JPH0249711Y2 - - Google Patents

Info

Publication number
JPH0249711Y2
JPH0249711Y2 JP1904984U JP1904984U JPH0249711Y2 JP H0249711 Y2 JPH0249711 Y2 JP H0249711Y2 JP 1904984 U JP1904984 U JP 1904984U JP 1904984 U JP1904984 U JP 1904984U JP H0249711 Y2 JPH0249711 Y2 JP H0249711Y2
Authority
JP
Japan
Prior art keywords
tape
nozzle
lever
solder
holding block
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1904984U
Other languages
English (en)
Japanese (ja)
Other versions
JPS60130643U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1904984U priority Critical patent/JPS60130643U/ja
Publication of JPS60130643U publication Critical patent/JPS60130643U/ja
Application granted granted Critical
Publication of JPH0249711Y2 publication Critical patent/JPH0249711Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743—Apparatus for manufacturing layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/743—Apparatus for manufacturing layer connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
JP1904984U 1984-02-13 1984-02-13 ノズル位置出し機構 Granted JPS60130643U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1904984U JPS60130643U (ja) 1984-02-13 1984-02-13 ノズル位置出し機構

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1904984U JPS60130643U (ja) 1984-02-13 1984-02-13 ノズル位置出し機構

Publications (2)

Publication Number Publication Date
JPS60130643U JPS60130643U (ja) 1985-09-02
JPH0249711Y2 true JPH0249711Y2 (US20090163788A1-20090625-C00002.png) 1990-12-27

Family

ID=30508259

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1904984U Granted JPS60130643U (ja) 1984-02-13 1984-02-13 ノズル位置出し機構

Country Status (1)

Country Link
JP (1) JPS60130643U (US20090163788A1-20090625-C00002.png)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4101573A4 (en) * 2020-04-03 2023-03-29 Hirata Corporation WELD CUTTING DEVICE, WELD CUTTING UNIT, WORK FITTING DEVICE AND PRODUCTION SYSTEM

Also Published As

Publication number Publication date
JPS60130643U (ja) 1985-09-02

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