JPH0249490A - Method of modification of jig for printed board wiring test - Google Patents

Abstract

PURPOSE:To obtain a wiring testing jig capable of rapidly coping with a printed board changed in design by a method wherein a copy plate is formed, which is fixed to a test jig, a hole boring process is made, and probe is installed. CONSTITUTION:A copy plate 10 provided with drilling position indexing holes 11 and two or more positioning holes 12 is formed, where the indexing holes 11 are bored at positions corresponding to the connecting points of an additionally packaged component 2 which is added to a printed board 1 and the positioning holes 12 are bored at positions corresponding to connecting points of existing packaged components 3 adjacent to the component 2. The plate 10 is fixed to a wiring test jig 20 by the use of two or more socket holes 22 from which the sockets has been extracted out, where the socket holes 22 corresponds to the connecting points of the component 3 adjacent to the component 2. An additional socket hole 23 is bored at a position corresponding to the connecting point of the component 2 through the indexing holes 11 as a guide. Sockets and probes are installed in the existing socket holes 22 and the additional hole 23. By these processes, a jig 20 capable of rapidly coping with the substrate 1 changed in design can be obtained.

Description

[Detailed Description of the Invention] [Summary] Regarding a method for modifying a wiring test jig for a printed circuit board, when mounting components are added in response to a design change of the printed circuit board, the wiring of the printed circuit board before the design change is changed. The purpose is to add probes to the required positions of the test jig so that it can be used as a wiring test jig for printed circuit boards after design changes, and it corresponds to the connection points of additional mounted components added to the printed circuit board. A copying plate having a required number of drill positioning holes formed at the positions to be mounted, and a plurality of positioning holes formed at positions corresponding to the connection points of the existing mounted components adjacent to the additional mounted components, is made, and the additional mounting is performed. Fix the above copying plate to the wiring test jig using the multiple socket holes from which sockets corresponding to the connection points of the existing mounted components adjacent to the component are removed, and perform additional mounting using the drill position indexing hole as a guide. An additional socket hole is formed at a position corresponding to the connection point of the component, and then a socket and a probe are attached to the existing socket hole from which the socket was previously removed and the additional socket hole.

[Industrial application field]

The present invention relates to a method for modifying a wiring test jig for a printed circuit board, and more particularly to a method for modifying a wiring test jig for a printed circuit board to which mounted components are added.

[Conventional technology]

The conventional printed circuit board wiring test jig, as shown in Fig. 6, has socket holes as shown in Fig. 7, corresponding to all the connection points (lands) of the mounted components on the printed circuit board under test. 22, and insert the probe 2 into the socket hole 22.
1 is inserted into the socket 24. The probe 21 is biased upward by a spring to ensure electrical conductivity with the printed circuit board that is pressure-bonded from above.

[Problem to be solved by the invention]

When a request to change or add functionality to a prototype or finished product involves changing the design of the circuit, it may be necessary to mount new parts on the printed circuit board. When printed circuit boards are manufactured based on design standards in which components are mounted on a basic grid, the jig used for wiring tests on printed circuit boards whose design has been changed can be handled by a general-purpose machine similar to that used for design changes. . However, in recent years, in order to save space, printed circuit boards that do not meet the design standards have been manufactured in which components are mounted on a basic grid, and in this case general-purpose machines cannot be used as test jigs. Furthermore, even if an attempt is made to use the wiring test jig used before the design change, it is necessary to add socket holes, sockets, probes, and wiring in accordance with the positions of additional parts. However, in order to create a new socket hole in a wiring test jig that has already been created for a specific printed circuit board, all probes, sockets, and wiring must be removed before processing the wiring test jig. It cannot be attached to a machine, and it is necessary to attach and wire a large number of probes and sockets after processing, which is actually an extremely difficult task.

Therefore, in the past, new wiring test jigs were created to accommodate printed circuit board design changes even when a small number of parts were added, which not only made it impossible to respond quickly to printed circuit board design changes, but also reduced costs. There is a problem in that it is disadvantageous when aiming for

The present invention has been made in consideration of the above circumstances, and includes:
When mounting components are added in response to changes in the design of a printed circuit board, probes are added to the required positions of the wiring test jig for the printed circuit board after the design change. Print M made available as
The purpose is to provide a method for modifying a wiring test jig for plates.

[Means to solve the problem]

In order to achieve the above object, the method for modifying a wiring test jig for a printed circuit board according to the present invention includes a step (Sl) of making a copy board as shown in FIG. It consists of a fixing step (S2), a drilling step (S3), and a prong installation step (S4).

In the step (Sl) of making a copying plate, a copying plate 10 as shown in FIG. 2, for example, is prepared. This copying plate 10 has a required number of drill position indexing holes formed at positions corresponding to connection points of additional mounting components 2 added as shown in FIG. 4 to a printed circuit board 1 as shown in FIG. 3, for example. 11 and a plurality of positioning holes 12 formed at the connection point of the existing mounted component 3 adjacent to the additional mounted component 2, that is, at a position corresponding to the socket hole 22.

In addition, in the step (S2) of fixing the copying plate to the test jig,
Among the many probes 21 attached to the wiring test jig 20, the socket 24 and the probe 2 are inserted through the socket hole 22 corresponding to the connection point of the existing mounted component 3 adjacent to the additional mounted component 2.
1, and each positioning hole 12 of the plate 10 is imitated to the plurality of socket holes 22 from which the socket 24 and the probe 21 have been removed.
After aligning the socket holes 22 and positioning holes 12
The copying plate 10 is fixed to the wiring test jig 20 using the following.

Furthermore, in the processing step (S3), the hole is drilled at a position corresponding to the connection point of the additional mounting component 2 of the wiring test jig 20 using the drill position indexing hole 11 as a guide, as shown in FIG. 5, for example. Additional bottle holes 23 are formed.

In the final socket mounting step (S4), the copying plate lO is removed from the cloth testing jig 20, and the socket hole 22 from which the socket 24 and probe 21 were previously removed and the additional socket hole 2 are removed.
A socket 24 and probe 21 which are wire-connected to 3 are attached.

[Effect]

According to the method for modifying a wiring test jig for a printed circuit board of the present invention, the probe 21 and socket 24 of the existing mounted component 3 adjacent to the newly added mounted component 2 are slightly removed and the newly added mounted component 2 is added. Socket hole 2 corresponding to the mounted component
2 can be formed, and there is no need to attach or detach a large number of sockets 24, probes 21, and wiring from the wiring test jig 20.

〔Example〕

A method for modifying a wiring test jig for printed circuit boards according to an embodiment of the present invention will be explained based on FIGS. 2 to 5.
It is as follows.

First, a copying plate 10 as shown in FIG. 2 is prepared (S
l). This copying plate 10 is prepared for adding an additional mounting component 2 as shown in FIG. 4 to a printed circuit board 1 as shown in FIG.
The required number of drill position indexing holes 11 formed at positions corresponding to the connection points (lands) of It has a plurality of positioning holes 12 formed at positions corresponding to the holes 22. The number of positioning holes 12 is not particularly limited as long as it is two or more, but here,
The holes are drilled in the machining step (S3), which will be described later, in order to sufficiently prevent the influence of the reaction force of the drill 30 acting on the copying plate 10, and to appropriately select the insertion position of the positioning pin 13. A positioning hole 12 is formed.

In the next step of fixing the copying plate (S2), the copying plate 10 out of the large number of probes 21 attached to the wiring test jig 20 is
The socket 24 and probe 21 are removed from the socket hole 22 of the existing mounted component 3 adjacent to the additional mounted component 2 within the range covered by the additional mounted component 2, and the copying plate 10 is positioned in the plurality of socket holes 22 from which the socket 24 and probe 21 have been removed. Hole 1
2, the copying plate 10 is fixed to the wiring test jig 20 by inserting the required number of positioning pins 13 across the socket hole 22 and the positioning hole 12, as shown in FIG. . The number of positioning bins 13 is not particularly limited as long as it is two or more, but as described above, drilling is performed using the drill 3 that acts on the copy vilo in the processing stage (S3).
The number must be large enough to sufficiently prevent the copying plate 10 from rotating due to zero reaction force.

The subsequent hole drilling is carried out in the machining stage (S3), for example, as shown in FIG. Additional socket holes 22 are formed at a predetermined number of positions corresponding to the connection points of the 20 additional mounted components 2. The machining depth of the drill 30 for forming the additional socket hole 23 is determined based on the plate pressure of the copying plate 10 and the thickness of the wiring test jig 20 in order to prevent damage to the wiring on the back side of the wiring test jig 20. It is equal to the sum.

After completing the machining stage (S3), the positioning pin 13 is removed, the copying plate 10 is removed from the wiring test jig 20, and a new socket hole 22 is formed with the socket hole 22 from which the socket 24 was previously removed. The sockets 24 connected to the additional socket holes 23 are press-fitted, the probes 21 are attached to these sockets 24, and the modification of the wiring test jig due to the change in the design of the printed circuit board is completed.

〔Effect of the invention〕

According to the above procedure, by removing only a portion of the socket and probe from the wiring test jig, it is possible to quickly modify the wiring test jig to be compatible with a printed circuit board whose design has been changed. Compared to making a test jig, it is possible to obtain a wiring test jig compatible with a printed circuit board whose design has been changed at a much lower cost.

Moreover, since additional pin holes are formed at predetermined positions using the drill position index hole of the copying plate as a guide, additional pin holes can be formed quickly and accurately even though a hand drill is used. Can be done.

[Brief explanation of the drawing]

FIG. 1 is a flow diagram showing the configuration of the present invention, FIG. 2 is a plan view of a copying plate used in an embodiment of the present invention, FIG. 3 is a layout diagram of components mounted on a printed circuit board before design change, and FIG. Figure 4 is a layout diagram of the components mounted on the printed circuit board after the design change, Figure 5 is a schematic diagram showing the fixing stage of the copying plate and the drilling stage, Figure 6 is a schematic diagram showing the cross section of the wiring test jig, Figure 7 is a sectional view of the wiring test jig showing the mounting structure of the probe and socket. In the figure, Sl...Profile temporary creation process, S2...Profile plate fixing process, S3...Drilling process, S4...Socket device process, 1...Printed circuit board, 2...Additional Mounted parts, 3...
・Existing mounted parts, 10... copying plate, 11... drill position indexing hole, 12... positioning hole, 20... wiring test jig, 2
1... Probe, 22... Socket hole, Fig. 2 - * Noh of the 黍餞 设场, If'J Plow section Fig. 1 Yoshifumi Kei Tago 9-suji 7° lint certain fu V Fig. 3 right History book [1, 7° Lint Kito-jo, Zuiku I Photographed by Peng Ruji, Tayeon-myeon-ku, No. 1 Gallery] Mr. 懺 1, Probe 1 or 4 of the detailed box disaster, Tax Asahi prisoner No. 1 figure

Claims (1)

[Scope of Claims] [1] Additional mounting components added to the printed circuit board (1)
A required number of drill position index holes (11) formed at positions corresponding to the connection points of 2) and positions corresponding to the connection points of the existing mounting component (3) adjacent to the additional mounting component (2). A copying plate (10) having a plurality of positioning holes (12)
) (S1), and install the existing mounted component (3) adjacent to the additional mounted component (2) above.
The copying plate (10) is removed using the plurality of socket holes (22) from which sockets (24) corresponding to the connection points are extracted.
is fixed to the wiring test jig (20) (S2), and an additional socket hole (23) is formed at a position corresponding to the connection point of the additional mounting component (2) using the drill position indexing hole (11) as a guide. death(
S3), After that, insert the socket (
24) and a probe (21) (S4).