JPH0249742Y2 - - Google Patents
Info
- Publication number
- JPH0249742Y2 JPH0249742Y2 JP1985189200U JP18920085U JPH0249742Y2 JP H0249742 Y2 JPH0249742 Y2 JP H0249742Y2 JP 1985189200 U JP1985189200 U JP 1985189200U JP 18920085 U JP18920085 U JP 18920085U JP H0249742 Y2 JPH0249742 Y2 JP H0249742Y2
- Authority
- JP
- Japan
- Prior art keywords
- connector
- wiring board
- printed wiring
- multilayer printed
- ground layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 9
- 230000001681 protective effect Effects 0.000 description 11
- 238000007747 plating Methods 0.000 description 6
- 238000007796 conventional method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Description
【考案の詳細な説明】
［考案の技術分野］
本考案は内層のグランド層を接栓めつき用リー
ド線として利用した多層印刷配線板に関する。[Detailed Description of the Invention] [Technical Field of the Invention] The present invention relates to a multilayer printed wiring board using an inner ground layer as a lead wire for plugging.
［考案の技術的背景とその問題点］
従来より多層印刷配線板においては、第３図に
示すように多層印刷配線板の製品外形線１の外側
に、接栓２をめつきするために接栓めつき用リー
ド線３が形成されている。そして接栓２をめつき
する場合には、予じめ図中点線で示すように、回
路部分以外に接栓めつき用リード線にも保護カバ
ー４ａ，４ｂを貼着してからＡ位置までめつき液
に浸漬し、めつき後は保護カバー４ａ，４ｂを剥
すことが行なわれている。[Technical background of the invention and its problems] Conventionally, in multilayer printed wiring boards, as shown in FIG. A plugging lead wire 3 is formed. When fitting the connector 2, first attach the protective covers 4a and 4b to the lead wires for attaching the connector in addition to the circuit part, as shown by the dotted line in the figure, and then attach the protective covers 4a and 4b to the connector connector lead wires beforehand. The protective covers 4a and 4b are removed after immersion in a plating solution and plating.
しかるにこのように従来の方法では、接栓めつ
き用リード線は外形加工後除去されるので資源の
無駄になり、また保護カバーのとりつけや剥離と
いう作業にも手間がかかるという難点があつた。 However, in the conventional method, the lead wire for fitting the plug is removed after the external shape is processed, which wastes resources, and it also takes time and effort to attach and peel off the protective cover.
［考案の目的］
本考案はこのような難点を解消するためになさ
れたもので、外形加工後は不要となる接栓めつき
用リード線をできるだけ少なくし、また保護カバ
ーのとりつけ場所もできるだけ少なくした多層印
刷配線板を提供することを目的とする。[Purpose of the invention] The present invention was made in order to solve these difficulties, and it minimizes the number of lead wires for connecting plugs that are unnecessary after the external shape is processed, and also minimizes the places where the protective cover is attached. The purpose of the present invention is to provide a multilayer printed wiring board.
［考案の概要］
すなわち本考案の多層印刷配線板は、各接栓の
パターンを製品外形線の外側まで延長し、各接栓
毎にスルーホールを介して内層のグランド層と接
続させ、前記内層のグランド層を接栓めつき用リ
ード線として用いることにより、外形加工後は不
要となる接栓めつき用リード線をできるだけ少な
くし、また保護カバーのとりつけ場所もできるだ
け少なくしたものである。[Summary of the invention] That is, the multilayer printed wiring board of the present invention extends the pattern of each plug to the outside of the product outline, connects each plug to the ground layer of the inner layer via a through hole, and By using the ground layer as the lead wire for fitting the connector, the number of lead wires for attaching the connector that are unnecessary after the external shape processing is minimized, and the number of places for attaching the protective cover is also minimized.
［考案の実施例］
次に本考案の実施例について図面を用いて説明
する。[Embodiments of the invention] Next, embodiments of the invention will be described with reference to the drawings.
第１図および第２図は、それぞれ実施例の多層
印刷配線板の外層を示す平面図と内層を示す平面
図である。なお第３図と共通する部分は同一符号
で示し重複する説明は省略する。 1 and 2 are a plan view showing an outer layer and an inner layer, respectively, of a multilayer printed wiring board according to an embodiment. Note that parts common to those in FIG. 3 are indicated by the same reference numerals, and redundant explanations will be omitted.
第１図において、符号２は複数の接栓で、各接
栓２のパターンは製品外形線１の外側まで延長さ
れ、その端部には内層のグランド層５と接続する
接栓めつき用スルーホール６が形成される。そし
て外層のめつき液に浸漬する位置Ａより上方に接
栓めつき用リード線３が取りつけられ、スルーホ
ール部７により内層のグランド層５と接続されて
いる。 In Fig. 1, reference numeral 2 indicates a plurality of connectors, and the pattern of each connector 2 extends to the outside of the product outline 1, and the end thereof has a through hole for connecting the connector to the ground layer 5 of the inner layer. A hole 6 is formed. A connector plating lead wire 3 is attached above the position A where the outer layer is immersed in the plating solution, and is connected to the ground layer 5 of the inner layer through a through hole portion 7.
このように構成された多層印刷配線板において
は、接栓２の内側の保護カバー４ａを設けた状態
で接栓めつきが行なわれ、めつき完了後保護カバ
ー４ａが除去され、製品外形線１から外側の部分
が切断除去されて所定の多層印刷配線板が得られ
る。したがつて外形加工後に除去する接栓めつき
用リード線の部分を少なくすることができ、また
めつきの際の保護カバー４ｂを省略することがで
きる。 In the multilayer printed wiring board configured in this way, plug plating is performed with the protective cover 4a provided inside the plug 2, and after the plating is completed, the protective cover 4a is removed and the product outline 1 The outer portion is cut and removed to obtain a predetermined multilayer printed wiring board. Therefore, it is possible to reduce the portion of the plug-fitting lead wire that must be removed after external processing, and it is also possible to omit the protective cover 4b in case of fitting.
［考案の効果］
以上説明したように本考案の多層印刷配線板に
おいては、内層のグランド層と接続する接栓めつ
き用スルーホールを形成してグランド層を接栓め
つき用リード線の代りに利用するので、資源の節
約をはかることができ、また接栓めつき用リード
線のための保護カバーを施こす必要がなくなる。[Effects of the invention] As explained above, in the multilayer printed wiring board of the invention, through-holes for plugging are formed to connect with the ground layer of the inner layer, and the ground layer can be used instead of lead wires for plugging. Since it can be used for many purposes, it is possible to save resources, and there is no need to provide a protective cover for the lead wire for plugging.
第１図および第２図はそれぞれ本考案の多層印
刷配線板の外層および内層を示す平面図、第３図
は従来の多層印刷配線板の平面図である。１……
製品外形線、２……接栓、３……接栓めつき用リ
ード線、４ａ，４ｂ……保護カバー、５……グラ
ンド層、６，７……接栓めつき用スルーホール。
FIGS. 1 and 2 are plan views showing the outer and inner layers of the multilayer printed wiring board of the present invention, respectively, and FIG. 3 is a plan view of a conventional multilayer printed wiring board. 1...
Product outline, 2... Junction, 3... Lead wire for fitting the fitting, 4a, 4b... Protective cover, 5... Ground layer, 6, 7... Through hole for fitting the fitting.
Claims (1)
切離し製品化される多層印刷配線板において、 前記各接栓のパターンが製品外形線の外側まで
延設され、各接栓ごとに製品外形線の外側でスル
ホールを介して内層のグランド層に接続させ、内
層のグランド層を接栓めつき用リード線として用
いるように構成したことを特徴とする多層印刷配
線板。[Claims for Utility Model Registration] In a multilayer printed wiring board in which a plurality of plugs are formed on the surface and are separated to form a product by cutting along the product outline, the pattern of each of the plugs extends to the outside of the product outline. The multilayer printing is characterized in that each connector is connected to an inner ground layer via a through hole outside the product outline line, and the inner ground layer is used as a lead wire for attaching the connector. wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985189200U JPH0249742Y2 (en) | 1985-12-09 | 1985-12-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985189200U JPH0249742Y2 (en) | 1985-12-09 | 1985-12-09 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6296885U JPS6296885U (en) | 1987-06-20 |
| JPH0249742Y2 true JPH0249742Y2 (en) | 1990-12-27 |
Family
ID=31141278
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985189200U Expired JPH0249742Y2 (en) | 1985-12-09 | 1985-12-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0249742Y2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2752988B2 (en) * | 1988-06-22 | 1998-05-18 | 松下電器産業株式会社 | Manufacturing method of printed wiring board |
| WO2022114078A1 (en) * | 2020-11-27 | 2022-06-02 | 京セラ株式会社 | Wiring board and probe card |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60236297A (en) * | 1984-05-10 | 1985-11-25 | 日本電気株式会社 | Multilayer printed circuit board |
-
1985
- 1985-12-09 JP JP1985189200U patent/JPH0249742Y2/ja not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60236297A (en) * | 1984-05-10 | 1985-11-25 | 日本電気株式会社 | Multilayer printed circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6296885U (en) | 1987-06-20 |
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