CN206283479U - Integrated crystal resonator - Google Patents
Integrated crystal resonator Download PDFInfo
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- CN206283479U CN206283479U CN201621468290.3U CN201621468290U CN206283479U CN 206283479 U CN206283479 U CN 206283479U CN 201621468290 U CN201621468290 U CN 201621468290U CN 206283479 U CN206283479 U CN 206283479U
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- wafer base
- electrode
- oscillator
- depressed area
- oscillator wafer
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Abstract
The utility model discloses a kind of integrated crystal resonator, crystal resonator includes oscillator wafer base, electrode, oscillator pedestal is made up of piezoelectric of mask, chemical attack, the upper surface of oscillator wafer base, lower surface are equipped with depressed area, and Top electrode, bottom electrode are respectively equipped with depressed area；The depth of depressed area is more than Top electrode or the thickness of bottom electrode；Top electrode, bottom electrode are respectively arranged at two ends with metal lead-outs oscillator wafer base；The top of oscillator wafer base is connected upper cover plate, infrabasal plate respectively；The bottom surface of infrabasal plate is respectively arranged at two ends with pad, and pad is connected with the metal lead-outs of Top electrode or bottom electrode；Upper cover plate, infrabasal plate are identical with the material of oscillator wafer base.The utility model can avoid producing additional frequency shift (FS)；Mechanical milling tech is avoided, yield rate is improved；In addition, it is thus also avoided that prior art adds piece method using monolithic, the problem poor for the low and consistent property of Product processing efficiency for minimizing.
Description
Technical field
The utility model is related to crystal resonator, specifically a kind of integrated crystal resonator.
Background technology
Existing quartz crystal resonator components, plate after being processed into chip using crystal or other piezoelectrics on two sides
Electrode, with ceramics or metal shell block as encapsulation, is assembled and is electrically connected using conducting resinl as oscillator.
Existing quartz resonator needs outsourcing base of ceramic and capping using piezoelectric chip and ceramics or metal shell assembling
Material；Quartz wafer has different expansion systems from base of ceramic, and in temperature change, oscillator produces stress, produces what is added
Frequency shift (FS)；Mechanical milling tech is used when being processed due to former chip, the yield rate of the resonator wafer higher to frequency is low, separately
On the one hand piece method is added using monolithic, the low and consistent property of Product processing efficiency for minimizing is poor.Due to base of ceramic work
The reason for skill and assembly technology, is manufacturing smaller size of 1.6 × 1.2mm, more difficult during the resonator of 1.2 × 1.0mm.
Utility model content
The technical problems to be solved in the utility model is integrated crystal resonator, the resonator can improve production efficiency,
Reduces cost, reduces oscillator stress, reduces product size.
In order to solve the above technical problems, the utility model is adopted the following technical scheme that：
Integrated crystal resonator, including oscillator wafer base, electrode, described oscillator pedestal are passed through to cover by piezoelectric
Film, chemical attack are made, and the upper surface of oscillator wafer base, lower surface are equipped with depressed area, and electricity is respectively equipped with depressed area
Pole, bottom electrode；The depth of depressed area is more than Top electrode or the thickness of bottom electrode；Top electrode, bottom electrode are in oscillator wafer base
It is respectively arranged at two ends with metal lead-outs；The top of oscillator wafer base is connected upper cover plate, infrabasal plate respectively；The bottom of infrabasal plate
Face is respectively arranged at two ends with pad, and pad is connected with the metal lead-outs of Top electrode or bottom electrode；Upper cover plate, infrabasal plate and oscillator
The material of wafer base is identical.
Using the utility model of above-mentioned technical proposal, compared with prior art, beneficial effect is：
Because upper cover plate, infrabasal plate and oscillator wafer base are material of the same race, with identical expansion system, become in temperature
Oscillator effectively reduces generation stress during change, it is to avoid produce additional frequency shift (FS)；Avoid when prior art wafer is processed and use
Mechanical milling tech, the yield rate of frequency resonator wafer higher is low；In addition, it is thus also avoided that prior art adds piece using monolithic
Method, the problem poor for the low and consistent property of Product processing efficiency of miniaturization.
Further optimal technical scheme is as follows：
The edge of oscillator wafer base depressed area is connected upper cover plate, infrabasal plate by high-temperature seal adhesive respectively.
Described piezoelectric is piezoelectric quartz.
Brief description of the drawings
Fig. 1 is the structural representation of the utility model embodiment；
Fig. 2 is the profile in Fig. 1 horizontal symmetry axis；
Description of reference numerals：1. upper cover plate；2. Top electrode；3. high-temperature seal adhesive；4. oscillator wafer base；5. bottom electrode；
6. infrabasal plate.
Specific embodiment
With reference to embodiment, the utility model is further illustrated.
Referring to Fig. 1, Fig. 2, integrated crystal resonator constitutes oscillator pedestal by piezoresistive material by oscillator wafer base 4, electrode
Material is made up of mask, chemical attack, and the upper surface of oscillator wafer base 4, lower surface are equipped with depressed area, in depressed area respectively
It is provided with Top electrode 2, bottom electrode 5；The depth of depressed area is more than Top electrode 2 or the thickness of bottom electrode 5；Top electrode 2, bottom electrode 5 exist
Oscillator wafer base 4 is respectively arranged at two ends with metal lead-outs；The top of oscillator wafer base 4 be connected respectively upper cover plate 1,
Infrabasal plate 6；The metal lead-outs company for being respectively arranged at two ends with pad, pad and Top electrode 2 or bottom electrode 5 of the bottom surface of infrabasal plate 6
Connect；Upper cover plate 1, infrabasal plate 6 are identical with the material of oscillator wafer base 4.
The edge of the depressed area of oscillator wafer base 4 is connected upper cover plate 1, infrabasal plate 6 by high-temperature seal adhesive 3 respectively.
Described piezoelectric is piezoelectric quartz.
Above-mentioned integrated crystal resonator, is processed into according to the following steps：
（1）It is large stretch of using piezoelectric, the upper surface of multiple, following table are disposably made by mask and chemical attack and are carried
The oscillator wafer base 4 of depressed area；
（2）Top electrode 2 is installed in the depressed area of upper surface, bottom electrode 5 is installed in the depressed area of lower surface；
（3）The metal lead-outs of Top electrode 2, bottom electrode 5 are drawn respectively by the two ends at the two ends of oscillator wafer base 4；
（4）By the edge of the upper surface of oscillator wafer base 4 and the edge coated high-temperature seal adhesive 3 of lower surface, glue respectively
Connect cover plate 1, infrabasal plate 6；
（5）The pad of the metal lead-outs respectively with the bottom of infrabasal plate 6 of Top electrode 2, bottom electrode 5 is connected.
Specific embodiment of the present utility model, but protection not limited to this of the present utility model are the foregoing is only, it is any
Those skilled in the art it is contemplated that the change that be equal to the technical program technical characteristic or replacement, all cover at this
Within the protection domain of utility model.
Claims (3)
1. integrated crystal resonator, including oscillator wafer base, electrode, it is characterised in that：Described oscillator pedestal is by piezoelectricity
Material is made up of mask, chemical attack, and the upper surface of oscillator wafer base, lower surface are equipped with depressed area, divides in depressed area
Top electrode, bottom electrode are not provided with；The depth of depressed area is more than Top electrode or the thickness of bottom electrode；Top electrode, bottom electrode are in oscillator
Wafer base is respectively arranged at two ends with metal lead-outs；The top of oscillator wafer base is connected upper cover plate, infrabasal plate respectively；
The bottom surface of infrabasal plate is respectively arranged at two ends with pad, and pad is connected with the metal lead-outs of Top electrode or bottom electrode；Upper cover plate, under
Substrate is identical with the material of oscillator wafer base.
2. crystal resonator according to claim 1, it is characterised in that：The edge of oscillator wafer base depressed area leads to respectively
High-temperature seal adhesive is crossed to be connected upper cover plate, infrabasal plate.
3. crystal resonator according to claim 1, it is characterised in that：Described piezoelectric is piezoelectric quartz.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621468290.3U CN206283479U (en) | 2016-12-29 | 2016-12-29 | Integrated crystal resonator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621468290.3U CN206283479U (en) | 2016-12-29 | 2016-12-29 | Integrated crystal resonator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206283479U true CN206283479U (en) | 2017-06-27 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621468290.3U Active CN206283479U (en) | 2016-12-29 | 2016-12-29 | Integrated crystal resonator |
Country Status (1)
| Country | Link |
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| CN (1) | CN206283479U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106656095A (en) * | 2016-12-29 | 2017-05-10 | 唐山国芯晶源电子有限公司 | Integrated crystal resonator and processing method thereof |
-
2016
- 2016-12-29 CN CN201621468290.3U patent/CN206283479U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106656095A (en) * | 2016-12-29 | 2017-05-10 | 唐山国芯晶源电子有限公司 | Integrated crystal resonator and processing method thereof |
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