JPH024781Y2 - - Google Patents

Info

Publication number
JPH024781Y2
JPH024781Y2 JP1984084351U JP8435184U JPH024781Y2 JP H024781 Y2 JPH024781 Y2 JP H024781Y2 JP 1984084351 U JP1984084351 U JP 1984084351U JP 8435184 U JP8435184 U JP 8435184U JP H024781 Y2 JPH024781 Y2 JP H024781Y2
Authority
JP
Japan
Prior art keywords
heat
printed circuit
circuit board
cream solder
resistant
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1984084351U
Other languages
English (en)
Japanese (ja)
Other versions
JPS614870U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1984084351U priority Critical patent/JPS614870U/ja
Priority to DE3429375A priority patent/DE3429375C2/de
Publication of JPS614870U publication Critical patent/JPS614870U/ja
Application granted granted Critical
Publication of JPH024781Y2 publication Critical patent/JPH024781Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/008—Soldering within a furnace
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Tunnel Furnaces (AREA)
JP1984084351U 1984-06-08 1984-06-08 リフロ−炉 Granted JPS614870U (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP1984084351U JPS614870U (ja) 1984-06-08 1984-06-08 リフロ−炉
DE3429375A DE3429375C2 (de) 1984-06-08 1984-08-09 Lötvorrichtung

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984084351U JPS614870U (ja) 1984-06-08 1984-06-08 リフロ−炉

Publications (2)

Publication Number Publication Date
JPS614870U JPS614870U (ja) 1986-01-13
JPH024781Y2 true JPH024781Y2 (enEXAMPLES) 1990-02-05

Family

ID=13828096

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984084351U Granted JPS614870U (ja) 1984-06-08 1984-06-08 リフロ−炉

Country Status (2)

Country Link
JP (1) JPS614870U (enEXAMPLES)
DE (1) DE3429375C2 (enEXAMPLES)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4787379B1 (ja) * 2011-02-17 2011-10-05 吉政 玉井 コンパクトテーブル

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3720912A1 (de) * 1986-07-03 1988-01-07 Licentia Gmbh Verfahren und anordnung zum reflow-loeten und reflow-entloeten von leiterplatten
DE3635448C1 (en) * 1986-10-18 1988-01-21 Sab Schumacher Appbau Gmbh & C Method and device for reflow soldering of electronic components on printed circuit boards, conforming with SMD technology
JPS6471571A (en) * 1987-09-11 1989-03-16 Senju Metal Industry Co Reflow furnace
DE3737565A1 (de) * 1987-11-05 1989-05-24 Ernst Hohnerlein Verfahren und vorrichtung zum loeten
JPH0751273B2 (ja) * 1988-01-13 1995-06-05 松下電器産業株式会社 基板加熱装置
DE3806753A1 (de) * 1988-03-02 1989-09-14 Heino Pachschwoell Loet- und/oder aushaertvorrichtung
US4973244A (en) * 1988-06-08 1990-11-27 Electrovert Limited Heating system in the manufacture of printed circuit boards, assemblies and the like
DE3837531A1 (de) * 1988-11-04 1990-05-10 Siemens Ag Heissluft-reflow-ofen
DE3841447C1 (enEXAMPLES) * 1988-12-09 1990-08-02 Heraeus Quarzschmelze Gmbh, 6450 Hanau, De
US6146448A (en) * 1998-11-02 2000-11-14 Soltec B.V. Flux management system for a solder reflow oven
US7303109B2 (en) * 2003-07-01 2007-12-04 Asm Technology Singapore Pte Ltd. Stud bumping apparatus
CN111545857B (zh) * 2020-06-02 2024-10-22 常州市武进顺达精密钢管有限公司 冰箱蒸发器和冷凝器焊接用的高频感应钎焊炉及应用工艺

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2435884A1 (fr) * 1978-09-07 1980-04-04 Cit Alcatel Machine a souder un connecteur a une plaque de circuit imprime

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4787379B1 (ja) * 2011-02-17 2011-10-05 吉政 玉井 コンパクトテーブル

Also Published As

Publication number Publication date
JPS614870U (ja) 1986-01-13
DE3429375A1 (de) 1985-12-12
DE3429375C2 (de) 1987-02-26

Similar Documents

Publication Publication Date Title
JPH024781Y2 (enEXAMPLES)
EP0307319B1 (en) Reflow furnace
CA1240404A (en) Infrared process and apparatus for infrared soldering components on circuit boards
EP0351460B1 (en) Soldering apparatus
US5066850A (en) Soldering apparatus of a reflow type
US6575352B2 (en) Apparatus and method for soldering electronic components to printed circuit boards
ATE78739T1 (de) Durchlaufofen zum anloeten von elektronischen bauteilen.
JPH0749151B2 (ja) ハンダ付けリフロー炉
JPH0228258B2 (ja) Rifurooroniokeruhandazukekairobannokanetsuhoho
JPS607193A (ja) 回路基板用半田付炉
JPH02114696A (ja) リフロー半田付け方法及びその装置
JPH05161961A (ja) リフロー炉
JPS63177960A (ja) リフロ−はんだ付け装置
JP2003179342A (ja) リフロー炉
JPH0645747A (ja) リフロー装置
JP2751515B2 (ja) リフロー半田付装置及びリフロー半田付装置の加熱方法
JP7550253B2 (ja) 搬送加熱装置
JPS6384767A (ja) リフロ−炉
JP2597695Y2 (ja) リフロー炉
JPH08250852A (ja) リフロー方法、リフロー炉およびリフロー炉用熱風式ヒーター
JP2009200072A (ja) リフローはんだ付け装置及びそれを使用するリフローはんだ付け方法
JPH0231255Y2 (enEXAMPLES)
JPH04270063A (ja) 伝熱リフローはんだ付け装置
JPH038391A (ja) リフロー炉
JPS6418572A (en) Soldering device