CN108264369A - A kind of preparation method of attached cavity ceramic component for ultraprecise semiconductor equipment - Google Patents
A kind of preparation method of attached cavity ceramic component for ultraprecise semiconductor equipment Download PDFInfo
- Publication number
- CN108264369A CN108264369A CN201711340640.7A CN201711340640A CN108264369A CN 108264369 A CN108264369 A CN 108264369A CN 201711340640 A CN201711340640 A CN 201711340640A CN 108264369 A CN108264369 A CN 108264369A
- Authority
- CN
- China
- Prior art keywords
- ceramic component
- attached cavity
- phase material
- glass phase
- cavity ceramic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
- C04B37/003—Joining burned ceramic articles with other burned ceramic articles or other articles by heating by means of an interlayer consisting of a combination of materials selected from glass, or ceramic material with metals, metal oxides or metal salts
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
- C04B2237/10—Glass interlayers, e.g. frit or flux
Abstract
The present invention relates to a kind of preparation method of the attached cavity ceramic component for ultraprecise semiconductor equipment, including：Glass phase material is applied to attached cavity ceramic component surfaces, then the component combined will be needed to dock, is sintered and applies pressure in outside, you can；Or glass phase material is bonded in attached cavity ceramic component surfaces and carries out pre-burning, the component assembled will then be needed to place thawing glass phase material again directly facing face and be bonded, you can.The glass material that the present invention uses can be attached directly to no press polished ceramic component surfaces, greatly reduce the extreme cost needed for polishing ceramic surface and labour, greatly improve the structural complexity and functionality of product, have a good application prospect.
Description
Technical field
The invention belongs to ceramic component fields, more particularly to a kind of attached cavity ceramic part for ultraprecise semiconductor equipment
The preparation method of part.
Background technology
If it is well known that meet vacuum integrity, electric requirement and dimensional stability, applied to semiconductor equipment and half
Many components in conductor process of producing product can be made of a variety of advanced ceramics materials.
Such as carry wafer mechanical arm it is made of aluminum be most common because relatively easily by these materials into
Shape and it is processed into required component.But product is larger with respect to ceramic component deformation made of aluminium, it can pushing away with the time
Existing deformation is removed, influences Product Precision, while the component coefficient of expansion made of aluminum is 3 times of aluminium oxide, then the size of product
Stability may be damaged.Additionally, due to the electric conductivity of metal material, damage of the electrostatic to product can be led to, so as to seriously affect crystalline substance
Circle quality.
Although in addition capsule components made of traditional metal material and being prepared by way of assembling, need
Two metalwork surfaces are highly polished and clean and then contact, and greatly improve production cost.
Therefore how to produce with certain internal cavity structure and can meet the ceramics of other physical and chemical performance requirements
Component is just very crucial.
Invention content
The technical problems to be solved by the invention are to provide a kind of attached cavity ceramic part for ultraprecise semiconductor equipment
The preparation method of part, the glass material that this method uses can be attached directly to no press polished ceramic component surfaces, pole
The big extreme cost reduced needed for polishing ceramic surface and labour greatly improve the structural complexity and functionality of product,
It has a good application prospect.
A kind of preparation method of attached cavity ceramic component for ultraprecise semiconductor equipment of the present invention, including：
Glass phase material is applied to attached cavity ceramic component surfaces, then the component combined will be needed to dock, in 900 DEG C
It is sintered at~1250 DEG C and applies 1~2kg pressure in outside, you can；
Or glass phase material is bonded in attached cavity ceramic component surfaces and carries out pre-burning, will then it need the portion assembled
Part directly facing face be positioned over 900 DEG C~1250 DEG C again melt glass phase material be bonded, you can.
The glass phase material is with silica silicate composite material as main component.
The calcined temperature is 800~900 DEG C.
The present invention using by two or several components with specific shape by using specific frit be bonded from
And the method for vacuum sealing space or cavity is formed to realize, have benefited from the shape of the technology, interiors of products or external cavity
Shape can be complicated and changeable, so as to greatly improve the structural complexity of product and functionality, and significantly reduces the manufacture of product
Difficulty and cost；It is forced in used method, these attached cavity components are combined together shape in 900 DEG C~1250 DEG C in stove
Into final products.
Advantageous effect
The glass material that the present invention uses can be attached directly to no press polished ceramic component surfaces, greatly reduce
Extreme cost and labour needed for polishing ceramic surface, greatly improve the structural complexity and functionality of product, have good
Good application prospect.
Description of the drawings
Fig. 1 is the process schematic representation of the present invention.
Specific embodiment
With reference to specific embodiment, the present invention is further explained.It should be understood that these embodiments are merely to illustrate the present invention
Rather than it limits the scope of the invention.In addition, it should also be understood that, after reading the content taught by the present invention, people in the art
Member can make various changes or modifications the present invention, and such equivalent forms equally fall within the application the appended claims and limited
Range.
Embodiment 1
Glass phase material is applied to attached cavity ceramic component surfaces (99% alumina ceramic face roughness is R0.6),
To then the component combined be needed to dock, and be sintered at 1150 DEG C and apply 1.5kg pressure in outside, you can.
The product of the present embodiment seals and without gas leak phenomenon.The application of specified pressure can equally reduce double sintering and bring
Warping part problem.
Embodiment 2
Glass phase material is bonded in attached cavity ceramic component surfaces and carries out pre-burning in 850 DEG C, will then need to assemble
Component directly facing face be positioned over 1150 DEG C again melt glass phase material be bonded, you can.
May be volatilized in being sintered this embodiment avoids some glass materials by adhesive leads to air void, suitable for combining
The larger product of area bonds packaging technology.
Claims (3)
1. a kind of preparation method of attached cavity ceramic component for ultraprecise semiconductor equipment, including：
Glass phase material is applied to attached cavity ceramic component surfaces, then will need combine component docking, in 900 DEG C~
It is sintered at 1250 DEG C and in the external pressure for applying 1~2kg, you can；
Or glass phase material is bonded in attached cavity ceramic component surfaces and carries out pre-burning, it will then need the component assembled straight
Junction opposite be positioned over 900 DEG C~1250 DEG C again melt glass phase material be bonded, you can.
2. a kind of preparation method of attached cavity ceramic component for ultraprecise semiconductor equipment according to claim 1,
It is characterized in that：The glass phase material is with silica silicate composite material as main component.
3. a kind of preparation method of attached cavity ceramic component for ultraprecise semiconductor equipment according to claim 1,
It is characterized in that：The calcined temperature is 800~900 DEG C.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711340640.7A CN108264369A (en) | 2017-12-14 | 2017-12-14 | A kind of preparation method of attached cavity ceramic component for ultraprecise semiconductor equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711340640.7A CN108264369A (en) | 2017-12-14 | 2017-12-14 | A kind of preparation method of attached cavity ceramic component for ultraprecise semiconductor equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108264369A true CN108264369A (en) | 2018-07-10 |
Family
ID=62771986
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711340640.7A Pending CN108264369A (en) | 2017-12-14 | 2017-12-14 | A kind of preparation method of attached cavity ceramic component for ultraprecise semiconductor equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108264369A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115697939A (en) * | 2020-05-26 | 2023-02-03 | 贺利氏科纳米北美有限责任公司 | Plasma resistant ceramic body formed from multiple pieces |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1988003087A1 (en) * | 1986-10-30 | 1988-05-05 | Olin Corporation | Ceramic-glass-metal composite |
| CN101456752A (en) * | 2007-12-11 | 2009-06-17 | 曾松 | 95Al2O3 ceramic-stainless steel sealed oxide solder method |
| CN102672593A (en) * | 2012-06-04 | 2012-09-19 | 上海卡贝尼精密陶瓷有限公司 | Ultra-precise combined polishing method |
| CN106220149A (en) * | 2016-07-27 | 2016-12-14 | 山东硅元新型材料有限责任公司 | Ultra-precision Turning and ultra precise measurement instrument ceramic guide rail and preparation method thereof |
-
2017
- 2017-12-14 CN CN201711340640.7A patent/CN108264369A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1988003087A1 (en) * | 1986-10-30 | 1988-05-05 | Olin Corporation | Ceramic-glass-metal composite |
| CN101456752A (en) * | 2007-12-11 | 2009-06-17 | 曾松 | 95Al2O3 ceramic-stainless steel sealed oxide solder method |
| CN102672593A (en) * | 2012-06-04 | 2012-09-19 | 上海卡贝尼精密陶瓷有限公司 | Ultra-precise combined polishing method |
| CN106220149A (en) * | 2016-07-27 | 2016-12-14 | 山东硅元新型材料有限责任公司 | Ultra-precision Turning and ultra precise measurement instrument ceramic guide rail and preparation method thereof |
Non-Patent Citations (1)
| Title |
|---|
| 沈鸿才等: "《结构陶瓷及应用》", 30 April 1988, 国防工业出版社 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115697939A (en) * | 2020-05-26 | 2023-02-03 | 贺利氏科纳米北美有限责任公司 | Plasma resistant ceramic body formed from multiple pieces |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180710 |
|
| RJ01 | Rejection of invention patent application after publication |