot pressing.

FIG. 9 is a diagram illustrating the parts of the multilayer device after hot pressing.

FIG. 10 is a diagram illustrating a semiconductor case having a cooling section.

FIG. 11 shows a semiconductor formed from a ceramic-glass-metal composite according to the present invention. FIG. 3 is a diagram illustrating a body case.

Figure 12 shows a structure formed from a ceramic-glass-metal composite with a ceramic lid. FIG.

Figure 13 shows a half formed from a ceramic-glass-metal composite with a metal lid. It is a figure which illustrates a conductor case.

FIG. 14 shows a semiconductor device similar to the embodiment shown in FIG. 12, but with no cooling section. FIG. 3 is a diagram illustrating a conductor device.

Figure 15 shows a semiconductor case formed from a ceramic-glass-metal composite body. A case with a cup-shaped member that serves as a surface that also couples the semiconductor device to the cooling section. FIG.

Figures 16A-16E illustrate multilayer ceramic-glass-metal circuit structures according to the present invention. It is a figure which illustrates a series of steps for forming a structure.

FIG. 17 is a perspective view of a ceramic rotor for a turbo-loaded turbine.

FIG. 18 is a perspective view of a hip and foot bone prosthesis.

FIG. 19 is a perspective view of the ceramic engine.

FIG. 20 is a perspective view of the grinding wheel.

FIG. 21 is a perspective view of the ceramic engine block.

The present invention particularly focuses on the mixture of ceramic and metal particles bonded together by glass. Concerning complexes formed from things. The composite consists of the selected glass at least such as hot forging and hot pressing at a processing temperature that softens the material, preferably into a fluid state. It can be molded into the desired shape using the following methods. The resulting molded composite is For example, semiconductor devices, hybrid packages, multilayer packages or rigid printed circuits. Particularly suitable for forming a substrate for plates.

The present invention utilizes at least three different types of materials to provide selected properties. including mixing together in appropriate proportions. One of those materials is ceramic. powder, it has the desired physical and chemical properties such as mechanical, electrical, and thermal properties. It is present in a selected volume % range according to the desired properties. typically Ceramic has physical properties including high strength, low malleability, high dielectric constant, and low coefficient of thermal expansion. and is known for its chemical non-reactivity.

The second material is glass, because it binds the ceramic particles and metal particles together form a matrix of Since glass is relatively brittle, it is mainly affected by ceramic particles. is typically applied at a rate that prevents significant reduction in the composite strength given by It is true. Glass, like ceramic particles, is a third material, metal or alloy particles. selected to chemically react with the child. The third material is made of metal or alloy particles. and they are distributed throughout the complex. Metal or alloy particles are composite processed Ceramic-glass slurry alone and while being pressed into the desired shape at high temperatures. Allows ceramic particles to be moved with a comparatively lower applied pressure. Furthermore, gold The metallic particles improve the thermal conductivity of the composite. Metal particles are preferably soft and malleable. , they flow onto adjacent surfaces between adjacent ceramic particles. tend to allow the ceramic particles to slide into each other without breaking during the forming process. It is thought that it will be possible. Metal particles and ceramic particles are fixed to each other. substantially reduces the pressure required to form the final shape. It is believed that this will decrease. The resulting complex is then processed in a one-step process. can be easily formed into complex final shapes with tight tolerances. It is particularly useful in this respect.

Ceramic materials typically consist of particles selected for their physical properties. Typical. Specific ceramics include Al2O3, SiC, Bed, TiO2, Zr Consisting of O2, MgO1A IN, S isN, BN and mixtures thereof The invention is limited to these ceramics which can be selected from the group 0 Any ceramics or mixtures of ceramics may be used instead. . The ceramic particles range from about 20% to about 80% by volume of the final fired composite, preferably is present in a range of about 40 to about 65% by volume. What kind of ceramic particles would you like? may have an average diameter of greater than about 1μ, preferably from about 1 to about 20 0μ, most preferably about 40 to about 100μ. ceramic of hope Factors considered in selecting the material include dielectric constant, coefficient of thermal expansion, strength and chemical resistance. Includes durability.

Traditionally, ceramics are selected because of their high temperature capabilities. Why This is because their melting points range from about 300°C to about 2500°C. deer However, the present invention may not require high temperature capability. Because ceramic particles , a glassy matrix with a lower softening temperature compared to that of its ceramic This is because they are joined together during the process. It can be made into parts that are stable at very high temperatures. It is also within the scope of the present invention to select a glass that can be used.

The second component of the complex has the desired composition according to the properties required by the final complex. It consists of a glass phase with

The glass phase binds ceramic and metal particles together within a glass matrix. It works to An important property is that the glass preferably has ceramic and metal particles. It is a chemical reaction with both. In addition, glass has good chemical durability and high strength. physical properties such as temperature, acceptable dielectric constant, and softening point within a selected temperature range. It is also important to have Suitable glasses include silicates, borosilicate, phosphates, zinc borosilicate From glasses such as silicates, soda/lime/silica, lead silicates, lead/zinc/borates, etc. Any desired glass may be used; includes phosphate glasses with large coefficients of thermal expansion and relatively low softening points. Ru. Furthermore, vitreous or devitrified Glass may also be selected.

Useful glass properties that provide thermosetting properties suitable for use in electronics applications A good example is devitrified solder glass. This glass is P bo-Z no-B 2 0 S type glass, approximately 10% by weight B, 0.025% by weight A, 8.5% by weight % Si, 0.04 wt% Ti, 0.01 wt% Fe, 8.5 wt% Zn , 12.5% by weight Zr, 0.25% by weight Hf, 2.0% by weight Ba, and the balance It has a nominal composition of the remainder pb. All elements are the weight of the corresponding oxide It is stated as a percentage. After the glass becomes a liquid, it is heated to a temperature of about 500℃. Hold for approximately 10 minutes. Next, when the glass is solidified, it becomes devitrified.

At that point, the glass does not remelt until it reaches a temperature of approximately 650°C. present in the range of about 15 to about 50% by volume, preferably about 20 to about 40% by volume of the combined Exists within the range of

Preferably, the glass is selected to have a softening temperature of about 300 to about 1300°C. The processing temperature is at least above the softening temperature of the glass, preferably in liquid form. selected to be in the same state.

Thermoset composites, with ceramic and metal particles, devitrify at temperatures above It may also be formed by mixing with glass. First, the composite is made of glass The zero-order complex is preferably formed at a processing temperature at which the It is kept in an oven at a temperature long enough for it to solidify and have a devitrified structure. Ru. When glass is in its crystalline state, it is usually much stronger than it is in its glassy state. Ru. Composites with this property, i.e. ceramic and metal mixed with devitrified glass The particles of can be characterized as thermoset materials. The latter property is remelted This is given because the temperature is significantly higher than the initial treatment temperature.

For example, in Owens Linois Co. Therefore, the manufactured devitrified solder glass CVIII can be used at a processing temperature of about 470°C. It becomes a liquid. As mentioned earlier, this glass is a PbO-Zn0-BzO* type glass. about 10 wt% B, 0.025 wt% A, 8.5 wt% Si, 0 ．． 04 wt% Ti, 0.01 wt% Fe, 8.5 wt% Zn, 12.5 wt% % by weight of Zr, 0.25% by weight of Hf, 2.0% by weight of Ba, and the balance PB, It has a nominal composition of All elements listed as weight percent of corresponding oxide has been done.

After the glass becomes liquid, hold it at a temperature of about 500°C for about 10 minutes, and the As a result, it becomes solidified and has a devitrified structure. At that point, it has a temperature of about 650℃ The thermosetting properties of devitrified glasses, which do not remelt until temperatures are reached, are particularly advantageous. . This is because the final product is exposed to temperatures higher than the initial processing temperature. This is because it becomes possible to use it.

The third component of the composite preferably consists of metal particles that are malleable at the processing temperature. Money The genus particles have the ability to significantly reduce the pressure required to densify the final composite product. It is given to us to have. They are squeezed between ceramic particles during the processing process and flows around the surface of the ceramic particles, thereby fixing the ceramic particles to each other. It is thought that this reduces or eliminates the processing pressure. For example, in normal processing is a mixture of ceramic particles, metal particles and glass, where the metal particles soften and become malleable. This includes heating the material to a processing temperature that causes it to form, but not melt. The resulting composite slurry The lee can be molded, ie, formed in a mold.

Ceramic/glass/metal slurry flows into the shape of the mold and forms ceramic particles. are squeezed into each other. The glass phase is squeezed out from between adjacent ceramic particles and Give a touch point. In the absence of metal particles, the ceramic particles remain in contact , fixed in that position, thereby retarding the flow ability of the slurry. complex Ease of flow is necessary for densification and shaping into the desired final shape. flow The reduction in quality becomes more important as the final shape becomes more complex.

A unique aspect of the present invention is that metal particles are added into the composite to improve the fluidity of the composite slurry. The aim is to have a significant impact on The metal particles slide the ceramic particles together It acts as a kind of lubricant that makes it possible to

Those consisting of metal particles migrate into the gaps between adjacent ceramic particles and form ceramic particles. It is thought that the particles flow to the point of contact where the particles become fixed to each other. touch each other Metal particles that are squeezed out by nearby ceramic particles adhere to the ceramic particles. It is thought that it deforms. This deformation prevents damage to the ceramic particles. While stirring, the slurry containing the ceramic particles is allowed to move and flow in the mold. become.

Metal particles may be formed from any metal or alloy that does not melt at the processing temperatures of the composite. Preferably, the metals and alloys include aluminum, copper, iron, silver, gold. , stainless steel, and alloys thereof.

The selected metals and alloys are any metal that is preferably malleable at the processing temperature. Or alloys have slight malleability at temperatures lower than their melting and solidus temperatures, respectively. Therefore, depending on the appropriately selected processing temperature, it becomes malleable at that processing temperature. Other metals or alloys can be used. The metal or alloy is sufficiently malleable at the processing temperature If this is not the case, apply additional pressure during the forming process to provide the required deformation. You may do so. The metal or alloy particles have an average diameter of about 0.01 to about 50μ. It is preferable to do so.

The final fired composite contains metal particles dispersed throughout the composite, either continuously or discontinuously. Even if the metal particles are continuously dispersed, they are The particles do not form a lump and are mainly locally sintered, which are continuously dispersed. If the particles are dispersed discontinuously, the product is classified as conductive. If so, the product would typically be classified as an insulator.

The metal particles, up to about 45% by volume of the fired composite, improve the flow properties of the composite at processing temperatures. is present in the complex in an amount effective to enhance. The metal particles are about 5 to about 4 parts of the composite. Preferably it constitutes 5% by volume.

Composites are classified as insulators for electrical packaging of components. For applications where it is preferable to distribute the metal particles discontinuously throughout the fired composite. The metal or metals in this case preferably given in volume % as dispersed Preferably, the alloy particles constitute less than about 25% by volume of the final fired composite. Preferably, the metal particles constitute less than about 15% by volume of the fired composite. Layer preferred. Limiting the volume percent of metal particles within these ranges will result in the final firing complex. It is believed that this prevents the formation of continuous metal paths during coalescence.

Even when the final composite contains discontinuously dispersed metal particles, the ceramic particles compared to composites formed where only the glass is bonded together by a glass matrix. , the final composite with dispersed metal particles exhibiting improved thermal conductivity It is particularly surprising that it has conductivity. Because the electrical conductivity This is because there is no corresponding increase. The reason for this unusual property is not fully understood. stomach.

For applications where the composite is preferred to be classified as an electrical conductor, the metal particles are It is preferably given in volume % such that it is continuously dispersed throughout the fired composite. stomach.

The metal or metal alloy particles in this case are greater than about 25% by volume of the final fired composite. Preferably, the metal or metal alloy particles make up about 30% to 30% of the fired composite. More preferably, the volume percent of the metal particles within these ranges comprises about 45 volume percent. limiting promotes the formation of continuous metal paths in the final fired composite. , which is believed to provide good electrical conductivity as well as thermal conductivity. . Such electrically conductive composites can be used in engineering composites and electronics where electrical conductivity is desired. It has wide applications in areas other than the field of electrical packaging, such as electronics complexes. It is considered to be common.

The method of forming the composite of the present invention includes three main ingredients: ceramic particles, metal Includes providing particles and glass. The method depends on the particular material selected. For example, ceramic particles have been mixed with relatively malleable metal particles and then bonded the ceramic particles together. Glass particles may be added to the mixture for the purpose of. The mixture is preferably is the temperature at which the glass particles become liquid or at least corresponds to their softening temperature. Heat to temperature.

This creates a molten glass semicircle with solid metal and ceramic particles dispersed therein. Preferably, a solid slurry is provided. Next, preferably as a semi-solid slurry. The composite is shaped into the desired shape by conventional methods such as hot forging in a mold or hot pressing. Can be molded into shapes. In a hot press, the mixture is heated from about 500 ρsi to about 3 00X It is preferable to squeeze at a pressure of 10'ρsi, the lowest pressure that can be used. is the pressure that can deform the metal particles attached between adjacent ceramic particles. It is thought that This depends on the malleability of the metal or alloy at the processing temperature. metal processed If the temperature is not sufficiently malleable, more pressure may be used to deform the metal particles. You can stay there.

Finally, the mixture is cooled to solidify the glass and bond the composite into the final devitrified shape. do. A conventional release agent such as boron nitride is applied to the mold walls to form a pressed product. The release agent may also be applied to the walls of the mold or the pressed body to facilitate removal from the mold. It is also preferable that it does not stick to the surface. However, make sure that the release agent does not stick to the walls of the mold. An important advantage of the present invention is that the pressed composite is very dense and moldable. The goal is to have a final shape that closely matches the shape of the mold.

The present invention is much more demanding than ceramic manufacturing methods currently used industrially. Parts with tolerances and more complex shapes can be manufactured. This important advantage This is mainly due to the following reasons. First, the starting material is located at the center of the actual manufacturing process. It is not necessary to necessarily contain components such as organic substances. Those organic substances are lost. Excessive contractions can lead to unnecessary contractions. Second, metal particles are separated during processing. Allows the ramic particles to flow better into each other. Other important benefits include firing The temperature, in turn, is substantially lower than the temperature range for firing the ceramic particles. be. Processing at lower temperatures compared to any inherently known method It also reduces processing costs.

Manufacturing methods may include conventional processes including hot pressing and hot forging. . Hot pressing can be carried out directly on powder mixtures or on cold pressed products. Wear.

However, depending on the glass, hot pressing may require an oxidizing atmosphere. for example , PbO-ZnO-B20i, etc., are solder glasses such as PbO-ZnO-B20i to prevent changes in the glass state. requires an oxidizing atmosphere.

Additional improvements in both thermal and mechanical properties include incorporating devitrified glass into the composite. It can be obtained by using For electrical packages, devitrification glass This allows the package to be formed at a temperature significantly lower than the temperature at which the package will operate. I can do it.

An example method is as follows.

Fine-grained (90% 1325 mesh) devitrified glass (Owens-Illinois Co., Ltd.) , CV III) about 45% by volume in the form of fine particles (-120 mesh) of A I20, and approximately 10% by volume of aluminum metal atomized fine powder (-325 metal). mixed with tsushiyu).

The resulting mixture was cold-pressed at approximately 50X 103 psi. At a temperature of 470°C and a pressure of approximately 25X 10'psi, diameter 1174'', thickness 0 ．． The disks were hot pressed into 1" disks.The disks were then placed in a furnace and heated to approximately 500℃. was maintained at a temperature of approximately 10 minutes to devitrify the final structure.

An example of a ceramic-glass-metal composite formed from vitreous glass is: That's right.

Fine-grained (90% 1325 mesh) vitreous glass (Corning, 70 52) Approximately 45 volume% of fine granular (-120 mesh) A I2 03 and about 10% by volume of ferrous metal atomized fine powder (-325 mesh) Can be done. The resulting mixture can be cold-pressed at approximately 50X 10’psi. Ru.

The cold pressed product is then heated to a temperature of about 1220°C and a pressure of about 25 x 103 psi. Hot press onto the board. The disk is then solidified into a glassy final structure. Obtained The disc is thought to be very dense, approximately 70×10-’in/in/ “It has a coefficient of thermal expansion of C.

Ceramic-glass-metal composites can also be made to be electrically conductive. child Give an example of the structure of the species.

Fine-grained (90% 1325 mesh) vitreous glass (Corning, 70 52) About 15% by volume to about 40% by volume of ferrous metal atomized fine powder (-325 mesh) and the remaining fine particles (-120 mesh) of A I20. obtained The mixture can be cold pressed at about 50 x 10'psi. Next, cold-pressed Hot press into disks at a temperature of approximately 1220°C and a pressure of approximately 25X 10’psi. can do. The disk can then be solidified into a glassy final structure. Ru. The resulting disk is considered to be very dense, approximately 86 x 10-'i It has a coefficient of thermal expansion of n/i n/''C.

The aforementioned composites are particularly suitable for applications in semiconductor packages. first preferred In another embodiment, the unique composite of the present invention can be used with a conventional ceramic base and as illustrated in FIG. Regarding the CERD IP package used in place of the lid. Conventional package The lid (8) typically includes a ceramic base (10) and a lid (12) and between them. It has a conducting wire structure (14) arranged therein. The conductor structure is first sealed with a sealing glass (1 6) to the base part (10). glass connecting the conductor structure to the base (10); The base (16) protrudes above the top surface of the conductor structure as illustrated in FIG. . The device (18) is then bonded to the surface of the base using conventional sealing materials. Next, install The wire is electrically coupled to the conductor using a coupling wire (20). Is it sealing glass? A preformed body (21) formed in advance may be placed between the conductive wire structure and the lid (12). stomach. Finally, the lid (12) is placed on top of the glass preform and the base (10). Temperature and pressure are applied to the structure and the package is hermetically sealed. CER of conventional method A potential weakness of the DIP package becomes apparent from FIG. between the base and the lid The sealing glass is placed in the holder and has a conductor structure embedded therein. Therefore, the conductor The glass on both sides of the structure and the glass bonding area are subject to large stress due to bending of the conductor structure. receive. Conductor structures are usually bent during package handling and installation. Receive.

With the advent of the ceramic-glass-metal composite of the present invention, ceramic molded products It can be formed at relatively low temperatures, ie, below about 500°C. this is particularly useful in the manufacture of semiconductor packages. Because, in that case, the important issue This is because extremely large cost savings can be obtained. Ceramic/Glass/ Because lower temperatures can be used to form the metal structure, the useful life of the mold is We live longer and require less energy. However, the glass for the glass phase Rusty low temperature glass deteriorates due to exposure of the formed composite to high operating temperatures. This may result in receiving. To resolve this potential problem, The glass matrix may be formed from devitrified glass as described above.

An important feature of the invention is that metal parts can be embedded into the composite.

This can be achieved in one step during molding of the composite into the final shape. . The metallic component is formed from a metal or alloy that is thermally compatible with the glass phase in the composite. It is preferable that the If the metal part does not adhere to the glass phase, It may be appropriate to apply an adhesive coating to the surface to achieve the same purpose.

Examples of suitable metals include nickel, copper, aluminum, iron, gold, silver and combinations thereof. Includes the group consisting of gold.

When this technology is applied to manufacturing electrical packages, they can have many different shapes. The result is a strong and inexpensive package that can be easily produced. 0 For example, this method uses thick wire structures during the hot forming process when manufacturing CERD IP. It can be used to embed structures into substrates. As a result, the conventional CERD Instead of burying it in a glass sealant as in the case of IP, ceramic glass - Provides a conductor structure buried directly into the metal composite. This new structure Due to the structure, one of the important weaknesses of the CERD IP structure, namely the bending of the conductor structure. This eliminates damage to the glass seal due to scratches.

Referring to FIG. 3, a semiconductor case (22) is illustrated therein. Base parts (2 4) and the lid part (28) are both made of the ceramic-glass-metal composite material of the present invention. (26). Composite materials consist of ceramic particles, a glassy phase for adhering particles together, and discontinuously with respect to each other throughout the composite. Consists of dispersed metal particles. The metal conductor structure (30) is embedded into the base part (24). being admired.

From the group consisting of borosilicates, soda-lime-silica, lead-silicates and lead-zinc borates The base part (24) is connected to the lid part by a sealing glass (32) such as solder glass. (28).

The ceramic-glass-metal composite material (26) is the original material described earlier in this specification. For example, the ceramic particles may constitute about 20 to 200% of the final composite. It accounts for about 80% by volume, preferably about 40 to about 65% by volume of the composite. ceramic The particles are selected to range in size from about 1 to about 200 microns.

The metal particles are present at about 25% of the composite to improve the flow properties of the composite at processing temperatures. It accounts for an effective amount of up to % by volume, preferably up to about 15% by volume. Processing temperature is preferably chosen above the softening temperature of the glass that bonds the composite together. It is more preferable that the temperature is at least the temperature at which the glass becomes liquid. 32) The bonding time and temperature will cause the glass in the composite to severely deform the lid and base. selected so that it does not soften sufficiently to cause Furthermore, the metal particles have a size of about 0.0 1 to about 50μ. Metal particles are selected to improve the flow properties of the composite. It has a higher melting temperature than the processing temperature. metal particles to form a composite selected so that it does not melt at the desired processing temperature. for adhering the complexes together The glass is selected from the group consisting of vitreous glasses and devitrified glasses.

By using devitrified glass as the matrix of the composite, CERD IP Additional improvements in the thermal and mechanical properties of the package can be obtained. Especially devitrification The lath results in improved thermal conductivity and mechanical properties of the composite.

The semiconductor case (22) as illustrated in Fig. 3 can be manufactured by the following steps. good. The base part (24) and the lid part (28) can be manufactured as follows. can. First, polymethyl methacrylate (PMMA) and polyvinyl alcohol Ceramic-glass-metal mixture with an organic binder such as PVA (PVA) Cold pressed to size and shape. The parts are then fired to a temperature lower than approximately 400°C. Then, as shown in Figure 3B, the organic binder is removed by combustion. The body (30) is placed on the top surface of the base part and heated to a temperature at which the glass softens and about 3 00X hot pressing at pressures up to 10'psi, resulting in The top surface is left exposed, the glass solidifies, and the organic matter is burned off and left behind. It fills the stomata.

The conductor structure is formed from a metal or alloy that is thermally compatible with the glass phase in the composite. It is preferable that the In addition, the conductor structure material is a composite material similar to the sealing glass (32). Preferably, it can also be bonded to the combined glass phase. If the metal conductor structure itself is glass If it does not adhere to the phase, an adhesive coating can be applied to the surface of the metal conductor structure to achieve the same purpose. Examples of suitable conductor construction metals that may be suitable for use include nickel. metal, copper, aluminum, iron, gold, silver and their alloys. However, the original Light is not limited to those metals or alloys, but can perform the necessary functions. Typically a semiconductor device (34) which may include any metal or alloy are attached to the base part using conventional bonding materials such as gold-silicon bonded alloys or solders. It may also be attached. Next, the device (34) is connected to the end of the conductor structure by a wire. The pre-molded body of the zero-order sealing glass (32) may be assembled into the base part (24) and the lid part ( 28). Next, the package is brought to the softening temperature of the sealing glass (32). Heat and press together. The package is then cooled and the sealing glass (3 2) to solidify and form an airtight seal.

The type of semiconductor case illustrated in Figure 3 has a unique feature superior to the conventional method CERD IP. It has the following advantages. For example, heating the conductor structure into the base component provides significantly better results. This will result in co-planarity of the conductors. This greatly increases the speed of ultrasonic wire joining machine. It will be better. Because the conductor wire coupling operation between the conductor structure and the chip This is because the production speed is significantly faster. A shiny glass between the ends of the conductor as shown in Figure 2 This also substantially eliminates the This is illustrated in Figure 3B by the conductor structure (30). As shown above, this time it is fixed into the ceramic/glass/metal base (24). It is et al. Vision recognition system i tem) and correspondingly increases the productivity of wire bonding operations. Being big is an advantage. Currently, the visual field identification device is coupled to the CERD IP component. It is used to automatically position the conductor tip of a conductor structure. That outfit The reflectivity of the glass is equal to or greater than the aluminum on the conductor tip. If this happens, people often mistake the tip of the conductor for the intervening glass, etc. The visual field identification device is an achromatic scale. This problem is a problem for visual field identifiers because they operate based on the contrast of the field of view. This will cause a major malfunction. Current solutions are much less expensive than glass as a conductor tip. The goal is to maintain a high standard. This can be achieved through tighter process control. However, identification errors often remain and defective work must be completed by manual machinery. . The method of the invention provides a dark ceramic adjacent to the aluminum or metallized conductor. , thereby giving excellent contrast.

4, another embodiment of the electrical package (31) is shown, The package includes each of the lid part and base parts (2B') and (26'). It includes metal plates (33) and (34) embedded in the inner cavity. This patch The cage (31) is constructed in a manner similar to that described above with respect to the embodiment illustrated in FIG. It can be manufactured by Illustrated in Figure 4 which is essentially the same as that illustrated in Figure 3. Parts that have been identified have the same reference numerals with a '' added. Metal plate is usually made of metal material contains significantly lower amounts of naturally occurring radioactive elements than conventional ceramics. This reduces the possibility of "soft errors". radioactive elements is the cause of soft errors, which is a serious problem for semiconductor memory. Ru. Traditional ceramic manufacturers use high The present invention relies on the use of ceramic materials, as shown in Figure 4. This problem can be solved by filling the cavity of the composite lid (28') with a metal plate (33). has been resolved. This metal plate is thermally compatible with the glass matrix of the composite. Preferably, it is made of a metal or alloy.

It is also preferred that the metallic material is capable of bonding to the glass phase of the composite. If the metal itself If it does not adhere to the glass phase, apply an adhesive coating, such as a plating, to the metal surface. It would be appropriate to achieve the same objective by using Examples of suitable metallic materials include nickel, Includes copper, aluminum, iron, gold, silver and their alloys. Metal plate in the lid (3 3) It is also possible to insert a metal plate (34) that provides electromagnetic shielding into the cavity at the base. It is within the scope of the invention. The metal plate placed in the cavity of the base is about the plate in the lid have the same selection criteria as specified.

CERD IP parts manufactured by attaching metal plates are manufactured using conventional methods. has additional advantages compared to manufactured parts. When installing the device, the metallization of the cavity is In-place mounting requires a much thinner film compared to the traditional method of applying a thick film into the cavity. This may be accomplished by electrodepositing the lume. Those who apply conventional thick film The method applies large thicknesses of gold, about 600 to about 700 microns. this thickness is obtained by the sintering method. The sintered gold layer is porous as a result of this sintering method. It is quality. Gold paste contains gold and glass powder as its main components. child These powders are contained in an organic phase consisting of a solute phase and a solvent phase, and are Provides appropriate rheology for

The porous nature of sintered gold means that equipment installation is a process issue, i.e. Safety countermeasures for the unknown degree of porosity and the problem of not being able to properly control it We need a thicker layer as a countermeasure. During the firing process, the glass flux is chemically is bonded to the substrate. However, the bond between glass and gold has mechanical properties, The phase and gold interpenetrate and form numerous mechanical locks. form such a bond The extra amount of gold used to make , is unnecessary when electroplating gold onto a metal plate.

The gold layer required to be thicker than about 50 to about 60 μin to achieve the same purpose. No need, gold accounts for a significant portion of the cost of CERD IP, approximately 40%. Therefore, a reduction in total usage of as much as 90% can dramatically reduce the cost of parts. Probably.

The present invention is not limited to the form of CERD IP, but rather CERQUADS It also includes other design configurations such as.

This is similar to CBRD IP, except that the conductors come from the four sides of the package. The difference is that it is growing. Traditionally, this has been the case in ceramic packages, where the conductor wires are tightly bent. This was impossible due to the impact on the seal.

Another aspect of the invention is a multilayer package as shown in FIGS. 5-10. production. In Figure 5, a ceramic is cold pressed according to the principles described earlier. A first layer of glass-metal composite (40) is illustrated. Figures 6A and 6 Figure B shows a cooling layer, preferably of the same material used to form layer (40). A second layer of pressed ceramic-glass-metal composite (42) is illustrated. There is. FIGS. 7A and 7B preferably show the layers used to form layer (42). of a cold-pressed ceramic-glass-metal composite (44) made of the same material as A third layer is illustrated.

Depending on your wishes, metal parts can be made in various forms, depending on the special requirements of the part being manufactured. It may be added and assembled in the same position. For example, in Fig. 8, the conductor structure part (4 6) is arranged around the layers (40') and (42'). Illustrated in another figure Parts that are essentially the same as those listed above are designated by the same number with the addition of a '. metal parts (48) is also arranged on the surface of the first layer (40'). Furthermore, a metal sealing ring (5 0) is placed on the top surface of the third layer (44').

These ceramic/glass/metal parts together with metal parts (48) and (50) The structure (49) formed by ) and the sealing ring (50) are embedded into the composite body (47), and the structure illustrated in FIG. A structure (54) is formed. This figure 9 is not to the same scale as figure 8. , hot pressing depends on the glass selected for the glass matrix of the composite. The treatment may be carried out at any existing treatment temperature. Electroplating the metal part (49) with a layer of gold However, the coupling of the semiconductor device to it may be strengthened. Place the device into the cavity. It may also be connected to the end of the conducting wire (51) with a wire. Finally, the metal cover (Fig. (not shown) can be sealed to the sealing ring (50).

There are various metals used to form hermetically sealed parts or other similar devices. For example, the metal may be plated with gold. borosilicate Typical processing temperatures of about 470°C for solder glass will reduce the quality of such plating. will not deteriorate. Metals can also be selectively plated, e.g. The bonding tip (31) and the exposed portion of the conductor structure may be gold plated. connected to the complex Nickel plated metal areas that come in contact to improve adhesion between glass and metal. You can also do this. After embedding the part of the metal insert (48) or (50) into the composite Can be plated. Depending on the special requirements of the material system and the application of the product, Similarly, plating with a desired metal or metal alloy is also within the scope of the present invention. further coated composite metal insert (48) or (50) with the desired coating, if appropriate. If so, you can use it.

Regarding the embodiment illustrated in FIG. 10, the CERDIP device package of FIG. A similar package (59) is shown with a cooling section (60) and a top shroud. (62) is added. Package (59) holds wireless ceramic chip It can be classified as a body. This aspect is used to bond metal structures into composites. It has the advantage of being able to The metal structure includes metal members (33) and (34) in FIG. selected according to the principles described in . The cooling part (60) has an upper part (68) having an outer shape substantially the same as the cavity (65) in the composite body (66). and extends into the cavity (65). The cooling section (60) follows the previously mentioned principle. It also has a lower part (69) which is larger than the upper part (68), which is larger than the upper part (68). 6) towards the outer surface (67). The cooling section (60) is equipped! (63) and the surface (61) to which the device (63) is coupled. It has the function of giving both. In this case too, the surface (61) is It may also be plated with gold. The top shroud (62) covers the conductor structure (46). ) may be made from the desired metal or alloy similar to that selected for , soldering and brazing to the sealing ring (50') using conventional methods such as soldering and brazing. can be done.

Regarding Mr. B in Figure 11, there is a package similar to the package in Figure 10 (7 0) is shown. However, the conductive wire structure ( 73) in that the external conductor (72) is brazed or welded. Cooling section ( The fin (71) added on top of (60') is optional. Furthermore, metal cooling Part (60') itself is also optional and may be omitted if desired. However, it is provided to improve thermal performance. The cooling section (60') is, for example, , copper, aluminum, gold, silver, nickel, iron and their alloys. The ceramic body (74) is made of a highly conductive metal or alloy, such as those selected. Compatible with the ceramic-glass-metal composite materials used to form A metal lid (62'), preferably formed of soldered, brazed or welded to a metal sealing ring (50″) embedded in is preferable.

Regarding the embodiment illustrated in FIG. 12, the same package (59) as in FIG. 10 is included. A similar package (80) is shown.

The difference between the package (59) and the package (80) is the sealing ring (50') and the gold The metallic cover (62) is a ceramic-glass-metal composite cover (82) and a sealing glass. (84). In this case as well, the cooling section (60 A buried internal conductor (88) is optional and may be omitted if desired. ) may be manufactured from materials with comparatively low thermal conductivity if desired, because , the conductor wire and conductor structure do not significantly contribute to thermal performance. Conductor ( 90) may also be made from a material with relatively low conductivity.

Since both the conductor structure (88) and the conductor (90) are formed from solid metal, The conductor (90) is gold-plated as is typically done in multilayer packages. Attachment to conductor structure (88) by spot welding rather than brazing the alloy You can leave it. This provides a significant cost advantage.

Regarding the embodiment of Figure 13, there is a high quality charge for the CERD IP package. A package (100) is illustrated that provides replacement items. Ceramic/Glass/Gold The auxiliary parts (102) form the body of the package. The conductor structure (104) is the main body It is buried in (102). The conductor (90') is brazed or spot welded. can be coupled to the conductor structure (88') by any conventional method such as Wear. A metal sealing ring (50-) is also present in the top surface (110) of the composite (102). Buried.

The sealing ring (50'') has a gold coating (112) applied to its upper surface. at the end of the conductor structure (88') to facilitate bonding of the bonding wires from the It is also provided with a gold coating (114). Finally, the conventional lid (62’″) provided for sealing to the sealing ring by any conventional means such as embossment. Ru.

Regarding the embodiment of FIG. 14, a package (120) similar to that illustrated in FIG. is exemplified. However, in order to reduce the cost of the package, a metal lid (62 -) and gold coating (112) are bonded to ceramic glass by solder glass (84'). Replaced with a ceramic lid (82') directly bonded to the metal part (102') is being given.

Regarding the embodiment of Figure 15, it provides a unique cooling section with excellent thermal performance. A package or semiconductor case (130) is illustrated. package( 130) is a semiconductor device! Cavity (133) used to accommodate (135) The main body part (131) has a body part (131). The conductor structure (134) is also connected to the main body part (13). 1) The conductor end (139) that is buried in the semiconductor device (139) and extends into the cavity is connected to the semiconductor device (1). 35). The co-tub type part (132) is made of ceramic gas. It is buried in the lath/metal part (131), and the surface of the tip (137) is The device mounting is substantially suspended from the side wall (142) of the surface part (132). The flange (138) that extends directly becomes part of the bottom of the case (130). There is. In effect, the flange (136) is a cooling section. Flange (136) also has an upwardly bent end portion (138), which is actually attached to the flange (136). It is qualitatively vertical and extends up the sides of the package. But that end It is also within the scope of the invention to omit item (138). Copper-like, if you wish. A metal member (140) made of highly conductive material is attached to the flange (13) at the bottom of the package. 6) from one part of the flange to the other part of the flange. The cooling capacity may be further increased. The side of the extension part of Kotop (132) The wall (142) has a plurality of holes (144) through which the ceramic glass is inserted. Maximum thermal stability, allowing the metal mixture to flow into the cavity and fill it. In order to provide the desired Preferably. The thickness of the tip is limited by the thickness of the ceramic glass due to the thermal expansion coefficient mismatch. to maximize the bond between the lath/metal composite and the metal tip without compromising it. It can be done. Place the sealing M (not shown) on the top surface (146). It may be installed on top of. The lid may be made of metal, glazed metal or ceramic. 12, 13 and 14. The sealing glass, the sealing ring and the gold-tin solder or They may also be bonded by solder glass.

The ceramic-glass-metal composite described here consists of multiple ceramic-glass ・Multilayer ceramics capable of having patterned conductors between adjacent pairs of metal substrates It is particularly useful for producing metal, glass, and metal substrates. Engineering that manufactures unit equipment The process is described below. A substrate (150) as illustrated in FIG. 16A, preferably Solidifying mixtures of ceramic-glass-metal composites and organic binders such as PNNA Assembly begins using the base formed by the method described above. Which one is needed? Note that a similar number of through holes (152) may be made. These through holes ( 152) can be of any desired diameter, typically in the range of about 5 to 20 mils. The size of the 0 through holes (152) in is not part of this invention; they are It can be made larger or smaller depending on your needs. For example, gold, silver, particles of the desired electrically conductive material such as platinum, palladium, copper and alloys thereof; It may also be filled with an electrical conductor (154) such as a conductive paste with an organic medium. If you want If so, the glass used for the base (150) is a conductor (154) and a ceramic. nine.

In order to increase the bond strength between the glass/metal substrate (150), conductive particles and May be mixed. The through hole may contain a solid wire or a conductive material such as solder. It may be filled with an electric body. The metal (156), (158) layers may be made of copper, for example. Any desired conductivity such as aluminum, iron, copper/silver, copper/gold and their alloys It may be formed from any material.

Referring again to Figure 16B, the metal foil layers (156) and (158) are ceramic It may be arranged on one or both sides of the glass/metal structure (150). Money Metallic foil layers (156) and (158) are made of ceramic, glass, or metal-based glass. Preferably, the foil layers are adhered to the foil layer, but the foil layers are ial No. 811,846. It is also within the scope of the present invention. For example, metal foil is made of deoxidized copper alloy and oxygen. The copper alloy may be selected from the group consisting of copper alloys that do not contain copper. Glass is silicate, borosilicate, The structure (150) may be selected from the group consisting of borate and phosphate glasses. First, it is fired at a temperature at which the organic binder is burned off. This combustion removal temperature is typically Foils and ceramics have a temperature lower than about 400°C, but can be higher if appropriate. The laminated assembly of glass, glass, and metal substrates is then heated to the glass softening temperature, and the lamination pressure is to adhere a layer of metal foil to the glass matrix within the substrate (150) and penetrate the conductor (154) in the hole (152) is in contact with the foil layers (156) and (158); Ru. A glass layer is arranged between the base (150) and the foil layers (156) and (15B). It is also within the scope of the present invention.

The glass layer softens the structure, and the foil layers (156) and (158) are attached to the substrate (150). Heat to bonding temperature.

With respect to FIG. foil layers (156), (15) by a desired method such as etching by photoresist method. 8) The conventional photoetching method used includes a conventional positive photolithography process. coating the outer surfaces of the foil layers (156) and (158) with a resist; Ru. The photoresist may be comprised of a photodegradable photosensitive resin. Then dew A mask with a specified pattern made of a material that is opaque to Idemitsu is brought into contact with the photoresist. I'll leave it to you. When exposed to light, only the unmasked portions of the photoresist layer are exposed. Shine. Next, the mask is removed and the resist is developed. The exposed part of the resist The zero etchings that are removed and circuits formed in the subsequent etching process are treated with potassium iodide or F This can be accomplished using conventional solutions such as eCl5/HCI copper etchant. set The solid is thus coated with photoresist several times and etched to create the desired pattern and structure. may be caused to occur. This assembly becomes a hybrid circuit device. It can be used for.

Next, as shown in Figure 16D, in the same manner as for the structure previously described (15G), a second ceramic-glass-metal composite (164) that can be formed; placed or laminated on the top surface (166) of the foil bonded to the structure (150); Ru.

The assembly is heated to a temperature at which the glass in each of substrates (150) and (164) softens. heat. Next, applying lamination pressure, the structure (15G) is attached to the structure (164). and press to cause the glass of the two structures to bond. carry out this process For this reason, pressures below about 300 ps i appear to be adequate. However, any suitable The present invention has heretofore been applied to a substrate (150) with foil. We have described the case where an electrical circuit pattern is formed on the foil after it has been deposited on the foil. By forming a conductive pattern on the foil by any desired method before applying it to the body Also falls within the scope of the present invention. Next, the substrate and foil are heated to the glass softening temperature, and the lamination pressure is increased. Additionally, the foil is attached to the ceramic/glass/metal substrate as shown in Figure 16C. You can do it like this.

Thereafter, as seen in Figure 16D, the multilayer hybrid circuit assembly (167) The above-described steps resulting in the formation of any number of layers may be repeated. the resulting structure The bodies (167) form ceramic glass when they are cooled from the solidification temperature to room temperature. are substantially adversely affected by the thermal shrinkage typically experienced by metal structures. This is especially advantageous in that it does not cause problems.

Therefore, the resulting hybrid circuit assembly is reproducible and has a conductive layer and electrical connections. The circuit between the connecting parts maintains contact through the through-holes. For example, the structure (16 4) The conductor in the through holes (170) and (172) is ceramic, glass, or metal. It is in contact with a circuit (160) formed in the structure (150).

Referring again to Figure 16E, there is a conductive circuit on the surface (182) of the substrate (150). an additional substrate (178) having a plurality of conductor-filled through holes (180) in contact with the path; It is shown. The arrangement of the conductive circuit (162) and the through hole (180) is similar to that of the through hole. can be controlled so that electrical contact problems do not substantially occur.

Finally, the conductor bottle (184) is sealed with conductor filling by some means such as brazing. Attach it to the through hole (180) to form a pin grid array structure (16B). You may.

Another aspect of the invention includes circuits (160) and (1) as illustrated in FIG. 16C. 62) is coated with a metal conductive paste on the substrate (150) as shown in FIG. 16A. This method may also be applied to metal (150) by screen printing. In a method, a substrate (150) is formed using high temperature glass and a conductive paste is applied. May be baked beforehand. Next, apply the conductive paste to a temperature of about 50°C to about 1000°C. The metal particles in the circuit conductor are solidified by pressure sintering at approximately 300 x 103 psi. and when they bond to the glass in the ceramic-glass-metal substrate (150) Preferably, both are highly conductive.

This step can be accomplished in a mold so that the substrate does not lose its shape.

Thereafter, as shown in FIGS. 16D and 16B, the additional substrate is attached to the substrate (1). 50) on either side of the A layered structure may also be formed.

The present invention provides ceramics that are easily formed using compositions selected according to specific applications. It also relates to storage goods. The described composites are used in the general field of engineered ceramics. It is particularly advantageous to have This includes ceramic engines and engine parts, Ceramics in areas such as cutting tools, human body substitutes and a wide variety of other possible products. This includes a wide range of new uses for coax. The invention allows for tight manufacturing tolerances and capacity. Products that require both the inherent advantages of ceramic materials as well as the need for ease of use. Particularly useful for forming. Ceramic materials have the ability to withstand high temperatures, low dielectric It is of particular interest because of its high yield, high strength and chemical stability.

Figures 17 to 21 illustrate the various types that can be formed from the composites of the present invention. It shows the following items. Figure 17 shows an example of a ceramic rotating blade, and Figure 19 shows an example of a ceramic rotating blade. This is an example of an engine mainly made of ceramic parts, and Figure 18 shows the human body part. Fig. 20 shows an example of a grinding wheel, and Fig. 21 shows a metal insert. is an example of a ceramic engine block with It is formed. The examples shown in FIGS. 17 to 21 illustrate the possibilities of the described complexes. This does not mean that we have exhausted all possible uses, but rather provide examples of a wide range of uses. It just shows. Typically, the composites of the present invention will have a ceramic physical It is most useful in applications where its properties are particularly advantageous.

The specific structures shown in FIGS. 17-21 are merely examples and are limitations of the present invention. rather, each figure represents an example of the type of article according to the invention. ing.

The construction form shown is actually a well-known construction form and is used for similar types of articles. use in their place a wide variety of other well-known structural forms to give be able to.

According to the invention, the articles can be manufactured by hot forging in a mold and by hot pressing. formed from a mixture of ceramic-glass-metal composites by conventional methods. preferable. Alternatively, if desired, for example polymethyl methacrylate ( PNNA), polyvinyl alcohol (PVA), etc. It may be molded and maintained. During processing, the preformed body is first removed from volatile organic matter. Heat to a temperature and maintain for a period of time to remove. Next, the preform is hot plated. It can be hot-formed or hot-formed to achieve maximum density in the final product.

Figure 17 shows a ceramic rotor manufactured from a ceramic-glass-metal composite. (200) is illustrated. Ceramic in areas exposed to high temperature exhaust for many years Improving the efficiency of turbo-loaded turbines for engines by using components That has been tried. This will make future generations of gas engines smaller and more efficient. It is important to be efficient. Currently used in turbo-loaded turbines, especially rotors. Uncooled metallic superalloys are not suitable at these temperatures due to creep-related damage. would not be able to perform its functions. Additionally, the rotor is exposed to extremely corrosive high temperature air. constantly in contact with engine exhaust gases. Furthermore, the rotor has a complicated shape, so be very careful. There are many matters. There are no attempts to replace expensive superalloy turbine blades with ceramic blades. It has been. However, the process is very expensive and difficult to mass produce. Due to the strength of the base material, the final shaping is an expensive process using materials such as diamond. Ceramic rotors using the principles of the present invention can be manufactured in a rational manner without requiring time-consuming cutting. It can be manufactured at a reasonable cost. Because it is a one-step method, accurate and complex This is because it can be molded into a shape. Both metal particles and glass in the composite are The lamic rotor is preferably selected to withstand the operating temperatures experienced. For example, the glass may be selected from borosilicates having a liquidus temperature of about 1220°C. Not possible.

The metal particles are preferably corrosion resistant and include stainless steel, tungsten and molybdenum. Materials such as carbon and nickel can be selected. Ceramic is a glass material. selected to withstand these temperatures and chemistries. These include , alumina, silicon carbide and titanium carbide. Ceramic rotor is required as it virtually eliminates shrinkage problems The present invention provides exceptional conditions for shaping into complex curved shapes. Shape tolerances allow making ceramic rotors at lower cost and lower temperatures. It is thought that it is possible.

Figure 19 has many parts made from ceramic-glass-metal composites. An engine (220) is illustrated.

The composite material is particularly advantageous for forming engine blocks. because, It withstands high operating temperatures and can be easily formed into precise and complex shapes, compared to This is because it is made of relatively inexpensive materials. Additionally, if desired, metal inserts are required. It may be cast directly into the composite as it is formed, depending on the engines formed from metal can operate at much higher temperatures than metal engines, and It is believed that this would be particularly useful since there would probably be no need for cooling.

The engine block (220) illustrated in FIG. 19 includes ceramic, glass, and metal. It may also be formed from a complex. Metal inserts such as cylinders (26) can be properly incorporated into the system block. Ceramic suitable for engine blocks glass-metal composite, about 20 to about 35% by volume borosilicate glass, about 5 to about It may consist of 10% by volume iron or iron alloy particles and the remainder alumina particles.

In addition, the components of the composite are such that the material provides better cooling of the engine block. The ratio can be selected such that it has a large thermal conductivity. This is iron or iron The volume percent of alloy particles is increased to about 30 to about 40 volume percent so that they are continuous in the composite. This may include making it decentralized. In this case, it is probably The lath will be present in a range of about 15 to about 25% by volume.

FIG. 18 shows a human body substitute (230). In particular, this is a human hip bone prosthesis. It is. Traditionally, human body replacements, especially bones and joints, have been made of stainless steel, titanium and steel. It has been formed from ceramics as well as Baltic alloys. Metal materials are biologically It is particularly susceptible to corrosion fatigue due to its presence in the chemical environment. Things needed for bone substitutes The physical properties of the composite material of the present invention are toughness, non-corrosion and ease of molding. It is particularly advantageous for this application. Suitable materials and properties allow composites to be easily shaped into complex shapes. Can be molded, non-corrosive, and somewhat similar to and compatible with human bone. Therefore, it can be selected to quickly adapt to the human body. appropriate The composite may be formed from about 40 to about 65 volume percent of a ceramic such as alumina. You might also say that.

Alumina is particularly advantageous because it is available in high quality. Metal particles are highly Preferably selected to be corrosion resistant and include silver, gold or stainless steel. The metal particles will represent about 5 to about 15 volume percent of the final composite. composite The rest of the body is glass, which has good chemical resistance throughout the human body and at body temperature. It is considered to be glass. In this application, the composite is formed into the required complex shape. Because of its ease of use, chemical durability, and ability to change shape as needed, Particularly advantageous. This is especially important for substitute products. Because they This is because it must be made according to a doctor's prescription. An example of a hip bone prosthesis However, it is within the scope of the present invention to form any human body substitute as needed. to go into.

FIG. 20 illustrates a grinding wheel (240). One important characteristic of a grinding wheel is its This is due to its hardness, which allows it to cut many other materials. Wear resistance also depends on its expected lifespan. It is one of the factors that can affect your life. The grinding wheel removes particles and provides a new cutting surface. It is preferable that it be as brittle as possible. Heat dissipation is also important, and finally the grinding wheel must be thermal shock resistant. The ceramic-glass-metal composite of the present invention has each of these properties. It can be easily formed into a grinding wheel with various types.

The metal particles account for about 5% to about 20% by volume of the composite, including copper, tungsten, and molybdenum. , nickel and their alloys. Glass is a composite of approx. It accounts for 15 to about 25% by volume and is preferably a borosilicate. The rest of the complex is ceramic may be selected from materials including alumina, silicon carbide and titanium carbide. . Metal particles dispersed throughout the grinding wheel provide high thermal conductivity and reduce heat transfer from the grinding wheel. make it good.

Accordingly, FIGS. 17 to 21 show that, in accordance with the present invention, A special selection of 0 different articles illustrating the wide variety of engineered ceramic products that can be made. Although materials are mentioned, they are meant to be examples and do not limit the invention. This does not mean that the preferred ceramic/glass/metal according to the present invention The composite could be used in any of the articles illustrated.

Other uses for the ceramic-glass-metal composites described include cutting tools, sealants, Includes bearings, scissors and knives.

In summary: high strength, ease of forming into complex shapes with tight tolerances and corrosion resistance. The present invention provides these articles having the following properties.

Engineered ceramics include all fine ceramics mixed with other materials as required. that is, the ceramic-glass-metal composite of the present invention; These are electroceramics, mechanical and heat-resistant ceramics, and functional ceramics. mixes, structural ceramics, bioceramics, electrical ceramics and engineering Used in fields including scientific cerami-nox.

For purposes of this invention, the final fired composite is defined as the composite after densification at the processing temperature. defined. Discontinuously dispersed means that the particles are intertwined throughout to provide conductivity. This means that they are not connected to each other. Continuously dispersed means that the particles are all mixed together. It means dwarfs that are connected to each other and provide conductivity.

As used herein, the term thermally compatible refers to means a material with a coefficient of thermal expansion.

Each of the packages or substrates described in connection with the present invention may be manufactured as follows. First, a mixture of ceramic/glass/metal particles and an organic binder is prepared. Cold-pressed into a molded body. First, the pre-formed body is heated to volatilize and remove the binder. . The preform can then be hot formed into the final desired shape.

This case has been described regarding hot forming under pressure, but casting, spraying, Ceramic, glass, metal steel can be made by any glass forming method such as molding. Forming the rally also falls within the scope of the invention.

According to the present invention, ceramic, glass, and gold satisfying the above-mentioned objects, means, and advantages. Electronics packages of components incorporating genus complexes have been provided. is clear. Although the present invention has been described in relation to its aspects, the previous description It is clear that many alternatives, modifications and changes will occur to those skilled in the art in light of the That's it.

Accordingly, all such alternatives, modifications and changes are covered within the broad scope of the appended claims. It is included as falling within the scope and essence.

Submission of translation of written amendment (84 vessels on special mention side%d May 1, 1999)

Claims (18)

[Claims] 1. In ceramic-glass-metal composites, it is possible to improve the flow properties of said composites. about 5% to about 45% by volume of metal particles to from about 15 to about 50% by volume glass to adhere the composite together; and residual essentially ceramic particles; The composite comprises the glass matrix and the ceramic and ceramic particles dispersed therein. having a structure consisting essentially of particles of metal; A ceramic-glass-metal composite characterized by: 2. characterized in that the ceramic particles account for about 20 to about 80% by volume of the composite. The composite according to claim 1. 3. Ceramic particles include Al2O3, SiC, BeO, TiO2, ZrO2, Mg selected from the group consisting of O, AlN, Si3N4, BN and mixtures thereof. The composite according to claim 2, characterized in that: 4. Metal particles include aluminum, copper, iron, silver, gold, stainless steel and alloys thereof. 4. Complex according to claim 3, characterized in that it is selected from the group consisting of: 5. Glass is silicate, borosilicate, phosphate, zinc borosilicate, soda/lime/silica , lead silicate, and lead zinc borate glass. The composite according to claim 4. 6. In a method of forming a ceramic-glass-metal composite, from about 5% to about 45% by volume of metal particles to improve the flow properties of said composite; about 15% to about 50% by volume of glass particles to adhere the coalesce together; and the remainder providing a mixture consisting essentially of ceramic particles; heating said mixture to a processing temperature; However, the treatment temperature is higher than the glass softening point of the glass particles, and the metal particles the melting point of the mixture is selected to be lower than the melting point of press, and The glass is solidified to form a matrix of the glass and the ceramic dispersed therein. forming a composite structure consisting essentially of particles of metal and metal; A method for forming a ceramic-glass-metal composite, characterized by comprising various steps. 7. The ceramic particles are selected to represent about 20% to about 80% by volume of the composite. 7. The method according to claim 6, characterized by the step of: 8. Ceramic particles include Al2O3, SiC, BeO, TiO2, ZrO2, M a material selected from the group consisting of gO, AlN, Si3N4, BN and mixtures thereof; 8. A method according to claim 7, characterized in that: 9. Metal particles such as aluminum, copper, iron, silver, gold, stainless steel and their combinations 9. The method of claim 8, further comprising the step of selecting from the group consisting of gold. 10. Glass can be treated with silicates, borosilicate, phosphates, zinc borosilicate, soda/lime/silicate. a further step of selecting from the group consisting of lead silica, lead silicate, and lead zinc borate glasses; 10. The method of claim 9, characterized in that: 11. Ceramic/glass/metal composites in composites with metal parts a base part (24) formed from a material; The composite material may contain up to about 25% by volume effective to improve the flow properties of the composite. from about 15 to about 50 volumes for depositing together the amount of metal particles and the composite. % glass and the remainder consisting essentially of ceramic particles; a structure consisting essentially of ceramic and metal particles dispersed therein; has; A composite body characterized in that: a metal part (36) embedded in said composite material. 12. The glass matrix is selected from the group consisting of vitreous glass and devitrified glass. 12. The composite of claim 11, further characterized in that: 13. In the semiconductor case (22), is the ceramic/glass/metal composite material used? a first part (24) formed from; a second component (28) formed from a ceramic-glass-metal composite material; The composite material may contain up to about 25% by volume effective to improve the flow properties of the composite. from about 15 to about 50 volumes for depositing together the amount of metal particles and the composite. % glass and the remainder consisting essentially of ceramic particles; a structure consisting essentially of ceramic and metal particles dispersed therein; has; a metal conductor structure (30) embedded in said first part (24); and a sealing glass (32) joining said second part (28) to said first part (24); ; A complex characterized by. 14. The first part (24) constitutes the base and the second part (28) constitutes the lid. The semiconductor case (22) according to claim 13, characterized in that: 15. In the method of forming the semiconductor case (22), ceramic, glass, gold a first part (24) and a second part (28) each formed from a genus composite material; However, the composite material comprises the glass matrix and a precursor dispersed therein. having a structure consisting essentially of ceramic and metal particles; providing a metal conductor structure (30); The conductor structure (30) is buried in the first part (24) and the sealing glass ( 32) is placed between the first part (24) and the second part (28), and The second part (28), the first part (24) and the sealing glass (32) , heating the sealing glass (32) to a temperature at which it becomes liquid; pressing said first part (24) and second part (28) together; and The sealing glass (32) is solidified and the first part (24) is bonded to the second part (2). 8) join to; A method for forming a semiconductor case characterized by various steps. 16. In a multilayer circuit device, Multiple ceramic/glass/metal substrates, adjacent ceramic/glass/metal substrates a conductive circuit pattern layer bonded between the plurality of ceramic/glass/gold layers; an electrically conductive member extending through each of the metallic substrates and contacting the electrically conductive circuit pattern; A multilayer circuit device featuring: 17. Engineered ceramic products made from ceramic-glass-metal composites Leave it behind. about 5 to about 45 volume % metal particles to improve the flow properties of the composite; from about 15 to about 50% by volume glass to adhere the composite together; and residual essentially ceramic particles; wherein said composite comprises said glass matrix and said glass matrix dispersed therein. characterized in that it has a structure consisting essentially of said ceramic and metal particles. Engineered ceramic products. 18. Ceramic rotor (200), engine block (220), grinding wheel (2 40) and a human prosthetic body (230). The product described in claim 17.