JPH0247052U - - Google Patents

Info

Publication number
JPH0247052U
JPH0247052U JP12643588U JP12643588U JPH0247052U JP H0247052 U JPH0247052 U JP H0247052U JP 12643588 U JP12643588 U JP 12643588U JP 12643588 U JP12643588 U JP 12643588U JP H0247052 U JPH0247052 U JP H0247052U
Authority
JP
Japan
Prior art keywords
integrated circuit
circuit device
hybrid integrated
conductive film
semiconductor element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12643588U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP12643588U priority Critical patent/JPH0247052U/ja
Publication of JPH0247052U publication Critical patent/JPH0247052U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Description

【図面の簡単な説明】
第１図は本考案の第１の実施例のハイブリツド
集積回路装置の断面図、第２図は本考案の第２の
実施例のハイブリツド集積回路装置の断面図、第
３図は従来のハイブリツドＩＣの断面図である。 １……ベース基板、２……半導体素子、３……
カバーキヤツプ、４……端子、５……プリント基
板、６……導電性被膜。

Claims (1)

    【実用新案登録請求の範囲】
  1. ベース基板に半導体素子を搭載し、前記半導体
    素子を覆うようにカバーキヤツプを設けたハイブ
    リツド集積回路装置において、前記カバーキヤツ
    プの少なくとも主面に導電性被膜を設け、この導
    電性被膜を接地したことを特徴とするハイブリツ
    ド集積回路装置。
JP12643588U 1988-09-27 1988-09-27 Pending JPH0247052U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12643588U JPH0247052U (ja) 1988-09-27 1988-09-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12643588U JPH0247052U (ja) 1988-09-27 1988-09-27

Publications (1)

Publication Number Publication Date
JPH0247052U true JPH0247052U (ja) 1990-03-30

Family

ID=31377957

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12643588U Pending JPH0247052U (ja) 1988-09-27 1988-09-27

Country Status (1)

Country Link
JP (1) JPH0247052U (ja)

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