TWI451957B - Complex article of ceramic and plastic and method for making the same - Google Patents

Complex article of ceramic and plastic and method for making the same Download PDF

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TWI451957B
TWI451957B TW098143602A TW98143602A TWI451957B TW I451957 B TWI451957 B TW I451957B TW 098143602 A TW098143602 A TW 098143602A TW 98143602 A TW98143602 A TW 98143602A TW I451957 B TWI451957 B TW I451957B
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ceramic
embedded portion
plastic composite
ceramic substrate
plastic
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TW098143602A
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TW201121750A (en
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Qiang Wang
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Fih Hong Kong Ltd
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陶瓷塑膠複合製品及其製作方法 Ceramic plastic composite product and manufacturing method thereof

本發明係關於一種陶瓷塑膠複合製品及其製作方法。 The invention relates to a ceramic plastic composite product and a preparation method thereof.

塑膠和陶瓷都係重要之工業材料,出於功能性或裝飾性之需要,有時需要將陶瓷和塑膠結合在一起。雖然藉由種種方法,例如機械件緊固,可以做到這一點,然,藉由機械件緊固之方法來製得陶瓷塑膠之複合製品之工藝較為繁雜,而且,在緊固之過程中還可能因為用力過大而導致陶瓷件破裂。另,所製得之複合製品本身之結構也比較複雜,當該複合製品用於裝飾件,如電子裝置外殼時,很難形成塑膠和陶瓷之間之多樣化搭配,難以獲得較佳之裝飾效果。 Both plastics and ceramics are important industrial materials. For functional or decorative purposes, it is sometimes necessary to combine ceramics and plastics. Although this can be done by various methods, such as mechanical fastening, the process of manufacturing a composite of ceramics and plastics by means of mechanical fastening is complicated, and, during the fastening process, The ceramic piece may be broken due to excessive force. In addition, the structure of the composite product itself is also relatively complicated. When the composite product is used for a decorative part, such as an electronic device casing, it is difficult to form a diversified combination between plastic and ceramic, and it is difficult to obtain a better decorative effect.

有鑒於此,本發明提供一種搭配多樣化、具有良好裝飾效果之陶瓷塑膠複合製品。 In view of this, the present invention provides a ceramic plastic composite product which is versatile and has a good decorative effect.

另,提供一種上述陶瓷塑膠複合製品之製作方法。 In addition, a method for manufacturing the above ceramic plastic composite product is provided.

一種陶瓷塑膠複合製品,包括一陶瓷基體及設置於該陶瓷基體上之至少一嵌件,其改良在於:該陶瓷基體上設有一嵌設部,該嵌件由填充於該嵌設部與該陶瓷基體一體成型之塑膠形成,該嵌設部由開設於該陶瓷基體上之至少一通孔組成,所述通孔之二開口 之間至少包括一大徑部,該嵌設部由開設於該陶瓷基體上之至少一通孔組成,所述通孔之二開口之間至少包括一大徑部。 A ceramic plastic composite product comprising a ceramic substrate and at least one insert disposed on the ceramic substrate, wherein the ceramic substrate is provided with an embedded portion, the insert is filled in the embedded portion and the ceramic The base body is integrally formed of plastic, and the embedded portion is composed of at least one through hole formed in the ceramic base body, and the through hole has two openings At least one large diameter portion is formed between the openings, and the embedded portion is formed by at least one through hole formed in the ceramic substrate, and at least one large diameter portion is included between the two openings of the through hole.

其中,該嵌設部由形成於該陶瓷基體上之通孔或凹槽形成。 Wherein, the embedded portion is formed by a through hole or a groove formed on the ceramic base.

一種陶瓷塑膠複合製品之製作方法,其包括如下步驟:提供一陶瓷基體,該陶瓷基體上設有一嵌設部;以嵌件注塑方式於該陶瓷基體之嵌設部內注塑形成一嵌件與該陶瓷基體之一體結構;藉由電解電鍍之方式於該嵌件露出於該嵌設部之表面形成一電鍍層。 A manufacturing method of a ceramic plastic composite product, comprising the steps of: providing a ceramic substrate, wherein the ceramic substrate is provided with an embedded portion; and inserting and inserting an insert into the ceramic substrate to form an insert and the ceramic a body structure; forming a plating layer on the surface of the embedded portion by electrolytic plating.

上述陶瓷塑膠複合製品在陶瓷基體上形成凹槽或通孔狀之嵌設部,藉由於嵌設部內注射塑膠以形成裝飾圖案,並在塑膠表面藉由電鍍之方式形成一電鍍金屬層,使陶瓷基體表面具有金屬圖案之裝飾效果,使得該陶瓷塑膠複合製品具有較佳之裝飾效果。而且,嵌設部之具體形成可以任意設置,故,塑膠形成之裝飾圖案也可千變萬化,使得陶瓷和塑膠之間可形成多種搭配。 The ceramic-plastic composite product forms a recessed or through-hole-shaped embedded portion on the ceramic substrate, and the ceramic is injected into the embedded portion to form a decorative pattern, and a plating metal layer is formed on the plastic surface by electroplating to make the ceramic The surface of the base body has a decorative effect of a metal pattern, so that the ceramic plastic composite product has a better decorative effect. Moreover, the specific formation of the embedded portion can be arbitrarily set, so that the decorative pattern formed by the plastic can also be varied, so that a plurality of combinations can be formed between the ceramic and the plastic.

100‧‧‧陶瓷塑膠複合製品 100‧‧‧Ceramic plastic composite products

10‧‧‧陶瓷基體 10‧‧‧Ceramic substrate

12‧‧‧嵌設部 12‧‧‧ Embedded Department

122‧‧‧通孔 122‧‧‧through hole

1221‧‧‧開口 1221‧‧‧ openings

1223‧‧‧大徑部 1223‧‧‧Great Path Department

124‧‧‧凹槽 124‧‧‧ Groove

20‧‧‧嵌件 20‧‧‧Inlays

30‧‧‧電鍍層 30‧‧‧Electroplating

圖1係本發明較佳實施方式陶瓷塑膠複合製品平面示意圖。 1 is a schematic plan view showing a ceramic plastic composite product according to a preferred embodiment of the present invention.

圖2係圖1沿II-II之剖視示意圖。 Figure 2 is a cross-sectional view taken along line II-II of Figure 1.

圖3係本發明較佳實施方式陶瓷塑膠複合製品之陶瓷基體之嵌設部之第一種結構示意圖。 3 is a first structural schematic view showing an embedded portion of a ceramic base of a ceramic-plastic composite product according to a preferred embodiment of the present invention.

圖4係本發明較佳實施方式陶瓷塑膠複合製品之陶瓷基體之嵌設部之第二種結構示意圖。 4 is a schematic view showing the second structure of the embedded portion of the ceramic base of the ceramic-plastic composite product according to the preferred embodiment of the present invention.

請參閱圖1及圖2,本發明較佳實施方式陶瓷塑膠複合製品100以其應用為一電子裝置外殼為例,其包括一陶瓷基體10及嵌設於陶瓷基體10上之至少一嵌件20(參見圖2)。 Referring to FIG. 1 and FIG. 2 , a ceramic plastic composite article 100 according to a preferred embodiment of the present invention is exemplified by an application of an electronic device casing, comprising a ceramic substrate 10 and at least one insert 20 embedded in the ceramic substrate 10 . (See Figure 2).

陶瓷基體10可由普通陶瓷或強化陶瓷製成,其構成所述電子裝置外殼之主要組成部分。陶瓷基體10上之設置有一嵌設部12(參見圖3),用於將嵌件20嵌設於陶瓷基體10上。嵌設部12可具有多種形狀。 The ceramic substrate 10 can be made of ordinary ceramic or reinforced ceramic, which constitutes a major component of the housing of the electronic device. The ceramic base 10 is provided with an embedded portion 12 (see FIG. 3) for embedding the insert 20 on the ceramic base 10. The embedded portion 12 can have a variety of shapes.

嵌設部12可由開設於陶瓷基體10上之至少一通孔122組成,所述通孔122之二開口1221之間至少包括一大徑部1223。當然,所述通孔122也可為相同之尺寸。請參閱圖3,本實施例之嵌設部12由多個不同尺寸之通孔122組成。嵌設部12也可為開設於陶瓷基體10上之至少一凹槽124組成,所述凹槽124之槽底寬而槽口小(參見圖4)。 The embedded portion 12 may be formed by at least one through hole 122 formed in the ceramic base 10. The second opening 1221 of the through hole 122 includes at least a large diameter portion 1223. Of course, the through holes 122 can also be the same size. Referring to FIG. 3, the embedded portion 12 of the present embodiment is composed of a plurality of through holes 122 of different sizes. The embedded portion 12 can also be formed by at least one groove 124 formed on the ceramic base 10. The groove 124 has a wide groove bottom and a small notch (see FIG. 4).

嵌件20由填充於該嵌設部12之塑膠組成。嵌件20藉由嵌件注塑之方式與陶瓷基體10一體成型,其可由選自較為常見之注塑樹脂形成,如:聚氯乙烯、聚對苯二甲酸乙二醇酯、丙烯睛-苯乙烯-丁二烯共聚合物、聚碳酸酯、聚醯亞胺、液晶聚合物、聚醚醯亞胺、聚苯硫、聚颯、聚苯乙烯、乙二醇改性聚酯及聚丙烯聚合物中之一種或多種。嵌件20在塑膠基體10表面形成裝飾圖案、文字及標識等。當嵌件20之材料為丙烯腈-丁二烯-苯乙烯(Acrylonitrile-Butadiene-Styrene,ABS)、聚碳酸酯(polycarbonate,PC)、丙烯腈-丁二烯-苯乙烯與聚碳酸酯混合物及聚甲基丙烯酸甲酯(Polyethylmethacrylate,PMMA)等可 進行電鍍之塑膠材料時,還可於嵌件20表面形成鍍覆一電鍍層30(請參見圖3)。電鍍層30形成於嵌件20露出於嵌設部12之表面上,以使嵌件20獲得金屬之外觀效果。 The insert 20 is composed of a plastic filled in the embedded portion 12. The insert 20 is integrally formed with the ceramic substrate 10 by insert molding, and may be formed by selecting a relatively common injection molding resin such as polyvinyl chloride, polyethylene terephthalate or acrylonitrile-styrene. Butadiene copolymer, polycarbonate, polyimine, liquid crystal polymer, polyether phthalimide, polyphenylene sulfide, polyfluorene, polystyrene, ethylene glycol modified polyester and polypropylene polymer One or more. The insert 20 forms a decorative pattern, a character, a logo, and the like on the surface of the plastic substrate 10. When the material of the insert 20 is acrylonitrile-butadiene-Styrene (ABS), polycarbonate (PC), acrylonitrile-butadiene-styrene and polycarbonate mixture and Polyethylmethacrylate (PMMA), etc. When the electroplated plastic material is subjected to plating, a plating layer 30 may be formed on the surface of the insert 20 (see Fig. 3). The plating layer 30 is formed on the surface of the insert 20 exposed on the embedded portion 12 to obtain the metal appearance effect of the insert 20.

上述陶瓷塑膠複合製品100之製作方法包括如下步驟:首先,提供一預先製好之陶瓷基體10。該陶瓷基體10可藉由粉料壓力成型坯體後燒結形成,其具有如上所述結構,其中該嵌設部12可在成型該坯體時同時形成,也可在燒結後藉由機械加工形成。 The manufacturing method of the above ceramic plastic composite article 100 comprises the following steps: First, a pre-made ceramic substrate 10 is provided. The ceramic substrate 10 can be formed by sintering a green body by powder pressure, and has the structure as described above, wherein the embedded portion 12 can be formed at the same time when the green body is molded, or can be formed by mechanical processing after sintering. .

然後以嵌件注塑方式於陶瓷基體10之嵌設部12內注塑形成該嵌件20與該陶瓷基體10之一體結構。形成嵌件20之材料為丙烯腈-丁二烯-苯乙烯(Acrylonitrile-Butadiene-Styrene,ABS)、聚碳酸酯(polycarbonate,PC)、丙烯腈-丁二烯-苯乙烯與聚碳酸酯混合物及聚甲基丙烯酸甲酯(Polyethylmethacrylate,PMMA)等可進行電鍍之塑膠材料。 Then, the insert 20 and the ceramic base 10 are integrally formed by insert molding in the insert portion 12 of the ceramic base 10. The material forming the insert 20 is acrylonitrile-butadiene-Styrene (ABS), polycarbonate (PC), acrylonitrile-butadiene-styrene and polycarbonate mixture and A plastic material that can be plated, such as polyethylmethacrylate (PMMA).

藉由電解電鍍之方式於嵌件20露出嵌設部12之表面形成一電鍍層30。 A plating layer 30 is formed on the surface of the insert 20 exposed to the embedded portion 12 by electrolytic plating.

上述陶瓷塑膠複合製品100在陶瓷基體10上形成凹槽或通孔狀之嵌設部12,藉由於嵌設部12內注射塑膠以形成裝飾圖案,並在塑膠表面藉由電鍍之方式形成一電鍍金屬層,使陶瓷基體10表面具有金屬圖案之裝飾效果,使得該陶瓷塑膠複合製品100具有較佳之裝飾效果。而且,嵌設部12之具體形成可以任意設置,所以,塑膠形成之裝飾圖案也可以千變萬化,使得陶瓷和塑膠之間可形成多種搭配。 The ceramic-plastic composite product 100 has a recessed or through-hole-like embedded portion 12 formed on the ceramic substrate 10, and the plastic is injected into the embedded portion 12 to form a decorative pattern, and a plating is formed on the plastic surface by electroplating. The metal layer has a decorative effect of the metal pattern on the surface of the ceramic substrate 10, so that the ceramic-plastic composite article 100 has a better decorative effect. Moreover, the specific formation of the embedded portion 12 can be arbitrarily set. Therefore, the decorative pattern formed by the plastic can also be varied, so that a plurality of combinations can be formed between the ceramic and the plastic.

100‧‧‧陶瓷塑膠複合製品 100‧‧‧Ceramic plastic composite products

10‧‧‧陶瓷基體 10‧‧‧Ceramic substrate

20‧‧‧嵌件 20‧‧‧Inlays

30‧‧‧電鍍層 30‧‧‧Electroplating

Claims (9)

一種陶瓷塑膠複合製品,包括一陶瓷基體及設置於該陶瓷基體上之至少一嵌件,其改良在於:該陶瓷基體上設有一嵌設部,該嵌件由填充於該嵌設部與該陶瓷基體一體成型之塑膠形成,該嵌設部由開設於該陶瓷基體上之至少一通孔組成,所述通孔之二開口之間至少包括一大徑部,該嵌設部由開設於該陶瓷基體上之至少一通孔組成,所述通孔之二開口之間至少包括一大徑部。 A ceramic plastic composite product comprising a ceramic substrate and at least one insert disposed on the ceramic substrate, wherein the ceramic substrate is provided with an embedded portion, the insert is filled in the embedded portion and the ceramic The base is integrally formed of plastic, and the embedded portion is composed of at least one through hole formed in the ceramic base, and the two openings of the through hole include at least a large diameter portion, and the embedded portion is formed by the ceramic base The upper portion is composed of at least one through hole, and at least a large diameter portion is included between the two openings of the through hole. 如申請專利範圍第1項所述之陶瓷塑膠複合製品,其中該嵌設部由開設於陶瓷基體上之至少一凹槽組成,所述凹槽之槽底寬而槽口小。 The ceramic-plastic composite article according to claim 1, wherein the embedded portion is composed of at least one groove formed on the ceramic substrate, and the groove has a groove bottom and a small groove. 如申請專利範圍第1項所述之陶瓷塑膠複合製品,其中該陶瓷塑膠複合製品還包括一電鍍層,該電鍍層形成於該嵌件露出於該嵌設部之表面。 The ceramic-plastic composite article according to claim 1, wherein the ceramic-plastic composite article further comprises a plating layer formed on the surface of the embedded portion. 如申請專利範圍第1項所述之陶瓷塑膠複合製品,其中該嵌件之材料為丙烯腈-丁二烯-苯乙烯、聚碳酸酯、丙烯腈-丁二烯-苯乙烯與聚碳酸酯混合物及聚甲基丙烯酸甲酯塑膠材料中之一種或幾種之組合。 The ceramic-plastic composite article according to claim 1, wherein the material of the insert is a mixture of acrylonitrile-butadiene-styrene, polycarbonate, acrylonitrile-butadiene-styrene and polycarbonate. And a combination of one or more of polymethyl methacrylate plastic materials. 一種陶瓷塑膠複合製品之製作方法,其包括如下步驟:提供一陶瓷基體,該陶瓷基體上設有一嵌設部;以嵌件注塑方式於該陶瓷基體之嵌設部內注塑形成一嵌件與該陶瓷基體之一體結構;藉由電解電鍍之方式於該嵌件露出於該嵌設部之表面形成一電鍍層。 A manufacturing method of a ceramic plastic composite product, comprising the steps of: providing a ceramic substrate, wherein the ceramic substrate is provided with an embedded portion; and inserting and inserting an insert into the ceramic substrate to form an insert and the ceramic a body structure; forming a plating layer on the surface of the embedded portion by electrolytic plating. 如申請專利範圍第5項所述之陶瓷塑膠複合製品之製作方法,其中該嵌設部由開設於該陶瓷基體上之至少一通孔組成,所述通孔之二開口之間至少包括一大徑部。 The method for fabricating a ceramic-plastic composite article according to claim 5, wherein the embedded portion is composed of at least one through hole formed in the ceramic substrate, and at least one large diameter is included between the two openings of the through hole unit. 如申請專利範圍第5項所述之陶瓷塑膠複合製品之製作方法,其中該嵌設 部由開設於陶瓷基體上之至少一凹槽組成,所述凹槽之槽底寬而槽口小。 The method for manufacturing a ceramic-plastic composite product according to claim 5, wherein the embedding The portion is composed of at least one groove formed on the ceramic base, and the groove has a wide groove bottom and a small groove. 如申請專利範圍第5項所述之陶瓷塑膠複合製品之製作方法,其中該陶瓷基體藉由粉料壓力成型坯體後燒結形成,該嵌設部在成型該坯體時同時形成。 The method for fabricating a ceramic-plastic composite article according to claim 5, wherein the ceramic substrate is formed by sintering a green body by powder pressing, and the embedded portion is simultaneously formed when the green body is molded. 如申請專利範圍第8項所述之陶瓷塑膠複合製品之製作方法,其中該嵌設部在該坯體燒結後藉由機械加工形成。 The method for producing a ceramic-plastic composite article according to claim 8, wherein the embedded portion is formed by mechanical processing after the green body is sintered.
TW098143602A 2009-12-18 2009-12-18 Complex article of ceramic and plastic and method for making the same TWI451957B (en)

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Citations (5)

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Publication number Priority date Publication date Assignee Title
CN87107196A (en) * 1986-10-30 1988-08-31 奥林公司 With ceramics-glass-metal composite encapsulating electronic components
JPH0373549A (en) * 1989-08-15 1991-03-28 Matsushita Electric Ind Co Ltd Manufacture of substrate with metal bump formed thereon
TW200641036A (en) * 2005-02-15 2006-12-01 Samsung Electro Mech Resin composition and ceramic/polymer composite for embedded capacitors having excellent TCC property
TW200827150A (en) * 2006-12-19 2008-07-01 Sutech Trading Ltd Insert molding article
TW200911501A (en) * 2007-09-14 2009-03-16 Sutech Trading Ltd Insert molded article

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN87107196A (en) * 1986-10-30 1988-08-31 奥林公司 With ceramics-glass-metal composite encapsulating electronic components
JPH0373549A (en) * 1989-08-15 1991-03-28 Matsushita Electric Ind Co Ltd Manufacture of substrate with metal bump formed thereon
TW200641036A (en) * 2005-02-15 2006-12-01 Samsung Electro Mech Resin composition and ceramic/polymer composite for embedded capacitors having excellent TCC property
TW200827150A (en) * 2006-12-19 2008-07-01 Sutech Trading Ltd Insert molding article
TW200911501A (en) * 2007-09-14 2009-03-16 Sutech Trading Ltd Insert molded article

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