JPH0444161U - - Google Patents
Info
- Publication number
- JPH0444161U JPH0444161U JP8637590U JP8637590U JPH0444161U JP H0444161 U JPH0444161 U JP H0444161U JP 8637590 U JP8637590 U JP 8637590U JP 8637590 U JP8637590 U JP 8637590U JP H0444161 U JPH0444161 U JP H0444161U
- Authority
- JP
- Japan
- Prior art keywords
- protrusion
- lead
- integrated circuit
- package
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011888 foil Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案の一実施例の集積回路装置の一
部切欠きした斜視図、第２図は同リードの突起の
要部斜視図、第３図は本考案の一実施例の集積回
路装置を印刷配線基板に表面実装した状態を示す
概念図である。 １……ＩＣパツケージ、２……リード、３……
突起。
部切欠きした斜視図、第２図は同リードの突起の
要部斜視図、第３図は本考案の一実施例の集積回
路装置を印刷配線基板に表面実装した状態を示す
概念図である。 １……ＩＣパツケージ、２……リード、３……
突起。
Claims (1)
- 表面実装する印刷配線基板の導電箔にほぼ垂直
に接触する突起をＩＣパツケージの各リードの先
端部に備えた集積回路装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8637590U JPH0444161U (ja) | 1990-08-16 | 1990-08-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8637590U JPH0444161U (ja) | 1990-08-16 | 1990-08-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0444161U true JPH0444161U (ja) | 1992-04-15 |
Family
ID=31818017
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8637590U Pending JPH0444161U (ja) | 1990-08-16 | 1990-08-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0444161U (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022153902A1 (ja) * | 2021-01-18 | 2022-07-21 | ローム株式会社 | 半導体装置 |
-
1990
- 1990-08-16 JP JP8637590U patent/JPH0444161U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022153902A1 (ja) * | 2021-01-18 | 2022-07-21 | ローム株式会社 | 半導体装置 |