JPH04322091A - Socket apparatus for integrated circuit - Google Patents

Abstract

PURPOSE:To improve the mounting density by installing a plurality of pin- receiving socket pins into which at least one IC pin receiving socket pin longer than the IC pin distance of an integrated circuit and connecting each of them by through holes. CONSTITUTION:After pin receiving socket pins 10, 11 of a second IC socket 9 are inserted into and connected with through holes 12 of a printed substrate 5, the pins 10, 11 are connected each other by soldering. Then, an IC pin 2 of an IC 1 is inserted into the pin 11 of the socket 9 and at the same time an IC pin receiving socket pin 8 of a first IC socket 7 is inserted into the pin 10. A plurality of IC 1 are clinched and mounted in one socket 9 by inserting pin 2 of the IC 1 into the socket 7. Though the pin 2 and the pin 8 to be inserted into the socket 9 are one, respectively, a plurality of IC pin receiving socket pins can be inserted into the second IC socket by differing the distance of a plurality of the pins.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a socket device for an integrated circuit mounted on a printed circuit board.

0002

2. Description of the Related Art FIG. 3 is a front view showing a conventional integrated circuit socket device. In the figure, 1 is an integrated circuit (hereinafter referred to as
(abbreviated as IC), 2 are IC pins provided at both longitudinal ends of the IC 1, and the pin spacing between the IC pins 2 is set to the same standardized length. 3 is an integrated circuit socket into which the IC pin 2 is inserted (hereinafter abbreviated as IC socket), 4 is an IC pin receiving socket pin of IC socket 3, 5 is a printed circuit board, and 6 is a hole drilled in the printed circuit board 5. The IC socket 3 is mounted on the printed circuit board 5 by inserting and connecting the IC pin receiving socket pin 4 into the through hole 6.

The IC socket 3 is mounted on the printed circuit board 5 by inserting the IC pin receiving socket pin 4 into the through hole 6 of the printed circuit board 5 and soldering. Next, by inserting and connecting the IC 1 into the IC socket 3 via the IC pin 2, the IC 1 is connected to the printed circuit board 5 via the IC socket 3.

0004

[Problems to be Solved by the Invention] Since the conventional integrated circuit socket device is constructed as described above, the pin spacing between the IC pin receiving socket pins 4 of the IC socket 3 is as large as the IC.
Since it is formed to have the same length as the pin interval of pin 2, I
Since only one IC 1 can be inserted and connected to one C socket 3, there is a problem in that it is impossible to further increase the mounting density of the printed circuit board 5.

[0005] This invention was made in order to solve the above-mentioned problems, and it is possible to insert and connect a plurality of integrated circuits to one integrated circuit socket, thereby improving the mounting density of the printed circuit board. The object of the present invention is to obtain a socket device for an integrated circuit.

[0006]

[Means for Solving the Problems] In the integrated circuit socket device according to the present invention, at least one IC pin receiving socket pin is inserted, the interval between the IC pins of the integrated circuit and the socket pin being longer than the interval between the IC pins of the integrated circuit. an integrated circuit socket provided with a plurality of pin-receiving socket pins;
It is comprised of a printed circuit board provided with through holes for inserting and connecting each of the plurality of pin receiving socket pins of the integrated circuit socket.

[0007]

[Operation] The socket device for integrated circuits according to the present invention has the following features:
After inserting and connecting multiple pin receiving socket pins of an integrated circuit socket into the through holes of a printed circuit board, IC pins of the integrated circuit and IC pins with IC pins of the integrated circuit inserted into the pin receiving socket pins of the integrated circuit socket. A plurality of ICs are mounted on one integrated circuit socket by inserting receiving socket pins.

[0008]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a front view showing one embodiment of this invention.
Components that are the same or equivalent to those in FIG. 3 are given the same reference numerals, and redundant explanation will be omitted. In the figure, 7 is IC1
8 is the first IC socket into which IC pin 2 is inserted;
Connect this I with the IC pin receiving socket pin of IC socket 7.
The socket pin spacing of the C pin receiving socket pins 8 is formed to be longer than the pin spacing of the IC pins 2. 9 is the 1st IC
A second IC socket into which a socket 7 and an IC pin 2 of an IC 1 different from the above-mentioned IC 1 are inserted, and a pin receiving socket pin 10 into which an IC pin receiving socket pin 8 of the first IC socket 7 is inserted and connected. Pin receiving socket pin 1 into which IC pin 2 is inserted and connected
1 is provided. Reference numeral 12 denotes a through hole formed in the printed circuit board 5, into which pin receiving socket pins 10 and 11 are inserted and connected.

Next, the operation will be explained. After the pin receiving socket pins 10 and 11 of the second IC socket 9 are inserted and connected to the through hole 12 of the printed circuit board 5, the pin receiving socket pins 10 and 11 are connected by soldering, respectively. Next, the pin receiving socket pin 11 of the second IC socket 9
At the same time, insert the IC pin 2 of the IC1 into the pin receiving socket pin 10, and insert the IC pin receiving socket pin 8 of the first IC socket 7 into the first IC socket 7.
1 as shown in Figure 2 by inserting the IC pin 2 of
The assembly and mounting of the plurality of ICs 1 to the second IC sockets 9 is completed.

In the above embodiment, the second IC socket 9 has one IC pin 2 and one IC pin receiving socket pin 8 each, but by varying the pin spacing, the second IC socket has one IC pin 2 and one IC pin receiving socket pin 8. Multiple receiving socket pins can be inserted.

[0011]

As described above, according to the present invention, at least one IC pin receiving socket pin is inserted into the integrated circuit socket, and the interval between the IC pins of the integrated circuit and the socket pin is longer than the interval between the IC pins of the integrated circuit. A plurality of pin-receiving socket pins are provided, and a through-hole is provided in the printed circuit board for inserting and connecting each of the plurality of pin-receiving socket pins of the above-mentioned integrated circuit socket. There is an effect that a plurality of integrated circuits can be inserted and connected to each other, and the mounting density of the printed circuit board can be improved.

[Brief explanation of drawings]

FIG. 1 is a front view showing an integrated circuit socket device according to an embodiment of the present invention.

FIG. 2 is a front view showing a state in which an integrated circuit is assembled into the integrated circuit socket shown in FIG. 1;

FIG. 3 is a front view showing an example of a conventional integrated circuit socket device.

[Explanation of symbols]

1 Integrated circuit 2 IC pin 5 Printed circuit board 7 First IC socket (integrated circuit socket) 8
IC pin receiving socket pin 9 2nd IC socket (integrated circuit socket) 1
0,11 Pin receiving socket pin 12 Through hole

Claims (1)

[Claims] 1. A socket for an integrated circuit, comprising a plurality of pin receiving socket pins into which at least one IC pin receiving socket pin is inserted, the interval between the IC pins of the integrated circuit and the socket pin being longer than the interval between the IC pins of the integrated circuit. and a printed circuit board provided with through holes for inserting and connecting each of the plurality of pin receiving socket pins of the integrated circuit socket.